会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明专利
    • Waveguide array antenna
    • 波导阵列天线
    • JP2008167246A
    • 2008-07-17
    • JP2006355566
    • 2006-12-28
    • Mitsubishi Electric Corp三菱電機株式会社
    • MOCHIZUKI KYOSUKENISHIZAWA KAZUFUMITAWARA YUKIHIROOHASHI HIDEMASAMIYASHITA HIROAKI
    • H01Q21/08H01Q13/08
    • PROBLEM TO BE SOLVED: To obtain a waveguide array antenna which avoids excitation of a standing wave only in the vicinity of a pin power supply part, thus, power is supplied to the waveguide without deteriorating radiation efficiency even when the pin power supply part is installed at a position equivalent to a node of the standing wave and a radiation element and the pin power supply part are independently designed without considering an effect due to coupling.
      SOLUTION: The waveguide array antenna includes a plurality of radiation elements 4 arranged in the tube axis direction at intervals which are half of wavelength in a tube on the upper surface 1a of a rectangle waveguide the both edges of which are short-circuited and includes a power feeding pin 3 provided approximately at an intermediate position of two adjacent radiation elements 4 on the bottom surface 1b of the waveguide.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题为了获得仅在引脚电源部分附近避免驻波的激励的波导阵列天线,因此即使当引脚电源 部件安装在与驻波的节点相当的位置处,并且辐射元件和引脚电源部分被独立设计,而不考虑由于耦合的影响。 解决方案:波导阵列天线包括沿管轴方向布置的多个辐射元件4,其间隔是两个边缘短路的矩形波导的上表面1a上的管中波长的一半的间隔 并且包括大致位于波导的底表面1b上的两个相邻辐射元件4的中间位置处的供电销3。 版权所有(C)2008,JPO&INPIT
    • 12. 发明专利
    • High frequency coupling line and high frequency filter
    • 高频耦合线和高频滤波器
    • JP2007336163A
    • 2007-12-27
    • JP2006164696
    • 2006-06-14
    • Mitsubishi Electric Corp三菱電機株式会社
    • OWADA SATORUOHASHI HIDEMASAKOSAKATA HIROSHI
    • H01P1/203H01P5/18H01P7/08
    • PROBLEM TO BE SOLVED: To realize a coupling line in which property variation by thickness variation of a dielectric substrate is little, and to improve an yield of the circuit.
      SOLUTION: The coupling line is provided with the dielectric substrate 1; a ground conductor 2 which is prepared on a main plane of the dielectric substrate 1, a plurality of strip conductors 6 which are formed on another main plane of the dielectric substrate 1, have clips 5, are simultaneously arranged nearly in parallel, and mutually carry out electromagnetic coupling; input and output terminals 4 which are respectively prepared for at least one end of the plurality of strip conductors 6; and internal strip conductors 8 which are prepared inside of the clips 5 with a space and without electrical conductivity to the strip conductors 6, and electrically connected to the ground conductor 2 by connection conductors 7 which penetrate through the dielectric substrate 1.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了实现电介质基板的厚度变化的特性变化小的耦合线,并且提高电路的产量。 解决方案:耦合线设置有电介质基板1; 在电介质基板1的主平面上准备的接地导体2,形成在电介质基板1的另一主面上的多个带状导体6,夹具5同时布置成大致平行,并相互承载 电磁耦合; 分别为多个带状导体6的至少一端准备的输入输出端子4; 以及内部带状导体8,其在片5的内部具有空隙并且对带状导体6没有导电性,并且通过穿过电介质基板1的连接导体7电连接到接地导体2。 (C)2008,JPO&INPIT
    • 13. 发明专利
    • Strip line connecting structure
    • STRIP线连接结构
    • JP2006246189A
    • 2006-09-14
    • JP2005060937
    • 2005-03-04
    • Mitsubishi Electric Corp三菱電機株式会社
    • SAITO MASAYUKITAWARA YUKIHIROOHASHI HIDEMASA
    • H01P5/02H01P1/04H05K3/46
    • H01P1/2005
