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11. 发明专利

JP2012030290A Machining device 有权
标题翻译：加工设备
公开(公告)号：JP2012030290A
公开(公告)日：2012-02-16
申请号：JP2010169085
申请日：2010-07-28
申请人： Disco Corp , 株式会社ディスコ
发明人： NAMIOKA SHINICHI , KAWASE MASAYUKI , TANIMOTO RYOJI
IPC分类号： B23Q11/10 , B23B25/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent chips from adhering to the tip of a cutting tool in lathe-cutting so as to prevent a lathe-cutting capacity from lowering, and also prevent the cutting tool from being deteriorated by heat.SOLUTION: This machining device 1 including at least a lathe-cutting device 3 rotatably having the cutting tool 33 for lathe-cutting of a workpiece held by a chuck table 2 includes a cooling water jetting unit 12 including a nozzle 120 for jetting cooling water toward the tip of the cutting tool 33 immediately after the cutting tool performs lathe-cutting of the workpiece positioned in a machining area B. Since the chips adhered to the tip of the cutting tool 33 is washed out by the cooling water, the lathe-cutting capacity of the cutting tool 33 is prevented from lowering, and the cutting tool 33 is prevented from being deteriorated, by cooling the tip of the cutting tool 33.
摘要翻译：要解决的问题：为了防止切屑粘附在车削切削刀具的尖端，以防止车削切削能力下降，并且还防止切削刀具受到热损坏。解决方案：该加工装置1包括至少一个可旋转地具有切削工具33的车床切割装置3，该切削装置用于由卡盘台2夹持的工件进行车床切割，包括冷却水喷射单元12，其包括用于喷射的喷嘴120 在切削工具进行切削加工区域B中的工件的切削后，立即向切削工具33的前端冷却水。由于附着在切削工具33的前端的切屑被冷却水冲洗掉，通过冷却切削工具33的尖端，防止切削工具33的车削切削能力下降，并且防止切削工具33劣化。（C）2012，JPO＆INPIT

12. 发明专利

JP2014079837A Auxiliary member for cutting tool wheel 有权
标题翻译：用于切割工具轮的辅助部件
公开(公告)号：JP2014079837A
公开(公告)日：2014-05-08
申请号：JP2012228704
申请日：2012-10-16
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： TAKEDA SHUHEI , NAMIOKA SHINICHI , TANIMOTO RYOJI
IPC分类号： B23Q11/00 , B23D7/06
摘要： PROBLEM TO BE SOLVED: To provide an auxiliary member for cutting tool wheels capable of reducing the possibility of an object to be processed or a cutting edge when a cutting edge catches cutting chips.SOLUTION: A cutting tool wheel includes a wheel base and a cutting tool unit comprising a cutting tool shank mounted on the wheel base, a cutting tool arranged in the cutting tool shank in a removable way and a cutting edge arranged in the lower end part of the cutting tool. An auxiliary member for the cutting tool wheel includes a mounting part to be mounted on the wheel base and a wall part which takes, as the moving direction, the direction of the movement of the cutting edge on an object to be processed in cutting the to-be-processed object, is hung from the lower end of the wheel base on the front side in the moving direction of the cutting edge, leads at least to a part of the cutting edge and exposes a processing point of the cutting edge so as to prevent adhesion of cutting chips produced during cutting the to-be-processed object with the cutting edge.
摘要翻译：要解决的问题：提供一种用于切削工具车轮的辅助构件，该辅助构件能够在切削刃抓住切屑时减少被加工物或切削刃的可能性。解决方案：切削工具车轮包括车轮基座和切割工具单元，其包括安装在所述车轮基座上的切割工具柄，以可移除方式布置在所述切割工具柄中的切割工具和布置在所述切割工具的下端部中的切割边缘。用于切削工具车轮的辅助构件包括安装在车轮基座上的安装部件和壁部件，其将作为移动方向的切削刃的移动方向作为移动对象物体切削成被加工物体从切割刃的移动方向的前侧的轮基底的下端悬挂起来，至少引导到切削刃的一部分，并使切削刃的加工点露出，以防止在切割被切割物体时产生的切割屑与切削刃的粘合。

