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11. 发明专利

JP2013120841A Dicing sheet with protective film forming layer and method for fabricating semiconductor chip 有权
标题翻译：具有保护膜形成层的表和用于制造半导体芯片的方法
公开(公告)号：JP2013120841A
公开(公告)日：2013-06-17
申请号：JP2011267992
申请日：2011-12-07
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , TAKANO TAKESHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property.SOLUTION: A dicing sheet consists of: a base film 1 subjected to peeling treatments; a protective film forming layer 4 formed on an inner perimeter of the base film; and an adhesive layer 2 formed an outer perimeter of the base film. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours is -1 to +1%.
摘要翻译：要解决的问题：为了提供具有高均匀度的保护膜形成层的切割片，可以容易地制造具有良好打印精度的保护膜的半导体芯片，并且具有耐热性。解决方案：切割片由以下部分组成：进行剥离处理的基膜1; 形成在基膜的内周上的保护膜形成层4; 以及形成基膜的外周的粘合剂层2。基膜的熔点超过130℃或基膜不具有熔点，并且在130℃加热2小时的基膜的热收缩率为-1〜+ 1％。版权所有（C）2013，JPO＆INPIT

12. 发明专利

JP2012156474A Adhesive composition for semiconductor, adhesive sheet for semiconductor and method for manufacturing semiconductor device 有权
标题翻译：用于半导体的粘合组合物，半导体用粘合片和制造半导体器件的方法
公开(公告)号：JP2012156474A
公开(公告)日：2012-08-16
申请号：JP2011016899
申请日：2011-01-28
申请人： Lintec Corp , リンテック株式会社
发明人： ICHIKAWA ISAO , KOYAKATA MASAHIRO , KASHIO MIKIHIRO , MIYATA TAKESHI , YANAGIMOTO KAISA , KOSONE YUICHI
IPC分类号： H01L21/52 , C09J7/02 , C09J11/06 , C09J133/00 , C09J163/00 , C09J183/00 , H01L21/301
CPC分类号： H01L24/27 , C08L33/066 , C08L63/00 , C09J133/08 , C09J163/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/83191 , H01L2224/83862 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0715 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , Y10T428/249982 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/04642 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor and the like which have excellent package reliability and adhesiveness, in a case of having been subjected to severe heat and humidity conditions and a reflow process, even after when having been stored for a fixed period of time.SOLUTION: The adhesive composition for a semiconductor includes: (A) an acrylic polymer; (B) an epoxy-based thermosetting resin; (C) a thermosetting agent; (D) a silane compound which has an organic functional group, has a molecular weight of 300 or more, and has an alkoxy equivalent of more than 13 mmol/g; and (E) a silane compound which has the organic functional group, has a molecular weight of 300 or less, and has an alkoxy equivalent of 13 mmol/g or less.
摘要翻译：要解决的问题：为了提供具有优异的包装可靠性和粘合性的半导体等的粘合剂组合物，在经受严酷的热和湿度条件和回流工艺的情况下，即使在已经被储存一段固定的时间。解决方案：半导体用粘合剂组合物包括：（A）丙烯酸类聚合物; （B）环氧类热固性树脂; （C）热固性剂; （D）具有有机官能团的硅烷化合物，其分子量为300以上，烷氧基当量大于13mmol / g; 和（E）具有有机官能团的硅烷化合物，其分子量为300以下，烷氧基当量为13mmol / g以下。版权所有（C）2012，JPO＆INPIT

