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    • 11. 发明专利
    • Method for treating optical waveguide
    • 用于处理光波导的方法
    • JP2005091830A
    • 2005-04-07
    • JP2003325809
    • 2003-09-18
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • TANI YOSHIYUKIHISAKADO TAKAO
    • G02F1/1333B29B17/02
    • PROBLEM TO BE SOLVED: To solve a problem associated with recycling of an optical waveguide which generally comprises breaking acrylic resin as it is, which has been discharged from a factory subsequent to impurity removal, and pelletizing it so as to turn it into acrylic pellets, and in which an organic solvent is used to remove a dot pattern, bringing about troubles of costing treatment, of being limited to treatment in a factory equipped with a plant for waste liquid disposal and of possibly being a factor of environmental deterioration, possibly putting the cart before the horse, when recently frequent soil pollution due to an organic solvent is taken into consideration. SOLUTION: The method for treating the optical waveguide composed of a plate with a predetermined pattern imparted on the surface is characterized by identifying the method for forming the dot pattern on the optical waveguide and physically grinding only the optical waveguide of which the dot pattern is composed of a composition other than the acrylic resin only on the surface with the dot pattern so as to remove the pattern. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:解决与通常包括断开丙烯酸树脂一样的光波导的再循环的问题,其在除去杂质之后已经从工厂排出,并将其造粒成为 丙烯酸类丸剂,其中使用有机溶剂去除点状图案,造成成本计算处理的麻烦,限于在装有废液处理设备的工厂中的处理以及可能是环境恶化的因素, 可能把马车放在马前,最近频繁地考虑到有机溶剂造成的土壤污染。 解决方案:用于处理由表面赋予预定图案的板构成的光波导的方法的特征在于,识别在光波导上形成点阵图案的方法,并仅物理研磨光波导,其中点 图案仅由具有点图案的表面上的丙烯酸树脂以外的组合物构成,以便去除图案。 版权所有(C)2005,JPO&NCIPI
    • 14. 发明专利
    • ALIGNER AND EXPOSURE METHOD
    • JP2001351844A
    • 2001-12-21
    • JP2000168479
    • 2000-06-06
    • MATSUSHITA ELECTRIC IND CO LTD
    • TANI YOSHIYUKI
    • G03B27/72G03F7/20G03F9/02H01L21/027
    • PROBLEM TO BE SOLVED: To provide an aligner and an exposure method for carrying out photolithography by practical throughput and small resolution. SOLUTION: A first exposure is carried out by setting a lens numerical aperture NA at 0.6 and a coherence factor σ at 0.3 with each structure of an illumination system, a lens system and a stage system fixed. Then, a lens numerical aperture NA is changed to 0.5 and a coherence factor σ is changed to 0.8 without changing an exposure position of an exposure object, and each structure of an illumination system, a lens system and a stage system is adjusted to minimize aberration under the conditions. Thereafter, second exposure is carried out with each structure of an illumination system, a lens system and a stage system fixed. Both high resolution and deep focus depth can be realized simultaneously while keeping practical throughput by carrying out correction of an illumination system, a lens system and a stage system to be optimum for each exposure condition by dividing exposure for each illumination condition.
    • 15. 发明专利
    • METHOD FOR FORMING PHOTORESIST PATTERN
    • JPH06216068A
    • 1994-08-05
    • JP2420793
    • 1993-02-12
    • MATSUSHITA ELECTRIC IND CO LTD
    • KOIZUMI TAICHITANI YOSHIYUKI
    • G03F7/16G03F7/38H01L21/30
    • PURPOSE:To restrain a photoresist pattern from varying in line width due to a standing wave effect when the pattern is formed on a substrate such as a semiconductor wafer or the like. CONSTITUTION:Photoresist material is applied onto a substrate 1 such as a semiconductor wafer or the like to form a photoresist film 2, and a first light exposure process is carried out by the use of a prescribed light source and a mask 4. Then, the photoresist film 2 is thermally treated on a hot plate 6 to be reduced by a prescribed value in thickness. Thereafter, a second light exposure process is carried out by the use of the same light, source and the mask as the first process. At this point, the thickness change of the photoresist film is set so as to enable the nodes and antinodes of light standing waves generated at the first and the second light exposure process to deviate from each other in position. By this setup, a resist pattern can be lessened in dispersion of line width by a resultant effect of standing waves. Especially, when a photoresist film is changed in thickness by an odd-numbered times as much as 1/4 of the wavelength of a light source in the film, a resist pattern can be most lessened in dispersion of line width.