13. 发明专利

JP2011044569A Electrode machining apparatus 有权
标题翻译：电极加工设备
公开(公告)号：JP2011044569A
公开(公告)日：2011-03-03
申请号：JP2009191377
申请日：2009-08-20
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： KOBAYASHI MAKOTO , KAWASE MASAYUKI , NAMIOKA SHINICHI , MORI TAKASHI
IPC分类号： H01L21/60 , B23C3/00 , B23D5/02 , B23Q17/20 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an electrode machining apparatus capable of machining to uniformize lengths of a plurality of bumps (electrodes) formed on respective devices even if there is variations in top surface elevations among a plurality of semiconductor devices formed on a semiconductor wafer.
SOLUTION: The electrode machining apparatus measures the lengths of the respective bumps 4, which are cut totally in a first process, in a second process, and sets a necessary cut amount in an X-coordinate and Y-coordinate respectively so as to uniformize the lengths. Tips of the bumps 4 are cut by a second cutting tool 203 of a second cutting means 200 on the respective X and Y coordinates to uniformize the lengths of all bumps 4.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种电极加工设备，即使在形成在多个半导体器件上的多个半导体器件中的上表面高度有差异的情况下，也能够对形成在各个器件上的多个凸块（电极）的长度进行均匀化半导体晶片。解决方案：电极加工装置测量在第一工序中完全切割的各个凸块4的长度，并分别设定X坐标和Y坐标所需的切割量，以便使长度均匀化。凸起4的尖端在相应的X和Y坐标上由第二切割装置200的第二切割工具203切割以使所有凸块4的长度均匀化。版权所有：（C）2011，JPO和INPIT

14. 发明专利

JP2004140227A Semiconductor wafer protection unit and semiconductor wafer processing method 有权
公开(公告)号：JP2004140227A
公开(公告)日：2004-05-13
申请号：JP2002304454
申请日：2002-10-18
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： KITAMURA MASAHIKO , NANJO MASATOSHI , YAJIMA KOICHI , NAMIOKA SHINICHI
IPC分类号： H01L21/683 , B24B7/22 , H01L21/00 , H01L21/02 , H01L21/301 , H01L21/68
CPC分类号： H01L21/6836 , B24B7/228 , B24B37/042 , H01L21/67132 , H01L2221/68327
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer protection unit (10) which enables a semiconductor wafer to be handled as needed without breaking the semiconductor wafer even when the reverse surface of the semiconductor wafer (2) is grounded and then made greatly thin, and to provide a semiconductor wafer processing method which uses the semiconductor wafer protection unit. SOLUTION: The semiconductor wafer protection unit comprises a magnetized tape 12 whose one surface is adhesive, and a magnetic substrate 14 which has a number of thin holes 24 formed at least in its center region 20. COPYRIGHT: (C)2004,JPO

15. 发明专利

JP2004079613A Semiconductor wafer moving equipment 审中-公开
公开(公告)号：JP2004079613A
公开(公告)日：2004-03-11
申请号：JP2002234627
申请日：2002-08-12
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： NANJO MASATOSHI , YAJIMA KOICHI , NAMIOKA SHINICHI , KITAMURA MASAHIKO
IPC分类号： C09J7/00 , C09J5/00 , C09J201/00 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To improve productivity by efficiently sticking a semiconductor wafer formed thinly and fixed on a substrate on a dicing tape to be moved. SOLUTION: Semiconductor wafer moving equipment 10 comprises an external stimulus imparting means 30 for giving an external stimulus to an adhesive layer interposed between the semiconductor wafer and the substrate 103, and a substrate removing means 25 for removing the substrate 103 from the semiconductor wafer at the lowest. The semiconductor wafer moving equipment 10 lowers adhesive force by giving the external stimulus in the external stimulus imparting means 30, then removes the substrate 103 fixed on the semiconductor wafer through the adhesive layer lowering the adhesive force by receiving the external stimulus from the semiconductor wafer by the substrate removing means 25, and moves and fixes it on a dicing frame 101. COPYRIGHT: (C)2004,JPO