13. 发明专利

JP2011225840A Adhesive composition for semiconductor, adhesive sheet for semiconductor, and method for producing semiconductor device 有权
标题翻译：用于半导体的粘合组合物，用于半导体的粘合片，以及用于生产半导体器件的方法
公开(公告)号：JP2011225840A
公开(公告)日：2011-11-10
申请号：JP2011070228
申请日：2011-03-28
申请人： Lintec Corp , リンテック株式会社
发明人： MIYATA TAKESHI , ICHIKAWA ISAO , KASHIO MIKIHIRO , KOYAKATA MASAHIRO , KOSONE YUICHI
IPC分类号： C09J133/04 , C09J11/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for semiconductors, which excels in package reliability and adhesiveness in the case through severe wet heat conditions and reflow processes even after storage for certain fixed period.SOLUTION: The adhesive composition for semiconductors is characterized by including a complex compound formed from (A) an acrylic polymer, (B) thermosetting epoxy resin, (C) thermosetting agent and (D) isophthalic acid-based compound and a compound for curing acceleration.
摘要翻译：要解决的问题：提供一种半导体用粘合剂组合物，即使在一定固定时间后储存，在严格的湿热条件和回流工艺的情况下也具有优异的包装可靠性和粘合性。解决方案：半导体用粘合剂组合物的特征在于包括由（A）丙烯酸类聚合物，（B）热固性环氧树脂，（C）热固性剂和（D）间苯二甲酸类化合物和化合物用于固化加速。版权所有（C）2012，JPO＆INPIT

14. 发明专利

JP2011198914A Adhesive composition for semiconductor, adhesive sheet for semiconductor, and method of manufacturing semiconductor device 审中-公开
标题翻译：用于半导体的粘合组合物，半导体用粘合片及制造半导体器件的方法
公开(公告)号：JP2011198914A
公开(公告)日：2011-10-06
申请号：JP2010062402
申请日：2010-03-18
申请人： Lintec Corp , リンテック株式会社
发明人： MIYATA TAKESHI , ICHIKAWA ISAO , KASHIO MIKIHIRO , KOYAKATA MASAHIRO , KOSONE YUICHI
IPC分类号： H01L21/52 , C09J7/02 , C09J11/06 , C09J133/04 , C09J163/00 , H01L21/301
CPC分类号： H01L24/29 , H01L2924/10253 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor having a high adhesiveness to an adhering part even in a case of having been subjected to a severe condition and a reflow process, an adhesive sheet for the semiconductor including an adhesive layer made of the adhesive composition, and a method of manufacturing the semiconductor using the same.SOLUTION: The adhesive composition for the semiconductor includes (A) an acrylic copolymer containing 3-10 wt.% structural unit derived from hydroxy-containing (meth)acrylic acid ester, and having a weight-average molecular weight of 100,000 to 1000,000, (B) an epoxy thermosetting resin, and (C) a thermosetting agent.
摘要翻译：要解决的问题：即使在经受严酷条件和回流处理的情况下，即使在经受严酷条件和回流处理的情况下，也提供了对粘合部分具有高粘附性的半导体用粘合剂组合物，包括由粘合剂组合物和使用其的半导体的制造方法。解决方案：半导体用粘合剂组合物包含（A）含有3-10重量％衍生自含羟基的（甲基）丙烯酸酯的结构单元的丙烯酸共聚物，并且具有100,000至1000,000的重均分子量，（B）环氧热固性树脂和（C）热固性剂。

15. 发明专利

JP2011190354A Sticky adhesive composition, sticky adhesive sheet, and method for producing semiconductor device 有权
标题翻译：胶粘剂组合物，粘胶粘合片及其半导体器件的制造方法
公开(公告)号：JP2011190354A
公开(公告)日：2011-09-29
申请号：JP2010057920
申请日：2010-03-15
申请人： Lintec Corp , リンテック株式会社
发明人： ICHIKAWA ISAO , KOYAKATA MASAHIRO
IPC分类号： C09J133/00 , C09J7/02 , C09J11/00 , C09J163/00 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a sticky adhesive composition free of peeling off of a bonded boundary or package cracks even when being exposed to a severe reflow condition in a package mounted with a thin semiconductor chip on an organic substrate having a narrow pitch, and capable of achieving a high package reliability.
SOLUTION: The sticky adhesive composition is characterized by containing an acrylic polymer (A), an epoxy resin (B) having a naphthalene skeleton and/or anthracene skeleton, and a curing agent (C).
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种粘合的边界或包装的剥离的粘性粘合剂组合物，即使当在具有窄的有机基底的安装有薄的半导体芯片的封装中暴露于严重的回流条件时并且能够实现高封装可靠性。粘合剂组合物的特征在于含有丙烯酸类聚合物（A），具有萘骨架和/或蒽骨架的环氧树脂（B）和固化剂（C）。版权所有（C）2011，JPO＆INPIT