    • 16. 发明专利
    • FORMATION OF PATTERN
    • JPH03223859A
    • 1991-10-02
    • JP1953190
    • 1990-01-30
    • MATSUSHITA ELECTRIC IND CO LTD
    • TANI YOSHIYUKISASAKO MASARU
    • G03F7/039G03F7/26H01L21/027H01L21/30
    • PURPOSE:To form fine patterns having a good shape and high dimensional accuracy by using a resin which copolymerized a component having high heat resistance together with a functional group which is soluble in alkalis in an acid atmosphere as a pattern forming material. CONSTITUTION:A pattern forming material film 2 contg. the resin having the functional group which is soluble in the alkalis in the acid atmosphere and the component having the heat resistance, a photosensitive compd. which generates an acid by exposing, and a solvent which can dissolve the resin and compd. is formed on a substrate 1. The material film 2 is subjected to selective exposing with far UV rays, heat treatment and developing to form the material film patterns. Since the heat resistance of the resin itself is high, there is no softening of the resin at the time of the heat treatment and a large difference in solubility in an alkaline developing soln. arises between the exposed parts and the unexposed parts; in addition, the resin in the unexposed parts does not soften at the time of the heat treatment. The pattern 2a, 2a' of a positive type having a good contrast and the high dimensional accuracy are formed in this way.
    • 18. 发明专利
    • RESIST FILM FORMATION
    • JPS6473722A
    • 1989-03-20
    • JP23130687
    • 1987-09-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • TANI YOSHIYUKIOGAWA KAZUFUMI
    • H01L21/027G03C1/00G03F7/00G03F7/095G03F7/16H01L21/30
    • PURPOSE:To facilitate the pattern formation at the low energy level by a method wherein a filming process of resist to form a semiconductor element manufacturing positive pattern is divided into two phases wherein the resist in the low molecular weight level easily melted down or etched away is used for the lower layer while the resist in the normal molecular weight level is used for the upper layer. CONSTITUTION:In order to form a positive resist pattern, the resist to be formed is divided into an upper layer and a lower layer to be used. At this time, the resist in the molecular weight easily melted down or etched away is used for the lower layer while the resist in the normal molecular weight is used for the upper layer. In other words, the energy level suffices for cutting off the main chain of the upper layer resist part while the transfer to the lower layer is managed with development or etching process eliminating the pattern transfer to the lower layer by oxygen plasma despite the consequent use of the two layer resist. Therefore, the resist filming process can be simplified to form a fine pattern in a sharp contrast.
    • 20. 发明专利
    • Method and apparatus for discriminating component of plastic material
    • 用于分辨塑料材料组分的方法和装置
    • JP2008026211A
    • 2008-02-07
    • JP2006200556
    • 2006-07-24
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • NAGASHIMA TAKASHITANI YOSHIYUKIIRIE SHOICHIYAMASHITA TAKEHIKOIWATA YUKIHIRO
    • G01N21/75G01N21/35
    • PROBLEM TO BE SOLVED: To provide a method for rapidly discriminating the content of the target detection component of a plastic material even if a very small amount of the target detection component is contained in the plastic material. SOLUTION: The first infrared absorption spectrum, which is obtained by irradiating the plastic material with infrared rays having a continuous spectrum and measuring the intensity of totally reflected or transmitted infrared rays, is compared with the second infrared absorption spectrum obtained by irradiating the plastic material with infrared rays having the continuous spectrum while or after processing for applying a change to the wave number inherent to the target detection component in the plastic material is performed and measuring totally reflected or transmitted infrared rays to recognize the presence of the content of the target detection component. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:即使在塑料材料中含有极少量的目标检测组分,也提供用于快速鉴别塑料材料的目标检测部件的含量的方法。 解决方案:通过用具有连续光谱的红外线照射塑料并测量全反射或透射的红外线的强度获得的第一红外吸收光谱与通过照射所得到的第二红外吸收光谱进行比较 执行具有连续光谱的具有连续光谱的红外线的塑料材料,或者在对塑料材料中的目标检测部件固有的波数进行改变的处理之后,测量全反射或透射的红外线,以识别出 目标检测组件。 版权所有(C)2008,JPO&INPIT