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11. 发明专利

JP2013155220A Thermoplastic resin composition for cleaning molding machine 有权
标题翻译：热塑性树脂组合物清洗成型机
公开(公告)号：JP2013155220A
公开(公告)日：2013-08-15
申请号：JP2012014738
申请日：2012-01-27
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： C11D3/37 , C08K5/098 , C08K5/103 , C08K5/521 , C08L25/04 , C08L25/14 , C08L33/12 , C11D1/04 , C11D1/34 , C11D1/68
CPC分类号： B29C33/722 , B29C33/72 , B29L2031/757 , C08K5/098 , C08K5/103 , C08K5/521 , C08L25/04 , C08L25/06 , C08L33/08 , C08L33/12 , C11D1/04 , C11D1/34 , C11D1/345 , C11D1/66 , C11D3/06 , C11D3/2075 , C11D3/362 , C11D3/37 , C11D3/3746 , C11D3/3749 , C11D10/04 , C11D11/0041
摘要： PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for cleaning a molding machine, which has favorable workability and cleaning characteristics when cleaning the interior of a thermoplastic resin molding machine such as an extrusion machine, an injection molding machine, or the like.SOLUTION: A thermoplastic resin composition for cleaning a molding machine contains: (A) a thermoplastic resin containing a styrenic resin; (B) an alkali metal salt of a fatty acid; (C) a nonionic surfactant; and (D) a metal salt of an acid ester phosphate.
摘要翻译：要解决的问题：提供一种清洗成型机的热塑性树脂组合物，其在清洗挤出机，注射成型机等热塑性树脂成型机的内部时具有良好的加工性和清洁特性。：用于清洗成型机的热塑性树脂组合物含有：（A）含有苯乙烯树脂的热塑性树脂; （B）脂肪酸的碱金属盐; （C）非离子表面活性剂; 和（D）酸式磷酸酯的金属盐。

12. 发明专利

JP2013154484A Thermoplastic resin composition for cleaning molding machine 有权
标题翻译：热塑性树脂组合物清洗成型机
公开(公告)号：JP2013154484A
公开(公告)日：2013-08-15
申请号：JP2012014737
申请日：2012-01-27
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： B29C33/72 , B29C45/17 , C08K5/098 , C08K5/103 , C08K5/521 , C08L23/00 , C08L101/00 , C11D1/04 , C11D1/34 , C11D1/68 , C11D3/37
CPC分类号： C11D3/3749 , B08B7/00 , B29C33/72 , C08K5/098 , C08K5/101 , C08K5/103 , C08K5/1535 , C08K5/521 , C08L23/02 , C08L23/04 , C08L23/06 , C08L23/0807 , C08L23/0815 , C08L23/0869 , C08L23/10 , C08L25/12 , C08L33/08 , C08L33/10 , C08L33/12 , C08L2205/03 , C08L2207/062 , C08L2207/066 , C11D1/345 , C11D1/66 , C11D1/667 , C11D3/2075 , C11D3/362 , C11D3/3761 , C11D10/04 , C11D11/0041
摘要： PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for cleaning a molding machine and having favorable cleaning characteristics and working efficiency when cleaning the interior of a thermoplastic resin molding machine such as an extruding machine and an injection molding machine.SOLUTION: A thermoplastic resin composition for cleaning a molding machine contains: (A) an olefin resin; (B) a thermoplastic resin having no compatibility with the olefin resin in an (A)-component; (C) a thermoplastic resin for making the olefin resin of the (A) component compatible with the thermoplastic resin of a (B)-component; (D) an alkali metal salt of a fatty acid; (E) a nonionic surfactant; and (F) a metal salt of an alkyl acid phosphate.
摘要翻译：要解决的问题：提供一种用于清洗成型机的热塑性树脂组合物，并且在清洗挤出机和注射成型机等热塑性树脂成形机的内部时具有良好的清洗特性和工作效率。解决方案：热塑性树脂用于清洁成型机的组合物包含：（A）烯烃树脂; （B）在（A）成分中与烯烃树脂不相容的热塑性树脂; （C）用于制备（A）成分的烯烃树脂与（B） - 组分的热塑性树脂相容的热塑性树脂; （D）脂肪酸的碱金属盐; （E）非离子表面活性剂; 和（F）烷基酸式磷酸盐的金属盐。

