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    • 12. 发明专利
    • JPH05291225A
    • 1993-11-05
    • JP9508592
    • 1992-04-15
    • MITSUBISHI ELECTRIC CORP
    • FUJINO NAOHIKOKANO ISAMUSASAI HIROSHI
    • G01N21/84G01N21/88G01N21/94G01N21/956G01R31/26H01L21/304H01L21/66
    • PURPOSE:To quantitatively evaluate the ability of a cleaning method and a cleaning apparatus which have been examined by a method wherein the surface of a wafer is inspected before and after its cleaning operation, observation positions and sizes of a plurality of foreign bodies which have been observed are specified and stored and the observation positions of the plurality of foreign bodies observed in respective inspections before and after the cleaning operation are collated sequentially. CONSTITUTION:The surface of a wafer is inspected before and after its cleaning operation; observation positions and sizes of foreign bodies which have been observed are specified and stored; the observation positions of the plurality of foreign bodies observed in respective inspections before and after the cleaning operation are collated sequentially. Thereby, an increase and a decrease in the number and the size of the foreign bodies in each observation position are inspected. The number of positions where the foreign bodies are decreased is designated as Pc; the number of positions where the foreign bodies are not changed is designated as Pn; the number of positions where the foreign bodies are increased is designated as Pp; the total number of foreign bodies before the cleaning operation is designated as Pt; the total number of foreign bodies after the cleaning operation is designated as Pt'. The increase and the decrease in the foreign bodies on the wafer before and after the cleaning operation are evaluated according to computation formulae for the ability of the cleaning operation Ac=Pc/Pt, the ability of a non-cleaning operation An=Pn/Pt and the ratio of contaminative particles Ap=Pt/Pt'; the cleaning ability is evaluated.