16. 发明专利

JP2009203332A Tacky adhesive composition, tacky adhesive sheet and method for producing semiconductor device 有权
标题翻译：胶粘剂组合物，胶粘剂粘合片和生产半导体器件的方法
公开(公告)号：JP2009203332A
公开(公告)日：2009-09-10
申请号：JP2008046502
申请日：2008-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： ICHIKAWA ISAO , KOYAKATA MASAHIRO , SHIZUHATA HIRONORI
IPC分类号： C09J163/00 , C09J7/02 , C09J133/00 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a tacky adhesive composition hardly causing separation of adhesive interface and package crack even when being exposed to a severe reflow condition, and achieving high package reliability in the package having a thin semiconductor chip mounted thereon. SOLUTION: The tacky adhesive composition containing (A) an acrylic polymer, (B) an epoxy resin and (C) a curing agent is regulated so that the ratio (c)/(x) of the number (c) of functional groups reactive with epoxy groups possessed by the curing agent (C) to the number (x) of epoxy groups contained in the composition is 0.3-0.93. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使在暴露于严重的回流条件下，即使在其上安装有薄的半导体芯片的封装中，也提供难以分离粘合剂界面和封装裂缝的粘性粘合剂组合物。解决方案：调节包含（A）丙烯酸类聚合物，（B）环氧树脂和（C）固化剂的粘性粘合剂组合物，使得（c）的（c）/（x）与固化剂（C）具有的环氧基反应的官能团与组合物中所含的环氧基的数量（x）为0.3-0.93。版权所有（C）2009，JPO＆INPIT

17. 发明专利

JP2012169670A Sheet for die sort 有权
标题翻译：表格排版
公开(公告)号：JP2012169670A
公开(公告)日：2012-09-06
申请号：JP2012120764
申请日：2012-05-28
申请人： Lintec Corp , リンテック株式会社
发明人： KOYAKATA MASAHIRO , SHINODA TOMONORI
IPC分类号： H01L21/683 , H01L21/67
摘要： PROBLEM TO BE SOLVED: To provide a sheet for a die sort, which can stably hold a chip with tack and which enables the chip with the tack to be picked up with ease.SOLUTION: A sheet 1 for a die sort comprises a circular base film 2, and an annular adhesive sheet 3 that is superposed on the peripheral edge of the base film 2. A central part of a surface of the base film 2 serves as a chip temporary-attachment part 20. The chip temporary-attachment part 20 with a surface roughness Ra of 0.01-0.4 μm has no adhesive layer.
摘要翻译：要解决的问题：提供一种用于模具分类的片材，其可以稳定地保持具有粘性的芯片，并且能够容易地拾取具有粘性的芯片。解决方案：用于模具分类的片材1包括圆形基膜2和叠置在基膜2的周缘上的环状粘合片3.基膜2的表面的中心部分作为芯片临时安装部20.表面粗糙度Ra为0.01〜0.4μm的芯片临时安装部20没有粘接层。版权所有（C）2012，JPO＆INPIT

