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11. 发明专利

JP2005150966A Coating structure for vehicle, vehicle mounted antenna, and antenna patterning method for vehicle 审中-公开
标题翻译：车辆，车辆安装天线的涂层结构和车辆的天线方式
公开(公告)号：JP2005150966A
公开(公告)日：2005-06-09
申请号：JP2003382979
申请日：2003-11-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： TANAKA TORU
IPC分类号： H01P11/00 , H01Q1/22
摘要： PROBLEM TO BE SOLVED: To provide a coating structure for vehicle having an antenna pattern exhibiting enhance gain, and to provide a vehicle mounted antenna and an antenna patterning method for vehicle. SOLUTION: The coating structure for vehicle having an antenna pattern 15 in the coating is provided with a dielectric layer 16 of low dielectric constant formed beneath the antenna pattern 15. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有增强增益的天线方向图的车辆用涂层结构，提供车载天线和车辆用天线构图方法。解决方案：在涂层中具有天线图案15的车辆涂层结构设置有形成在天线图案15下方的低介电常数介电层16.（C）2005，JPO＆NCIPI

12. 发明专利

JP2007116037A Method of manufacturing wiring board 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：JP2007116037A
公开(公告)日：2007-05-10
申请号：JP2005308483
申请日：2005-10-24
申请人： Mitsui Chemicals Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 三井化学株式会社
发明人： TAKAHASHI MASAKI , IWATA KENJI , GOTO KENICHI , KAMATA JUN , TANAKA TORU
IPC分类号： H05K3/18 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a remarkably simplified method of forming a conductor circuit which does not require plating or resist by solving a problem of complicated process in a conventional method of forming a conductor circuit, and to provide a wiring board to be obtained by this method.
SOLUTION: The method of forming a conductor circuit is characterized in that a silicon-containing polymer layer patterned is formed on an insulation layer by using an ink jet device, and then, the formed layer is brought into contact with a solution of a transition metal salt or a suspension, thereby forming a transition metal layer on the silicon-containing polymer layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种非常简单的形成不需要电镀或抗蚀剂的导体电路的方法，通过解决传统的形成导体电路的方法中的复杂工艺的问题，并且提供一种布线板通过这种方法获得。解决方案：形成导体电路的方法的特征在于，通过使用喷墨装置在绝缘层上形成图案化的含硅聚合物层，然后使形成的层与过渡金属盐或悬浮液，从而在含硅聚合物层上形成过渡金属层。版权所有（C）2007，JPO＆INPIT

13. 发明专利

JP2004183479A Part installation structure to fuel tank band 有权
公开(公告)号：JP2004183479A
公开(公告)日：2004-07-02
申请号：JP2002347524
申请日：2002-11-29
申请人： Nifco Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社ニフコ
发明人： TANAKA TORU , KATAOKA CHIAKI , TAKAHASHI SHIGERU
IPC分类号： B60K15/03 , B60K15/067 , F02M37/00 , F16B5/06 , F16B5/10 , F16B5/12
CPC分类号： F16B5/123 , B60K15/067 , B60K2015/03467 , Y10T24/1471 , Y10T24/1473 , Y10T403/4966 , Y10T403/53 , Y10T403/59 , Y10T403/7176
摘要： PROBLEM TO BE SOLVED: To enable the installation of a part to a fuel tank band by securing the rigidity of the fuel tank band. SOLUTION: A clip 14 for the fuel tank band is made of resin material, and provided with a clip body 16 for holding the clip setting part 10A of the fuel tank band 10, and a part locking part 18 formed at the lower part of the clip body 16. The clip body 16 of the chip 14 is divided into an upper part 20 and a lower part 22. Between the upper part 20 and the lower part 22, a clearance 24 is formed to fit an end face shape of the clip setting part 10A of the fuel tank band 10. COPYRIGHT: (C)2004,JPO&NCIPI

14. 发明专利

JP2004083889A Automotive propylene-based resin composition, method for producing the same and molded product of the same 有权
公开(公告)号：JP2004083889A
公开(公告)日：2004-03-18
申请号：JP2003185382
申请日：2003-06-27
申请人： Japan Polychem Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 日本ポリケム株式会社
发明人： NAKAYAMA KOICHI , ZANKA YUKITO , UBOSHI RYOJI , FUJITA YUJI , TANAKA TORU
IPC分类号： C08L53/00 , C08K3/04 , C08K3/34
摘要： PROBLEM TO BE SOLVED: To obtain an automotive propylene-based resin composition having improved coating performance in primerless coating of a water-based coating, having such electrical conductivity as to enable to conduct electrostatic coating, having such flowability as to enable to conduct injection molding of a large-sized thin-wall molded product, and further having an excellent balance between the coating performance, the electrical conductivity, and mechanical characteristics, to provide a method for producing the same, and to provide a molded product of the same. SOLUTION: The automotive propylene-based resin composition contains (A) a polypropylene-based resin composition in an amount of 100 pts.wt., (B) a specific modified polypropylene in an amount of 1-15 pts.wt., and (C) an electrically-conductive carbon black in an amount of 1-15 pts.wt., wherein the polypropylene-based resin composition (A) is composed of (a) a propylene-ethylene block copolymer in an amount of 100 pts.wt., (b) an ethylenic elastomer in an amount of 20-40 pts.wt., and (c) talc in an amount of 30-50 pts.wt. Further, the automotive propylene-based resin composition has a volume resistivity value (VR) of ≤10 10 Ωcm, and further has a relationship of the VR (volume resistivity) to a MFR satisfying inequality (I): [log(VR)-1]×2≤MFR, so that the propylene-based resin composition has the excellent balance between the electrical conductivity, the coating performance and impact strength. COPYRIGHT: (C)2004,JPO

