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11. 发明专利

JP2010268635A Printed wiring board, electronic device, high-voltage power supply apparatus, and image forming apparatus 审中-公开
标题翻译：印刷线路板，电子设备，高压电源设备和图像形成设备
公开(公告)号：JP2010268635A
公开(公告)日：2010-11-25
申请号：JP2009119075
申请日：2009-05-15
申请人： Canon Inc , キヤノン株式会社
发明人： TANAKA SHUNSUKE
IPC分类号： H02M3/24 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To easily and inexpensively protect a semiconductor component from electric discharge that is caused by a pyroelectric effect at a piezoelectric element in a flow mounting process.
SOLUTION: An electronic device includes a printed wiring board, a semiconductor component mounted by flow bonding on the printed wiring board, and a piezoelectric element mounted by flow bonding on the printed wiring board. The electronic device also includes a breaker mechanism disposed in the middle of a closed circuit made up of the semiconductor component and the piezoelectric element, the breaker mechanism keeping the closed circuit open at least during flow mounting while being short-circuited by a short-circuiting method different from the method of flow mounting to complete the closed circuit after the end of flow mounting.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：在流动安装过程中，为了容易且廉价地保护由压电元件的热电效应引起的放电的半导体元件。解决方案：一种电子设备包括印刷线路板，通过流焊在印刷线路板上安装的半导体部件和通过流焊在印刷线路板上安装的压电元件。电子设备还包括设置在由半导体部件和压电元件构成的闭路的中间的断路器机构，断路器机构至少在流动安装期间保持封闭回路断开，同时由于短路而短路方法与流动安装方法不同，完成流动安装结束后的闭路。版权所有（C）2011，JPO＆INPIT

12. 发明专利

JP2010267877A Printed wiring board, electronic device, high-voltage power-supply device, and image formation device 审中-公开
标题翻译：印刷线路板，电子设备，高压电源装置和图像形成装置
公开(公告)号：JP2010267877A
公开(公告)日：2010-11-25
申请号：JP2009119074
申请日：2009-05-15
申请人： Canon Inc , キヤノン株式会社
发明人： TANAKA SHUNSUKE
IPC分类号： H05K1/02 , G03G15/02 , G03G15/16 , H02M3/24
摘要： PROBLEM TO BE SOLVED: To protect, with an inexpensive and simple method, a semiconductor component from discharge generated from a piezoelectric element by a power-collecting effect in a flow soldering process.
SOLUTION: The electronic device includes: a printed wiring board to be soldered using, for instance, a solder jet flow; a semiconductor component arranged on the printed wiring board; and a piezoelectric element arranged on the printed wiring board. In particular, the electronic device includes one or more inductors that are inserted on a line connecting the semiconductor component and the piezoelectric element and that protects the semiconductor component from a discharge phenomenon generated from the piezoelectric element in a soldering process.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了以廉价和简单的方法，通过在焊接焊接过程中的电力收集效应，从由压电元件产生的放电来保护半导体元件。解决方案：电子设备包括：使用例如焊料喷射流焊接的印刷线路板; 布置在印刷线路板上的半导体部件; 以及布置在印刷线路板上的压电元件。特别地，电子设备包括插入在连接半导体部件和压电元件的线上的一个或多个电感器，并且在焊接过程中保护半导体部件免受从压电元件产生的放电现象。版权所有（C）2011，JPO＆INPIT

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