13. 发明专利

JP2012158115A Thermoplastic resin composition for cleaning molding machine 审中-公开
标题翻译：热塑性树脂组合物清洗成型机
公开(公告)号：JP2012158115A
公开(公告)日：2012-08-23
申请号：JP2011019664
申请日：2011-02-01
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： B29C45/17 , B29C33/72 , C08K5/524 , C08L101/00 , C09K15/32 , C11D3/36 , C11D3/37 , C11D7/36
摘要： PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for cleaning a molding machine by which the visual confirmation of the cleaning state of the molding machine is easily carried out.SOLUTION: The thermoplastic resin composition for cleaning the molding machine contains a thermoplastic resin and an antioxidant containing phosphite and the phosphite is 6-[3-(3-t-butyl-4-hydroxy-5-methyl phenyl)propoxy]-2,4,8,10-tetra-t-butyl dibenz[d,f][1,3,2]dioxyophophepin.
摘要翻译：要解决的问题：提供一种用于清洁成型机的热塑性树脂组合物，通过该成型机容易地进行成型机的清洁状态的目视确认。解决方案：用于清洗成型机的热塑性树脂组合物含有热塑性树脂和含有亚磷酸酯的抗氧化剂，亚磷酸酯是6- [3-（3-叔丁基-4-羟基-5-甲基苯基）丙氧基] -2,4,8,10-四叔丁基二苯并[d，f] [1,3,2]二氧磷杂环庚烯。版权所有（C）2012，JPO＆INPIT

14. 发明专利

JP2005271253A Conductive composite plastic sheet 审中-公开
标题翻译：导电复合塑料片
公开(公告)号：JP2005271253A
公开(公告)日：2005-10-06
申请号：JP2004084385
申请日：2004-03-23
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： B65D73/02 , B29C70/88 , B32B27/30 , B65D1/00 , B65D65/40 , C08K3/04 , C08L25/08 , H05K9/00 , H05K13/00
CPC分类号： H05K13/0084 , Y10T428/1352
摘要： PROBLEM TO BE SOLVED: To provide a conductive composite plastic sheet suitable for a carrier tape for storing an electronic component. SOLUTION: The composite plastic sheet has a sheet substrate containing a thermoplastic resin and a conductive resin layer formed on the surface of the sheet substrate. The sheet substrate contains a styrene resin. The conductive resin layer is a mixture in which a styrene resin (A-1), carbon black (A-2), and one kind of a copolymer obtained from ethylene and the other monomer or two or more kinds of copolymers (A-3) are combined and comprises a conductive resin composition containing the copolymer in which the content of the monomer copolymerized with ethylene is 6-14 mass% in mass average. The thickness ratio of the sheet substrate to the conductive resin layer is 4/1-20/1, and the total thickness is 0.1-1.0 mm. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供适合于用于存储电子部件的载带的导电性复合塑料片。解决方案：复合塑料片具有包含热塑性树脂的片基片和形成在片基片的表面上的导电树脂层。片基材含有苯乙烯树脂。导电性树脂层是苯乙烯系树脂（A-1），炭黑（A-2）和由乙烯和其它单体得到的一种共聚物或两种以上共聚物（A-3）的混合物）组合，并且包括含有共聚物的导电树脂组合物，其中与乙烯共聚的单体的含量以质量平均计为6-14质量％。片基体与导电性树脂层的厚度比为4 / 1-20 / 1，总厚度为0.1〜1.0mm。版权所有（C）2006，JPO＆NCIPI

15. 发明专利

JP2014077049A Thermoplastic resin composition for cleaning molding processing machine 审中-公开
标题翻译：用于清洁成型加工机的热塑性树脂组合物
公开(公告)号：JP2014077049A
公开(公告)日：2014-05-01
申请号：JP2012225077
申请日：2012-10-10
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： C08L23/00 , C08K3/32 , C08K5/098 , C08L23/08 , C08L25/08
CPC分类号： B29C33/722 , C08F2/005 , C08K3/32 , C08K5/098 , C08K2003/324 , C08L23/0815 , C08L23/0846 , C08L33/12
摘要： PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for cleaning a molding processing machine, having good cleaning performance.SOLUTION: This invention provides a thermoplastic resin composition for cleaning a molding processing machine. The composition contains (A) an olefin-based resin, (B) one or more thermoplastic resins selected from AS resin, MS resin, and PMMA resin, (C) a thermoplastic resin for compatibilizing the olefin-based resin of component (A) and the thermoplastic resin of component (B), (D) an alkali metal salt of a fatty acid, and (E) condensed sodium phosphate.
摘要翻译：要解决的问题：提供一种用于清洗成型加工机的热塑性树脂组合物，具有良好的清洁性能。解决方案：本发明提供一种用于清洗成型加工机的热塑性树脂组合物。该组合物含有（A）烯烃系树脂，（B）选自AS树脂，MS树脂，PMMA树脂的一种以上热塑性树脂，（C）将成分（A）的烯烃系树脂相容化的热塑性树脂，和组分（B）的热塑性树脂，（D）脂肪酸的碱金属盐和（E）缩合的磷酸钠。

