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11. 发明专利

JP2014015580A Adhesive tape 有权
标题翻译：胶粘带
公开(公告)号：JP2014015580A
公开(公告)日：2014-01-30
申请号：JP2012155668
申请日：2012-07-11
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： TONEGAWA KYO , ASO TAKAHIRO
IPC分类号： C09J7/02 , B32B27/00 , C08F2/50 , C09J4/00 , C09J11/04 , C09J11/06
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape that is easily releasable from an adherend without an adhesive residue upon being irradiated with rays of light even after undergoing high-temperature processing.SOLUTION: An adhesive tape includes an adhesive layer comprising an adhesive composition containing a photocurable adhesive component and a photoinitiator on at least one face of a base material. On the surface of the base material on the side in contact with the adhesive layer, an anchor agent layer with a storage elastic modulus of 1.0×10Pa or more at 260°C is formed.
摘要翻译：要解决的问题：提供即使在进行高温处理后也被光线照射后，也可以从被粘物容易地剥离而不会发生粘合剂残留的粘合带。胶粘带包括粘合剂层，该粘合剂层包含含有可光固化的粘合剂组分和光引发剂在基材的至少一个面上。在与粘合剂层接触的一侧的基材的表面上，形成了在260℃下的储能弹性模量为1.0×10Pa以上的固着剂层。

12. 发明专利

JP2014012769A Adhesive compound, adhesive tape, and wafer treatment method 审中-公开
标题翻译：粘合剂，粘合胶带和水分处理方法
公开(公告)号：JP2014012769A
公开(公告)日：2014-01-23
申请号：JP2012150603
申请日：2012-07-04
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ASO TAKAHIRO , TONEGAWA KYO
IPC分类号： C09J201/02 , C09J7/02 , C09J11/04 , C09J11/06 , C09J175/16 , C09J183/07 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide: an adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed without adhesive deposit by the application of light even after having undergone a high-temperature process at a temperature of 200°C or higher; an adhesive tape using the adhesive compound; and a wafer treatment method using the adhesive compound.SOLUTION: The adhesive compound contains a photocurable adhesive component, a photopolymerization initiator, inorganic fine particles having an average particle diameter of 0.05-3 μm, and urethane acrylate oligomer.
摘要翻译：要解决的问题：提供：具有高初始粘合力的粘合剂化合物，可以将被粘物牢固地固定就位，并且即使在经过高温处理后的温度下也可以通过施加光而容易地除去粘合剂沉积为200℃以上; 使用粘合剂的胶带; 以及使用粘合剂的晶片处理方法。胶粘剂化合物含有光固化性粘合剂成分，光聚合引发剂，平均粒径为0.05〜3μm的无机微粒和氨基甲酸酯丙烯酸酯低聚物。

13. 发明专利

JP2013213206A Transparent substrate treatment method, and pressure-sensitive adhesive for transparent substrate treatment 有权
标题翻译：透明基板处理方法和用于透明基板处理的压敏粘合剂
公开(公告)号：JP2013213206A
公开(公告)日：2013-10-17
申请号：JP2013044419
申请日：2013-03-06
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： TONEGAWA TORU , ASO TAKAHIRO
IPC分类号： C09J5/06 , C09J4/02 , C09J7/02 , C09J183/07
摘要： PROBLEM TO BE SOLVED: To provide a transparent substrate treatment method, capable of surely protecting a transparent substrate by a support plate and easily peeling the support plate by irradiation with light even after a treatment step of performing a treatment accompanied by heating to 150°C or higher, and to provide a pressure-sensitive adhesive for transparent substrate treatment which can be used for the transparent substrate treatment method.SOLUTION: A transparent substrate treatment method includes: a support plate fixing step of fixing a transparent substrate to a support plate through a pressure-sensitive adhesive for transparent substrate treatment; a transparent substrate treatment step of performing a treatment accompanied by heating to 150°C or higher on the surface of the transparent substrate fixed to the support plate; and a support plate peeling step of irradiating the transparent substrate after the treatment with light to harden the pressure-sensitive adhesive for transparent substrate treatment, and peeling the support plate from the transparent substrate. The pressure-sensitive adhesive for transparent substrate treatment includes an adhesive component, a photopolymerization initiator, and a silicone compound having a functional group crosslinkable with the adhesive component.
摘要翻译：要解决的问题：提供一种透明基板处理方法，即使在进行了加热至150℃的处理步骤的处理步骤之后，也能够通过支撑板确保保护透明基板，并且通过照射轻易剥离支撑板以上，并且提供可用于透明基板处理方法的透明基板处理用粘合剂。解决方案：透明基板处理方法包括：将透明基板固定到支撑板上的支撑板固定步骤用于透明基板处理的压敏粘合剂; 透明基板处理步骤，在固定在所述支撑板上的所述透明基板的表面上进行150℃以上的加热处理; 以及支撑板剥离步骤，用光照射所述透明基板，使所述粘合剂硬化，进行透明基板处理，并从所述透明基板剥离所述支撑板。用于透明基板处理的压敏粘合剂包括粘合剂组分，光聚合引发剂和具有可与粘合剂组分交联的官能团的硅氧烷化合物。