18. 发明专利

JP2009227892A Tacky adhesive composition, tacky adhesive sheet, and method for producing semiconductor device 审中-公开
标题翻译：复合粘合剂组合物，粘合剂粘合片和用于生产半导体器件的方法
公开(公告)号：JP2009227892A
公开(公告)日：2009-10-08
申请号：JP2008077438
申请日：2008-03-25
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , NEZU YUSUKE
IPC分类号： C09J133/00 , C09J7/02 , C09J11/06 , C09J163/00 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/27 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/09701 , H01L2924/181 , H01L2924/3512 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide such a tacky adhesive composition that, in a package mounted with thin semiconductor chips, neither adhesive interface debonding nor package cracking occurs even if exposed to severe reflow conditions, thus high package reliability can be accomplished. SOLUTION: The tacky adhesive composition includes (A) an acrylic polymer, (B) an epoxy-based thermosetting resin, (C) a phenolic curing agent and (D) a curing promoter; wherein the content of the curing promoter D stands at 0.1-0.9 pt.wt. based on a total of 100 pts.wt. of the total of the epoxy-based thermosetting resin B and the phenolic curing agent C. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供这样一种粘性粘合剂组合物，即使在暴露于严格的回流条件下，在安装有薄的半导体芯片的封装中也不会发生粘合剂界面剥离或包装开裂，因此可以实现高的封装可靠性。粘合剂组合物包括（A）丙烯酸类聚合物，（B）环氧类热固性树脂，（C）酚类固化剂和（D）固化促进剂; 其中固化促进剂D的含量为0.1-0.9重量份。基于总共100 pts.wt. 的环氧类热固性树脂B和酚类固化剂C的总量。（C）2010，JPO＆INPIT

19. 发明专利

JP2009203338A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device 审中-公开
标题翻译：压敏粘合剂组合物，压敏粘合片和制造半导体器件的方法
公开(公告)号：JP2009203338A
公开(公告)日：2009-09-10
申请号：JP2008046592
申请日：2008-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： SHIZUHATA HIRONORI , SHINODA TOMONORI , KOYAKATA MASAHIRO
IPC分类号： C09J133/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J163/00 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To achieve high package reliability even if a package, to which a semiconductor chip is mounted, is exposed to high temperature and high humidity or exposed to high temperature and high humidity under voltage application.
SOLUTION: The pressure-sensitive adhesive composition comprises an acrylic polymer (A), an epoxy resin (B), a compound (C) having two or more phenolic hydroxy groups with a phenolic hydroxy group equivalent of 103 g/eq or less, and an ion scavenger (D). The content of the ion scavenger (D) is 1-20 pts.wt. based on 100 pts.wt. of all the resin components.
COPYRIGHT: (C)2009,JPO&INPIT

20. 发明专利

JP2009016697A Dicing sheet with identification symbol and its production method 有权
标题翻译：具有识别符号及其生产方法的标签
公开(公告)号：JP2009016697A
公开(公告)日：2009-01-22
申请号：JP2007179264
申请日：2007-07-09
申请人： Lintec Corp , リンテック株式会社
发明人： YAMAZAKI OSAMU , KOYAKATA MASAHIRO , HAMAZAKI AKIE
IPC分类号： H01L21/301 , C09J7/02 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with an identification symbol which is identified even after being stuck to a wafer, and to which an identification symbol such as the name of an article is affixed without damaging the dicing sheet, and also to provide its production method. SOLUTION: The dicing sheet 1 comprises a substantially circular base 2 and an adhesive layer 3, and an annular base 4 and an adhesive layer 5 for sticking a ring frame laminated on the adhesive layer 3 in the periphery thereof, wherein an identification symbol 8 of the dicing sheet 1 is printed in a space between a ring frame sticking portion 6 and a wafer sticking portion 7. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有即使在粘贴到晶片之后被识别的识别符号的切割片，并且诸如物品名称的识别符号被固定在其上而不损坏切割片，并且也提供其生产方法。解决方案：切割片1包括基本上圆形的基底2和粘合剂层3，以及环形基底4和用于粘附层压在其周边的粘合剂层3上的环形框架的粘合剂层5，其中识别切割片1的符号8被印刷在环形框架粘贴部分6和晶片粘贴部分7之间的空间中。版权所有：（C）2009，JPO＆INPIT

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