16. 发明专利

JP2013060510A Molding method of molding material 有权
标题翻译：成型材料成型方法
公开(公告)号：JP2013060510A
公开(公告)日：2013-04-04
申请号：JP2011199054
申请日：2011-09-13
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： C11D3/37 , B29C37/00 , C11D3/02
摘要： PROBLEM TO BE SOLVED: To provide a molding method of a molding material in which the substitution to a molding material 2 from a molding material 1 is easy when a molding material is molded using a molding machine.SOLUTION: The molding method of a molding material is such that a molding material 1 is used to be molded by a molding machine, then a molding material 2 is used to be molded by the same molding machine, a washing process 1 and a washing process 2 are executed by this order, the molding material 1 that remains in the molding machine is removed, and then the molding material 2 is used to be molded. The molding method of a molding material is characterized in that the washing process 1 is a process in which the molding machine is washed by a detergent composition 1 including the molding material 1 and a surfactant, and the washing process 2 is a process in which the molding machine is washed by a detergent composition 2 including the molding material 2 and a surfactant.
摘要翻译：要解决的问题：提供一种成型材料的成型方法，其中当使用成型机模制成型材料时，从成型材料1对成型材料2的取代容易。解决方案：成型材料的成型方法是使用成型材料1通过成型机成型，然后使用成型材料2通过相同的成型机，洗涤工序1和按照该顺序执行洗涤处理2，去除保留在成形机中的成型材料1，然后使用成型材料2进行成型。成型材料的成型方法的特征在于，洗涤方法1是其中成型机由包括成型材料1和表面活性剂的洗涤剂组合物1洗涤的过程，洗涤过程2是其中成型机由包括成型材料2和表面活性剂的洗涤剂组合物2洗涤。版权所有（C）2013，JPO＆INPIT

17. 发明专利

JP2009234149A Composite molding 审中-公开
标题翻译：复合成型
公开(公告)号：JP2009234149A
公开(公告)日：2009-10-15
申请号：JP2008085512
申请日：2008-03-28
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI
IPC分类号： B32B27/00 , B32B27/34
摘要： PROBLEM TO BE SOLVED: To provide a composite molding which can be applied to fields requiring chemical resistance, sliding resistance, heat resistance or the like. SOLUTION: The composite molding 1 has a polyamide resin-containing layer 3 on one surface 2a of the molding 2 containing a polyether ether ketone resin. The polyamide resin-containing layer 3 is formed by heat fusion of the polyether ether ketone resin and the polyamide resin at a melting point of the polyether ether ketone resin or above. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供可应用于需要耐化学性，滑动阻力，耐热性等的场合的复合成型体。解决方案：复合模塑件1在含有聚醚醚酮树脂的模制件2的一个表面2a上具有含聚酰胺树脂的层3。聚酰胺树脂含有层3通过聚醚醚酮树脂和聚酰胺树脂在聚醚醚酮树脂的熔点以上的熔点进行热熔融而形成。版权所有（C）2010，JPO＆INPIT