15. 发明专利

JP2004035621A Propylenic resin composition for automobile, method for producing the same and its molded product 有权
公开(公告)号：JP2004035621A
公开(公告)日：2004-02-05
申请号：JP2002191103
申请日：2002-06-28
申请人： Japan Polychem Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 日本ポリケム株式会社
发明人： NAKAYAMA KOICHI , ZANKA YUKITO , UBOSHI RYOJI , FUJITA YUJI , TANAKA TORU
IPC分类号： C08J5/00 , B29B7/00 , B29K23/00 , B29K105/16 , B29K307/04 , C08K3/04 , C08K3/34 , C08L53/00
摘要： PROBLEM TO BE SOLVED: To provide a propylenic resin composition for automobiles, which has an excellent balance between electroconductivity and flowability, to provide a method for producing the same, and to provide its molded product.
SOLUTION: This propylenic resin composition for the automobiles, having the excellent balance between the electroconductivity and the flowability, comprising (A) 100 pts. wt. of a propylene-ethylene block copolymer, (B) 20 to 40 pts. wt. of ethylene-octene random copolymer and/or ethylene-butene random copolymer, (C) 30 to 50 pts. wt. of talc, and (D) 0.5 to 15 pts. wt. of conductive carbon, is characterized in that a volume resistivity value (VR) is ≤10
10 Ωcm and the relation of MFR with VR satisfies the following expression (I). [log(VR)-1]×2≤MFR (I). The method for producing the same, and its molded product.
COPYRIGHT: (C)2004,JPO

16. 发明专利

JP2014192518A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2014192518A
公开(公告)日：2014-10-06
申请号：JP2013069828
申请日：2013-03-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： TANAKA TORU
IPC分类号： H01L23/29 , H01L23/31 , H01L23/36
CPC分类号： H01L23/4334 , H01L23/051 , H01L23/16 , H01L23/3107 , H01L23/3135 , H01L23/492 , H01L23/49562 , H01L23/49575 , H01L2224/27013 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor chip is solder bonded to a metal plate and resin molded and the metal plate and a resin package are unlikely to be separated.SOLUTION: A semiconductor device 10 disclosed in the present specification comprises: a metal plate 3; a semiconductor chip 5 fixed to the metal plate 3 via a solder layer 8; and a resin package 12 which is in contact with the metal plate 3 and molds the semiconductor chip 5. The semiconductor device 10 includes a dent 4 in the metal plate 3 so as to be adjacent to an edge of a fillet 8a of the solder layer 8 when viewed from above the metal plate 3. An excess primer gathered around the edge of the fillet flows into the dent 4 thereby to prevent increase in film thickness of the primer.
摘要翻译：要解决的问题：提供一种半导体器件，其中半导体芯片被焊接到金属板上并且树脂模制，并且金属板和树脂封装不可能被分离。解决方案：本说明书中公开的半导体器件10 包括：金属板3; 通过焊料层8固定在金属板3上的半导体芯片5; 以及与金属板3接触并对半导体芯片5进行成形的树脂封装12.半导体装置10在金属板3中具有与焊料层的圆角8a的边缘相邻的凹部4 当从金属板3的上方观察时，围绕圆角边缘聚集的过量底漆流入凹陷4，从而防止底漆的膜厚增加。

17. 发明专利

JP2013206920A Module including circuit element 有权
标题翻译：包括电路元件的模块
公开(公告)号：JP2013206920A
公开(公告)日：2013-10-07
申请号：JP2012071048
申请日：2012-03-27
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： USUI MASANORI , SATO TOSHIICHI , AOSHIMA MASAKI , TANAKA TORU
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To realize a module which achieves stable joint strength between an electrode of a circuit element and a copper plate.SOLUTION: A module 100 includes: a copper plate 10; a circuit element 30; and an alloy layer 20 that joins the copper plate 10 to an electrode 32 of the circuit element 30. The alloy layer 20 includes a first portion 22, a second portion 26, and a third portion 24. The first portion 22 is positioned on the copper plate 10 side and is made of a first type alloy composed of tin and copper. The second portion 26 is positioned on the electrode 32 side of the circuit element 30 and is made of a second type alloy including at least one kind of metal, which is selected from gold, nickel, and silver, and tin. The third portion 24 is positioned between the first portion 22 and the second portion 26, and the first type alloy and the second type alloy are mixed therein.
摘要翻译：要解决的问题：实现一种在电路元件的电极和铜板之间实现稳定的接合强度的模块。解决方案：模块100包括：铜板10; 电路元件30; 以及将铜板10连接到电路元件30的电极32的合金层20.合金层20包括第一部分22，第二部分26和第三部分24.第一部分22位于铜板10侧，由锡和铜构成的第一种合金制成。第二部分26位于电路元件30的电极32侧，并且由选自金，镍和银中的至少一种金属和锡构成的第二类合金制成。第三部分24位于第一部分22和第二部分26之间，并且第一类型合金和第二类型合金混合在其中。