14. 发明专利

JP2013157470A Semiconductor component manufacturing method 审中-公开
标题翻译：半导体元器件制造方法
公开(公告)号：JP2013157470A
公开(公告)日：2013-08-15
申请号：JP2012017029
申请日：2012-01-30
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： SUGITA TAIHEI , ASO TAKAHIRO , TONEGAWA KYO
IPC分类号： H01L21/56 , C09J5/00 , C09J7/02 , C09J11/06 , C09J201/00 , H01L25/04 , H01L25/18
CPC分类号： H01L24/96 , H01L21/568 , H01L2924/181 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor component which allows easy detachment of a support substrate after encapsulation by a molding resin.SOLUTION: In a manufacturing method of a semiconductor component 6 in which a plurality of semiconductor chips 1 are mounted on a support substrate 2 via a double-sided adhesive tape 3 and the support substrate 2 and the double-sided adhesive tape 3 are detached by irradiation of light from the support substrate 2 side of the semiconductor component 6 encapsulated by an encapsulation resin 5, the double-sided adhesive tape 3 includes: a gas-generating agent-containing photo-curing adhesive layer 32 which contains a gas-generating agent that generates gas by irradiation of light, and which is arranged on a base material 31 on the side to be adhered to the support substrate 2; and a high-cross-linkage low-polarity photo-curing adhesive layer 33 which has a degree of cross-linkage of 70-90% and a surface polarity of 45 dyn/cmor less, and which is arranged on the base material 31 on the side to be adhered to the semiconductor chip 1.
摘要翻译：要解决的问题：提供一种半导体部件的制造方法，其能够通过模制树脂封装后容易地分离支撑基板。解决方案：在其中安装有多个半导体芯片1的半导体部件6的制造方法中通过双面胶带3和支撑基板2和双面胶带3在支撑基板2上的照射被从由密封树脂5包封的半导体部件6的支撑基板2侧照射，双面胶带3包括：含气体发生剂的光固化粘合剂层32，其含有通过照射产生气体的气体发生剂，并且其布置在侧面的基材31上粘附到支撑基板2上; 以及交联度为70〜90％，表面极性为45dyn / cm以下的高交联性低极性光固化粘合剂层33，并且配置在基材31上要粘附到半导体芯片1的一侧。

15. 发明专利

JP2012197324A Inorganic fine particle dispersion paste 审中-公开
标题翻译：无机细颗粒分散膏
公开(公告)号：JP2012197324A
公开(公告)日：2012-10-18
申请号：JP2011059383
申请日：2011-03-17
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： MIYAZAKI HIROKO , YAMAUCHI KENJI , YAMANAKA ISAO , ASO TAKAHIRO
IPC分类号： C08L33/06 , C08K3/00 , C08K5/00 , C08K5/053 , C08K5/09 , C08L93/04
摘要： PROBLEM TO BE SOLVED: To provide an inorganic fine particle dispersion paste in which the unevenness of the surface at printing can be controlled, and that has an excellent sintering capability.SOLUTION: The inorganic fine particle dispersion paste is used for a printing process and includes: a (meth)acryl resin; a rosin containing at least 40 wt.% of abietic acid having a decahydronaphthalene backbone shown by the formula (1); an organic solvent; and an inorganic fine particle.
摘要翻译：要解决的问题：提供可以控制印刷时的表面不均匀性并且具有优异的烧结能力的无机微粒分散浆料。解决方案：无机细颗粒分散膏用于印刷方法，包括：（甲基）丙烯酸树脂; 含有至少40重量％具有式（1）所示的十氢萘主链的松香的松香; 有机溶剂; 和无机细颗粒。版权所有（C）2013，JPO＆INPIT