18. 发明专利

JP2008081838A Plated resin-molded body 有权
标题翻译：镀树脂模体
公开(公告)号：JP2008081838A
公开(公告)日：2008-04-10
申请号：JP2007017464
申请日：2007-01-29
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： TAI TOSHIHIRO , WAKITA NAOKI
IPC分类号： C23C18/16 , C23C18/20
摘要： PROBLEM TO BE SOLVED: To provide a plated resin-molded body with a plating film having high adhesive strength and showing beautiful appearance. SOLUTION: The resin-molded body is made from a resin composition which comprises: (A) (A-1) 10 to 90 mass% of a resin showing a water absorption rate (ISO62) of 0.6% or more after having been immersed in water at 23°C for 24 hrs; (A-2) 10 to 90 mass% of a resin showing a water absorption rate (ISO62) less than 0.6% after having been immersed in water at 23°C for 24 hrs; and (B) 0.01 to 20 parts by mass of a water-soluble substance having the solubility in water (25°C) of 0.01 g/100 g to 10 g/100 g, with respect to 100 parts by mass of a synthetic resin of the (A) component. The resin-molded body also has the surface having a contact angle (measured by dropping method) of 55 to 75 degrees; and is not etched by an acid containing chromium and/or manganese. The plated resin-molded body has a metal-plated layer on the surface of the above resin-molded body. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有高粘合强度的电镀膜并且呈现出美丽外观的电镀树脂成型体。解决方案：树脂成形体由树脂组合物制成，该树脂组合物包含：（A）（A-1）具有10至90质量％的具有0.6％或更高的吸水率（ISO62）的树脂，具有浸入23℃的水中24小时; （A-2）在23℃下浸渍24小时后，表现出吸水率（ISO62）小于0.6％的树脂的10〜90质量％和（B）相对于100质量份的合成树脂100质量份，在水（25℃）中溶解度为0.01g / 100g〜100g / 100g的水溶性物质为0.01〜20质量份的（A）组分。树脂成型体的表面具有55〜75度的接触角（通过滴下法测定）。并且不被含有铬和/或锰的酸蚀刻。电镀树脂成型体在上述树脂成型体的表面上具有金属镀层。版权所有（C）2008，JPO＆INPIT

19. 发明专利

JP2004351870A Conductive composite plastic sheet 审中-公开
公开(公告)号：JP2004351870A
公开(公告)日：2004-12-16
申请号：JP2003154984
申请日：2003-05-30
申请人： Daicel Polymer Ltd , ダイセルポリマー株式会社
发明人： WAKITA NAOKI , KUBOTA SHINICHI , IRIE HIROSAKU
IPC分类号： B65D65/40 , B32B7/02 , B32B27/00 , B32B27/08 , B65D73/02 , B65D85/90 , C08J5/18 , H01B5/14 , H01L23/00 , H05K13/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive composite plastic sheet which causes no flash during slitting.
SOLUTION: The conductive composite plastic sheet has a thermoplastic resin (A-1) selected from a polyphenylene ether-based resin and the like, a sheet base material (A-2) including a styrene-based thermoplastic elastomer and a conductive resin layer formed on the surface of the sheet base material wherein the sheet base material contains 1 to 25 mass pts. of the component (A-2) based on 100 mass pts. of the component (A-1), the component (A-2) shows a peak frequency of loss tangent (tanδ) of not more than 10
8 at 23°C, the conductive resin layer is composed of a conductive resin composition containing a thermoplastic resin selected from a polyphenylene ether-based resin (B) and the like, carbon black (C) and a thermoplastic elastomer (D), a ratio of the thickness of the sheet base material to that of the conductive resin layer is in the range of 4/1 to 20/1, and the total thickness is 0.1 to 1.0mm.
COPYRIGHT: (C)2005,JPO&NCIPI

20. 发明专利

JP2004255774A CONDUCTIVE COMPOSITE PLASTIC SHEET 审中-公开
公开(公告)号：JP2004255774A
公开(公告)日：2004-09-16
申请号：JP2003050602
申请日：2003-02-27
申请人： DAICEL POLYMER LTD
发明人： WAKITA NAOKI , KUBOTA SHINICHI , IRIE HIROSAKU
IPC分类号： B65D73/02 , B29C70/88 , B32B7/02 , B32B27/00 , B32B27/18 , B32B27/30 , B65D65/40 , C08L23/08 , C08L25/04 , C08L71/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive composite plastic sheet which brings about no flash on the occasion of slitting. SOLUTION: This conductive composite plastic sheet has a sheet base which contains (A-1) a thermoplastic resin selected from a polyphenylene ether-based resin and a polystyrene-based resin and (A-2) a matter selected from a thermoplastic resin having noncompatibility with the thermoplastic resin and containing no styrene unit as a repetitive unit and a thermoplastic elastomer, and has a conductive resin layer which is formed on the surface of the sheet base. The sheet base contains a matter obtained by compounding 1-20 pts.mass of (A-2) with 100 pts.mass of (A-1). The conductive resin layer contains a matter selected from (B) a thermoplastic resin selected from the polyphenylene ether-based resin and a styrene-based resin, (C) carbon black and (D) the thermoplastic elastomer. The thickness ratio between the sheet base and the conductive resin layer is made 1/4-1/20 and the total thickness of the sheet is made 0.1-1.0 mm. COPYRIGHT: (C)2004,JPO&NCIPI

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