16. 发明专利

JP2010118494A Electrode working apparatus 有权
标题翻译：电极工作装置
公开(公告)号：JP2010118494A
公开(公告)日：2010-05-27
申请号：JP2008290649
申请日：2008-11-13
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： KOBAYASHI MAKOTO , MORI TAKASHI , KAWASE MASAYUKI , NAMIOKA SHINICHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an electrode working apparatus capable of machining, to uniform lengths, a plurality of bumps (electrodes) formed on a plurality of devices formed on a wafer even if there is a variation of surface elevations among the devices. SOLUTION: In the electrode working apparatus for machining a protruding electrode formed on the surface of the wafer held on a holding surface of a chuck table 52, the chuck table is supported via a piezo-electric motor 53 constituted of a piezo-electric element, and a machining means includes a machining byte. The apparatus includes a memory for storing X, Y coordinate values of a plurality of devices formed on the surface of the wafer and the previously detected surface elevation positions of the devices. X, Y coordinate values of the machining byte are obtained to control a voltage applied to the piezo-electric motor corresponding to the surface elevation position of the device in the X, Y coordinate values of the device. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够加工均匀长度的电极加工装置，即使在形成在晶片上的多个装置上形成的多个凸块（电极），即使在设备。解决方案：在用于加工形成在夹持在卡盘台52的保持表面上的晶片表面上的突出电极的电极加工装置中，卡盘台由压电马达53支撑，电气元件和加工装置包括加工字节。该装置包括存储器，用于存储形成在晶片表面上的多个器件的X，Y坐标值以及先前检测到的器件的表面仰角位置。获得加工字节的X，Y坐标值，以在设备的X，Y坐标值中控制施加到对应于装置的表面仰角位置的压电马达的电压。版权所有（C）2010，JPO＆INPIT

17. 发明专利

JP2005340592A Wafer processing device 有权
标题翻译：过滤加工设备
公开(公告)号：JP2005340592A
公开(公告)日：2005-12-08
申请号：JP2004159015
申请日：2004-05-28
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： MORI TAKASHI , NAMIOKA SHINICHI , MATSUTANI KAZUHIRO
IPC分类号： H01L21/683 , H01L21/60 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a wafer processing device with a chuck table, can be formed thereon and capable of effecting suction retaining without bending up the outer peripheral part of the wafer. SOLUTION: The wafer processing device is provided with the chuck table equipped with a retaining surface for retaining the wafer, a chuck table moving mechanism for moving the chuck table to a workpiece carry into/carry out region and a processing region, a cutting unit arranged in the processing region and mounted on a tool mounting member attached to a rotary spindle to cut a plurality of electrodes formed so as to be projected from the surface of the wafer retained by the chuck table and align the heights thereof, and a cutting unit feeding mechanism for advancing and retreating the cutting unit into a direction orthogonal to the retaining surface of the chuck table. The retaining surface of chuck table is equipped with an outer peripheral annular retaining unit formed on an outer periphery, a suction recess communicated with a suction means formed on the inside of the outer peripheral annular retaining unit, and an inside retaining unit formed on the inside of the outer peripheral annular retaining unit. The tool mounting member is constituted so that a level difference forming bite for cutting the outer peripheral annular retaining unit of the chuck table is mounted detachably on the tool mounting member. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有卡盘台的晶片处理装置，可以在其上形成并且能够实现吸留保持而不会弯曲晶片的外周部分。解决方案：晶片处理装置设置有配备有用于保持晶片的保持表面的卡盘台，用于将卡盘移动到工件进入/执行区域的卡盘台移动机构和加工区域，切割单元，布置在处理区域中，并且安装在安装在旋转主轴上的工具安装构件上，以切割多个电极，所述多个电极形成为从由卡盘台保持的晶片的表面突出并对准其高度; 切割单元进给机构，用于使切割单元前进和后退到与卡盘台的保持表面正交的方向上。卡盘台的保持面配备有形成在外周的外周环状保持单元，与形成在外周环状保持单元的内侧的吸引装置连通的吸入凹部，以及形成在内侧的内侧保持单元的外周环形保持单元。工具安装构件构成为能够可拆卸地安装用于切割卡盘台的外周环形保持单元的水平差形成用咬合件的工具安装构件。版权所有（C）2006，JPO＆NCIPI