    • PROBLEM TO BE SOLVED: To provide a strip line connecting structure in which improvement in high-frequency characteristic and a reduction in size can be achieved. SOLUTION: There is provided the strip line connecting structure which connects, in the laminated direction, a first strip line 5a formed in different layers of laminated dielectric substrates 1a to 1d and a second strip line 5b via a junction. A strip conductor pattern connecting conductor connects an apical end 8a of a strip conductor pattern of the first strip line 5a, and an apical end 8b of a strip conductor pattern of the second strip line 5b to make up the junction. In order to construct the above structure, the conductor is allowed to penetrate a basic conductor pattern 3b in a dielectric substrate located between the first strip line 5a and the second strip line 5b without contacting electrically the basic conductive pattern 3b, and a first punched portion 9 is formed from which the basic conductor pattern is excluded. Second punched portions 7a, 7b from which the basic conductor pattern is excluded are periodically or nearly periodically arranged in the basic conductors of the first and second strip lines. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供可以实现高频特性的提高和尺寸减小的带状线连接结构。 解决方案:提供了一种带状连接结构,其在层叠方向上连接形成在不同层压电介质基片1a至1d的第一带状线5a和第二带状线5b之间。 带状导体图形连接导体连接第一带状线5a的带状导体图案的顶端8a和第二带状线5b的带状导体图案的顶端8b以构成接合部。 为了构成上述结构,允许导体穿过位于第一带状线5a和第二带状线5b之间的电介质基板中的基本导体图案3b,而不与基本导电图案3b电接触,并且第一穿孔部分 形成基本导体图案的方法9。 排除基本导体图案的第二穿孔部分7a,7b周期地或几乎周期地布置在第一和第二条带线的基本导体中。 版权所有(C)2006,JPO&NCIPI
    • 14. 发明专利
    • Multi-layered high-frequency circuit
    • 多层高频电路
    • JP2006237967A
    • 2006-09-07
    • JP2005048735
    • 2005-02-24
    • Mitsubishi Electric Corp三菱電機株式会社
    • YUASA TAKESHITAWARA YUKIHIROOHASHI HIDEMASA
    • H01P5/08H01L23/12
    • PROBLEM TO BE SOLVED: To obtain a multi-layered high-frequency circuit whose performance can be enhanced by suppressing input-output coupling of a high-frequency IC in a simple manufacturing method.
      SOLUTION: The multi-layered high-frequency circuit includes a chassis metal plate 8, a multi-layered dielectric substrate 3 which is arranged on the chassis metal plate and dug, a metal carrier 2 arranged in the dug part of the multi-layered dielectric substrate, a high-frequency IC chip 1 mounted on the metal carrier, a strip conductor 5 formed on the surface of the multi-layered dielectric substrate 3, a plane ground conductor 6 formed in an internal layer of the multi-layered dielectric substrate 3, a metal pattern 10 which is formed on a flank of the dug part and electrically connects the plane ground conductor and chassis metal plate, and a wire 9 which electrically connects a high-frequency signal input/output terminal of the high-frequency IC chip 1 to the strip conductor 5. Then a ribbon 4 which electrically connects a portion of the lane ground conductor 6 to a portion of the metal carrier 2 is arranged to have a hollow part.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题:为了获得通过以简单的制造方法抑制高频IC的输入输出耦合来提高其性能的多层高频电路。 解决方案:多层高频电路包括底板金属板8,布置在底盘金属板上的多层电介质基板3,金属载体2布置在多层 层叠电介质基板,安装在金属载体上的高频IC芯片1,形成在多层电介质基板3的表面上的带状导体5,形成在多层介质基板3的内层的平面接地导体6 电介质基板3,金属图案10,其形成在挖掘部分的侧面上并电连接平面接地导体和底盘金属板;以及导线9,其将高频信号输入/输出端子电连接, 然后,将通道接地导体6的一部分电连接到金属载体2的一部分的带状物4布置成具有中空部分。 版权所有(C)2006,JPO&NCIPI
    • 15. 发明专利
    • Conversion circuit
    • 转换电路
    • JP2006148206A
    • 2006-06-08
    • JP2004331698
    • 2004-11-16
    • Mitsubishi Electric Corp三菱電機株式会社
    • ONO YOSHIKIENDO KUNIHIROOHASHI HIDEMASA
    • H01P5/107H01P1/02
    • PROBLEM TO BE SOLVED: To provide a conversion circuit with a configuration wherein a waveguide is connected to a microstrip line in its extension direction, the microstrip line being located on a dielectric board supported by a metallic carrier.
