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    • 12. 发明专利
    • ELECTRONIC SWITCH
    • JPH03257733A
    • 1991-11-18
    • JP5691390
    • 1990-03-08
    • OMRON TATEISI ELECTRONICS CO
    • NAKANO HIROYUKI
    • H01H36/00
    • PURPOSE:To provide a switch excellent in water proof and impact resistance which can be manufactured by means of simple processes in a short time by providing a switch furnished with paired covering members which hold a substrate from both side surfaces so as to hermetically cover electronic parts, injecting thermal plastic resin onto the outer circumference of the covering members so as to be molded, and thereby integrally bonding them together so as to be fixed. CONSTITUTION:A substrate 1 which is held by holders 21 and 23 while being connected to a sensor section 8 and a cord section 9, is fitted into a metal mold in which cavities having the outer shape of an electronic switch are formed. In the second place, thermal plastic resin 51 such as opaque polyarylate resin and the like is injected into the metal mold at high temperature with pressure so that the substrate 1, the holders 21 and 31, the sensor section 8 and the cord section 9 are monolithically bonded together so as to be molded. By this constitution, working hours required are shortened, hardening and contraction are lessened in quantity, and a need for secondary filling is eliminated so that water proof and impact resistance can thereby sufficiently be secured.
    • 13. 发明专利
    • CONTACTLESS RELAY
    • JPS60165118A
    • 1985-08-28
    • JP2065784
    • 1984-02-06
    • OMRON TATEISI ELECTRONICS CO
    • FUKUYAMA TOSHIBUMIHORIIKE SUMIONAKANO HIROYUKI
    • H03K17/08H03K17/082H03K17/78H03K17/795
    • PURPOSE:To prevent a component from being damaged even with a load short- circuited by stopping the signal transmission of the 1st photocoupler based on a signal transmitted by the 2nd photocoupler transmitting a signal representing an excess current of the load to the secondary side after it is detected. CONSTITUTION:When a load current is an excess current because of short-circuit or the like, a voltage drop of a resistor R5 is large because of the excess current, a light emitting diode L3 is lighted, the light is inputted to a photothyristor PTh, which is turned on and the current is held afterward. Since a current flows in the path of power terminal 4 resistor R1 light emitting diode L4 photothyristor PTh OV terminal 6 in this case, the light emitting diode L1 of a photocoupler 8 is turned off, a phototransistor (Tr) PT1 and a Tr1 are turned off, the load current is released to as to prevent an overcurrent from flowing to the component of the secondary side circuit 3. Since the light emitting diode L4 is light while the photothyristor PTh is turned on for the purpose of display, it is recognized that the flowing of the excess current is given to the load.
    • 14. 发明专利
    • MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
    • JPS6070754A
    • 1985-04-22
    • JP17995583
    • 1983-09-27
    • OMRON TATEISI ELECTRONICS CO
    • TANAHASHI KAZUOKIHACHIDAN HIDEAKIHORIIKE SUMIONAKANO HIROYUKI
    • H01L27/01H01G4/40H05K1/16
    • PURPOSE:To reduce the occupying area of a thick-film capacitor, and to increase the density of a hybrid integrated circuit and miniaturize the circuit by forming a lower electrode on an insulating substrate and forming a first dielectric layer, a common electrode, a second dielectric layer and an upper electrode on the lower electrode in succession. CONSTITUTION:A lower electrode 12 is printed and baked on an insulating substrate 11, a first dielectric layer 13 is shaped on the lower electrode, and a common electrode 14 is formed on the dielectric layer 13. The lower electrode 12 and the common electrode 14 are separated electrically by the dielectric layer 13 at that time. A second dielectric layer 15 is formed on the common electrode 14, and an upper electrode 16 is shaped on the second dielectric layer 15. The common electrode 14 and the upper electrode 16 are also separated electrically by the dielectric layer 15 at that time. When each electrode and dielectric layer is superposed and formed on the insulating substrate 11 in mentioned-above order, a capacitor 11 is constituted by the lower electrode 12, the first dielectric layer 13 and the common electrode 14, and a capacitor 12 is constituted by the common electrode 14, the second dielectric layer 15 and the upper electrode 16.