18. 发明专利

JP2005340324A Method of processing chuck table in processing apparatus 有权
标题翻译：加工设备中加工表的方法
公开(公告)号：JP2005340324A
公开(公告)日：2005-12-08
申请号：JP2004154199
申请日：2004-05-25
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： NAMIOKA SHINICHI
IPC分类号： B23C3/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method of processing a chuck table in a processing apparatus wherein a distance between the holding surface of the chuck table and a cutting tool can be unified over the entire region of the holding surface. SOLUTION: The processing apparatus comprises the chuck table having the holding surface for holding a plate-like object, a chuck table moving mechanism for moving the chuck table, a cutting unit containing the cutting tool for cutting and truing up heights of a plurality of electrodes formed in a projecting state on the surface of a plate-like object held by the chuck table, and a cutting unit feeding mechanism for making back and forth the movement of the cutting unit in a direction perpendicular to the holding surface of the chuck table. In processing the chuck table in the processing apparatus, the chuck table is moved to a processing area, and then the holding surface of the chuck table is cut by the cutting unit. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理装置中的卡盘台的处理方法，其中夹持台的保持表面与切割工具之间的距离可以在保持表面的整个区域上一体化。解决方案：处理设备包括具有用于保持板状物体的保持表面的卡盘台，用于移动卡盘台的卡盘台移动机构，包含切割工具的切割单元和切割高度的切割单元在由卡盘台保持的板状物体的表面上以突出状态形成的多个电极，以及用于使切割单元沿与垂直于卡盘的保持表面垂直的方向前后移动的切割单元进给机构卡盘表。在处理装置中的卡盘台处理中，将卡盘移动到处理区域，然后通过切割单元切割卡盘台的保持表面。版权所有（C）2006，JPO＆NCIPI

19. 发明专利

JP2005327838A Processing device for plate-like electrode 有权
标题翻译：板状电极加工装置
公开(公告)号：JP2005327838A
公开(公告)日：2005-11-24
申请号：JP2004143198
申请日：2004-05-13
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： MORI TAKASHI , NAMIOKA SHINICHI , MATSUTANI KAZUHIRO
IPC分类号： H01L21/60
CPC分类号： H01L2224/1134
摘要： PROBLEM TO BE SOLVED: To provide a processing device capable of easily aligning heights of a plurality of electrodes formed to protrude from the surface of a platelike object without short-circuiting, and preventing the deposition of cut chips to the plate-like object and the contamination in a processed region.
SOLUTION: The processing device for aligning the heights of the plurality of electrodes formed to protrude from the surface of the plate-like object includes a chucking table having a mount face for mounting the plate-like object, a cutting unit provided in a machining region and having a cutting tool for cutting the plurality of electrodes formed to protrude from the surface of the plate-like object held on the chuck table to align their heights, an air-jetting means for jetting the air onto the machined surface of the plate-like object held on the chuck table to blow off the cut chips on the machined surface, and a suction means for sucking the cut chips blown off by the air jetted from the air-jetting means.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理装置，能够容易地将形成为从板状物体的表面突出的多个电极的高度对准而不发生短路，并且防止切割的芯片沉积到板状物体和处理区域的污染。解决方案：用于对准形成为从板状物体的表面突出的多个电极的高度的处理装置包括具有用于安装板状物体的安装面的夹盘，设置在加工区域，并且具有用于切割多个电极的切割工具，所述切割工具形成为从保持在卡盘台上的板状物体的表面突出以对准其高度;空气喷射装置，用于将空气喷射到加工表面上保持在卡盘台上的板状物品吹出加工表面上的切屑，以及用于吸入由空气喷射装置喷射的空气吹出的切断的切屑的抽吸装置。版权所有（C）2006，JPO＆NCIPI

20. 发明专利

JP2013187210A Bit cutting device 有权
标题翻译：位切割装置
公开(公告)号：JP2013187210A
公开(公告)日：2013-09-19
申请号：JP2012048702
申请日：2012-03-06
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： NAMIOKA SHINICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a bit cutting device which reduces the occurrence of a problem that a bellow part is fastened in a shrinking state thereby disabling a function of measuring a thickness of a workpiece.SOLUTION: A contact needle includes: a bar shaped body; and a tip part connected with the bar shaped body through a bellow part, which may expand and retract, and contacting with a holding surface and an upper surface of a workpiece. Workpiece thickness measurement means has a cover member having a through hole into which the contact needle is inserted and enclosing at least the bellow part.
摘要翻译：要解决的问题：提供一种减少波纹管部件在收缩状态下被紧固的问题的发生的位切割装置，从而无法测量工件的厚度的功能。解决方案：接触针包括：条状的身体; 以及通过波纹管部分与棒状体连接的尖端部分，其可以膨胀和缩回，并与工件的保持表面和上表面接触。工件厚度测量装置具有盖构件，其具有通孔，接触针插入该通孔中并且至少包围波纹管部分。

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