      SOLUTION: The conversion circuit for converting the microstrip line into the ridge waveguide is configured to include: the microstrip line 2 formed on the dielectric board 1 supported by the metallic carrier 3; the ridge waveguide 4 the part of the guide wall of which uses a side face of the metallic carrier 3 and having a bent part at a bottom side of the metallic carrier 3; a back short 6 connected to the ridge waveguide 4, having a length of about 1/4 wavelength, and extended in a direction orthogonal to the microstrip line 2; and a projection 7 shaped by truncating one side of a triangular prism in a circular-arc shape at an end of the back short 6 of the ridge waveguide 4 and connected to a ridge part 5, and the conversion circuit is also configured such that the projection 7 and the microstrip line 2 are connected by a metallic ribbon 8.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供具有波导在其延伸方向上连接到微带线的配置的转换电路,微带线位于由金属载体支撑的电介质板上。 解决方案:将微带线转换成脊波导的转换电路被配置为包括:形成在由金属载体3支撑的电介质板1上的微带线2; 脊导波导4,其引导壁的一部分使用金属载体3的侧面并且在金属载体3的底侧具有弯曲部分; 连接到脊波导4的后短6,其长度为约1/4波长,并且在与微带线2正交的方向上延伸; 以及突起7,其通过在脊状波导4的后短路6的端部截取圆弧状的三角棱镜的一侧并与脊部5连接而成形,并且转换电路还构造成 突起7和微带线2通过金属带8连接。版权所有(C)2006,JPO&NCIPI
    • 16. 发明专利
    • Coupled line directional coupler
    • 耦合线方向耦合器
    • JP2005168072A
    • 2005-06-23
    • JP2005067304
    • 2005-03-10
    • Mitsubishi Electric Corp三菱電機株式会社
    • YUGAWA HIDENORIOHASHI HIDEMASAMIYAZAKI MORIYASU
    • H01P5/18
    • PROBLEM TO BE SOLVED: To provide the coupled line directional coupler which is small in size and has proper reflection characteristics.
      SOLUTION: At both ends of a coupling line 28, a coupling line 29a, whose electrical length is 1/4 wavelength at a design frequency is constructed, and the coupling factor at both ends is not 0 but is set to a specified value. Since the distance between inner conductors can be reduced and a total length of a coupling line is shortened by 1/4 of the wavelength, in comparison with when the coupling factor is 0, when only a tapered coupling line is used, the effect of miniaturization of the coupler exists. Since the line does not change by a large amount in its shape at the end of the coupling line, high accuracy design in the frequency band becomes possible. In addition, at the tapered coupling line part, there are no discontinuity part between coupling lines such as multiply coupled line, and consequently, proper reflection characteristics can be obtained as the effect.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供尺寸小且具有适当反射特性的耦合线路定向耦合器。 解决方案:在耦合线路28的两端,构造在设计频率下电长度为1/4波长的耦合线29a,并且两端的耦合系数不是0,而是设定为指定的 值。 由于可以减小内部导体之间的距离,并且耦合线的总长度被缩短为波长的1/4,所以与耦合系数为0时相比,当仅使用锥形耦合线时,小型化的效果 存在耦合器。 由于线路在耦合线路端部的形状没有大的变化,所以在频带中的高精度设计成为可能。 此外,在锥形耦合线部分,在诸如多重耦合线之间的耦合线之间没有不连续部分,因此,可以获得适当的反射特性作为效果。 版权所有(C)2005,JPO&NCIPI
    • 17. 发明专利
    • Conversion circuit
    • 转换电路
    • JP2005109933A
    • 2005-04-21
    • JP2003341381
    • 2003-09-30
    • Mitsubishi Electric Corp三菱電機株式会社
    • ONO YOSHIKIOHASHI HIDEMASATAWARA YUKIHIROKODAMA KATSUHISA
    • H01P5/107H01P5/02