18. 发明专利

JP2007237776A Fuel tank of resin 审中-公开
标题翻译：树脂燃油箱
公开(公告)号：JP2007237776A
公开(公告)日：2007-09-20
申请号：JP2006059418
申请日：2006-03-06
申请人： Fts:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社エフティエス
发明人： KINOSHITA SHINSUKE , SUGANUMA HIROAKI , SUDA SHINKO , TANAKA TORU
IPC分类号： B60K15/077
摘要： PROBLEM TO BE SOLVED: To provide a fuel tank formed from a resin by means of blow molding, in which a recess is formed functioning as a stand-off part or a baffle part, capable of suppressing a decrease in the tank capacity.
SOLUTION: A through hole 21 is formed in the wall surface of the recess 2 so as to generate communication from an accommodation space 100 to the cavity 20 in the recess 2, and a cover 3 is provided to demarcate the cavity 20 from the outside air-tightly. Because the fuel intrudes into and goes out of the cavity 20 in the recess 2 via the through hole 21, it is possible to accommodate the fuel even in the cavity 20.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过吹塑成型由树脂形成的燃料箱，其中形成有用作间隔部分或挡板部分的凹部，能够抑制罐容量的降低。解决方案：在凹部2的壁表面中形成通孔21，以便从容纳空间100到凹部2中的空腔20产生连通，并且设置盖3以将空腔20从外面气密。由于燃料经由通孔21进入凹部2内的空腔20内，所以也可以容纳在空腔20内的燃料。（C）2007，JPO＆INPIT

19. 发明专利

JP2007131898A Metal coating method and foamed body 有权
标题翻译：金属涂层方法和发泡体
公开(公告)号：JP2007131898A
公开(公告)日：2007-05-31
申请号：JP2005325197
申请日：2005-11-09
申请人： Mitsui Chemicals Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 三井化学株式会社
发明人： TAKAHASHI MASAKI , IWATA KENJI , KAMATA JUN , GOTO KENICHI , TANAKA TORU
IPC分类号： C23C18/18 , C04B41/88 , C08J9/36 , C23C18/16 , C23C18/20
摘要： PROBLEM TO BE SOLVED: To selectively form a metallic layer with an almost uniform film thickness on the desired part in the surface of a continuous foamable molding and the surface of each communicative pore at the inside thereof without using complicated methods such as plating and resist layer formation.
SOLUTION: The reducibility of a silicon-containing polymer to a transition metal salt is utilized. Namely, a silicon-containing polymer layer is formed on the surface of a continuous foamable molding and the surface of each communicative pore at the inside thereof, the silicon-containing polymer layer other than the forming scheduled part of a metallic layer is irradiated with ultraviolet rays, thereafter, the silicon-containing polymer layer is brought into contact with a solution or a suspension comprising a transition metal salt in which counter anions can be coordinated on the silicon atoms of the silicon-containing polymer, and a metallic layer is selectively formed on the part not irradiated with the ultraviolet rays.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了选择性地在连续发泡模塑件的表面的所需部分和其内部的每个连通孔的表面上选择性地形成具有几乎均匀的膜厚度的金属层，而不使用诸如电镀的复杂方法并抗蚀层形成。解决方案：使用含硅聚合物对过渡金属盐的还原性。也就是说，在连续发泡性成形体的表面上形成含硅聚合物层，在其内部形成各交换孔的表面，除金属层的成形排列部分以外的含硅聚合物层照射紫外线之后，使含硅聚合物层与包含过渡金属盐的溶液或悬浮液接触，其中可以在含硅聚合物的硅原子上配位相对阴离子，并且选择性地形成金属层部分不被紫外线照射。版权所有（C）2007，JPO＆INPIT

20. 发明专利

JP2007116038A Method of manufacturing wiring board 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：JP2007116038A
公开(公告)日：2007-05-10
申请号：JP2005308484
申请日：2005-10-24
申请人： Mitsui Chemicals Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 三井化学株式会社
发明人： TAKAHASHI MASAKI , IWATA KENJI , GOTO KENICHI , KAMATA JUN , TANAKA TORU
IPC分类号： H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a remarkably simplified method of forming a conductor circuit which does not require plating or resist by solving a problem of complicated process in a conventional method of forming a conductor circuit, and to provide a wiring board to be obtained by this method.
SOLUTION: The method of forming a conductor circuit is characterized in a silicon-containing polymer layer patterned is formed on an insulation layer by using a screen printer, and then, the formed layer is brought into contact with a solution of a transition metal salt or a suspension, thereby forming a transition metal layer on the silicon-containing polymer layer.
COPYRIGHT: (C)2007,JPO&INPIT

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