    • PROBLEM TO BE SOLVED: To obtain a thin waveguide and a dielectric microwave transmission line conversion circuit. SOLUTION: The conversion circuit is composed of a ground conductor formed to one face of a first layer of a dielectric multilayered substrate, a conductor pattern similarly and regularly arranged to the other face of the first layer of the dielectric multilayered substrate, a plurality of through-holes for connecting the ground conductor and the conductor pattern, an open stub formed to the uppermost layer of the dielectric multilayered substrate, and a microwave transmission line which is formed to the uppermost layer of the dielectric multilayered substrate extended to the outside of the waveguide via a part where the waveguide is partially notched and connected with the open stub. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:获得薄波导和电介质微波传输线转换电路。 解决方案:转换电路由形成在电介质多层基板的第一层的一个面上的接地导体,类似地且规则地布置到电介质多层基板的第一层的另一面的导体图案, 多个用于连接接地导体和导体图案的通孔,形成在电介质多层基板的最上层的开口短截线,以及形成在延伸到外部的电介质多层基板的最上层的微波传输线 的波导通过波导部分切口并与开口短截线连接的部分。 版权所有(C)2005,JPO&NCIPI
    • 19. 发明专利
    • Interlayer connecting structure
    • 中间层连接结构
    • JP2003023249A
    • 2003-01-24
    • JP2001204760
    • 2001-07-05
    • Mitsubishi Electric Corp三菱電機株式会社
    • MIYAZAKI MORIYASUTAWARA YUKIHIROOHASHI HIDEMASA
    • H05K3/46H01P3/08
    • PROBLEM TO BE SOLVED: To provide an interlayer connecting structure that can connect aimed conductor layers to each other in a multilayered high-frequency circuit, etc., even in such a case that through holes made through vertically adjacent dielectric layers are not able to be arranged linearly along the same center axis unlike the conventional structure.
      SOLUTION: This interlayer connecting structure connects aimed conductors provided on both sides of an intermediate layer composed of a plurality of layers to each other. In this structure, unit through holes provided at every layer constituting the intermediate layer are arranged at prescribed intervals in the directions of the layers so that the axial centers of the unit holes adjoining to each other in the direction of lamination may not become coincident with each other. At the same time, the aimed conductors are connected to each other through stepped through holes formed by arranging hole connecting conductors which connect the end sections of the unit through holes adjoining to each other in the direction of lamination to each other among the layers.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:即使在通过垂直相邻的电介质层形成的通孔不能够在多层高频电路等中提供可将目标导体层彼此连接的层间连接结构 与传统结构不同,沿着相同的中心轴线性排列。 解决方案:该层间连接结构将设置在由多个层组成的中间层两侧的目标导体彼此连接。 在该结构中,构成中间层的每层的单位通孔以规定的间隔布置在层的方向上,使得在层叠方向上彼此相邻的单元孔的轴心不能与每个层叠 其他。 同时,目标导体通过将连接导体的孔连接导体形成的阶梯状通孔彼此连接,所述孔连接导体通过彼此相邻的彼此相邻的孔彼此相互连接。
    • 20. 发明专利
    • 電波吸収体およびそれを用いた電波暗室
    • 无线电波吸收器和无线电波浪使用相同的暗室
    • JP2015015449A
    • 2015-01-22
    • JP2013257639
    • 2013-12-13
    • 三菱電機株式会社Mitsubishi Electric Corp
    • ANDO YUJIUCHIDA TAKESHIOKA NAOTOOHASHI HIDEMASA
    • H05K9/00
    • 【課題】本発明は、垂直入射のみならず斜入射における電磁波吸収特性に優れかつ全高の低い電波吸収体と、それを用いた電波暗室を提供することを目的とする。【解決手段】電磁波損失材料からなる互いにほぼ等しい高さを有し全体として錐体、錐台、楔体、またはそれらに類似する形状の複数の第1の電波吸収部2と、板状の第2の電波吸収部3とを備え、複数の第1の電波吸収部2を平面上に配置するとともに、第2の電波吸収部3を、複数の第1の電波吸収部2が配置された平面に対して平行に配置する。【選択図】図1
    • 要解决的问题:提供一种电波吸收特性不仅在垂直入射,而且倾斜入射,总长度也低的电波吸收体,以及使用无线电波吸收体的无线电波暗室。解决方案:无线电波 吸收体包括:多个第一无线电波吸收部分2,其包括具有几乎相同的高度的电磁波损耗材料,并且具有与之相似的金字塔,截头锥体,楔形体或类似形状的整体 ; 以及包括电磁波损耗材料的板状的第二无线电波吸收部3。 第一无线电波吸收部2设置在平面上,第二无线电波吸收部3与设置有第一无线电波吸收部2的平面平行地配置。