16. 发明专利

JP2012140558A Inorganic particle dispersion paste composition 审中-公开
标题翻译：无机颗粒分散膏组合物
公开(公告)号：JP2012140558A
公开(公告)日：2012-07-26
申请号：JP2011000832
申请日：2011-01-05
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ASO TAKAHIRO , INAOKA MIKI , YAMAUCHI KENJI , MIYAZAKI HIROKO , SUGITA TAIHEI
IPC分类号： C08L33/08 , C08K3/00 , C09D11/02 , C09D11/033 , C09D11/037 , C09D11/322 , C09D11/324 , C09D11/326 , C09D11/38 , C09D11/52 , C09D17/00 , C09K11/02 , C09K11/59 , C09K11/78 , H01L31/0224 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an inorganic particle dispersion paste composition having a high viscosity, being excellent in screen printability and dispense printability, and being capable of being fired at a low temperature.SOLUTION: The inorganic particle dispersion paste composition includes a gelatinous particle containing a crosslinking (meth)acrylic resin, an inorganic microparticle, and an organic solvent, wherein the gelatinous particle containing a crosslinking (meth)acrylic resin is obtained by swelling a resin microparticle containing ≥70 wt.% of the crosslinking (meth)acrylic resin with the organic solvent, and the particle diameter of the resin microparticle containing ≥70 wt.% of the crosslinking (meth)acrylic resin is ≤10 μm; and the crosslinking (meth)acrylic resin is a copolymer having a segment originated from a monofunctional (meth)acrylic monomer and a segment originated from a polyfunctional (meth)acrylic monomer.
摘要翻译：要解决的问题：提供一种具有高粘度，优异的丝网印刷性和分配印刷性并且能够在低温下烧制的无机颗粒分散糊组合物。解决方案：无机颗粒分散糊组合物包括含有交联（甲基）丙烯酸树脂，无机微粒和有机溶剂的凝胶状颗粒，其中含有交联（甲基）丙烯酸树脂的凝胶状颗粒通过溶胀交联（甲基）丙烯酸树脂含有有机溶剂≥70重量％的树脂微粒，交联（甲基）丙烯酸树脂含有≥70重量％的树脂微粒的粒径≤10μm; 交联（甲基）丙烯酸树脂是具有源自单官能（甲基）丙烯酸单体的链段和源自多官能（甲基）丙烯酸类单体的链段的共聚物。版权所有（C）2012，JPO＆INPIT

17. 发明专利

JP2011122129A Inorganic fine particle dispersed paste composition 审中-公开
标题翻译：无机细颗粒分散的糊剂组合物
公开(公告)号：JP2011122129A
公开(公告)日：2011-06-23
申请号：JP2010070149
申请日：2010-03-25
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： INAOKA MIKI , ASO TAKAHIRO , YAMAUCHI KENJI , MIYAZAKI HIROKO , SUGITA TAIHEI
IPC分类号： C09D11/00 , C08F220/10 , C09D7/12 , C09D133/00 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide an inorganic fine particle dispersed paste composition having high viscosity, excellent printability or dispense printability and capable of being fired at a low temperature. SOLUTION: The inorganic fine particle dispersed paste composition contains a gelated particle containing a cross-linked (meth)acrylic resin, the inorganic fine particle and an organic solvent. The gelated particle containing the cross-linked (meth)acrylic resin is swelled with the organic solvent, has ≤10 μm particle diameter and the cross-linked (meth)acrylic resin is a copolymer having a segment orienting in a single functional (meth)acrylic monomer and a segment originating in a multi-functional (meth)acrylic monomer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高粘度，优异的可印刷性或分配印刷性并能够在低温下烧制的无机细颗粒分散糊剂组合物。解决方案：无机细颗粒分散糊组合物含有含有交联（甲基）丙烯酸树脂，无机细颗粒和有机溶剂的凝胶化颗粒。含有交联的（甲基）丙烯酸树脂的凝胶化颗粒与有机溶剂一起膨胀，粒径≤10μm，交联的（甲基）丙烯酸树脂是具有单官能（甲基）丙烯酸系单体的链段取向的共聚物，丙烯酸类单体和源自多官能（甲基）丙烯酸类单体的链段。版权所有（C）2011，JPO＆INPIT

18. 发明专利

JP2011066134A Silver paste for forming solar battery silver electrode, solar battery element, and solar battery module 审中-公开
标题翻译：用于形成太阳能电池银电极，太阳能电池元件和太阳能电池模块的银浆
公开(公告)号：JP2011066134A
公开(公告)日：2011-03-31
申请号：JP2009214592
申请日：2009-09-16
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： HIRAIKE HIROYUKI , YAMAUCHI KENJI , MORIGUCHI SHINTARO , ASO TAKAHIRO , MIYAZAKI HIROKO
IPC分类号： H01L31/04 , H01B1/22
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide silver paste for forming a solar battery silver electrode of which the silver paste contains silver grains having high dispersion properties to enable formation of wiring with a high aspect ratio and is superior in storage stability, and to provide a solar battery element and a solar battery module manufactured by using the silver paste for forming the solar battery silver electrode. SOLUTION: The silver paste for forming the solar battery silver electrode contains sliver grains, a polyvinyl acetal resin, a glass frit, and an organic solvent. The polyvinyl acetal resin content is 0.1 to 5 wt.%, the silver grain content is 70 to 95 wt.%, and the glass frit content is 0.1 to 5 wt.%. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于形成银膏的银浆，其中银膏含有具有高分散性能的银颗粒以能够形成具有高纵横比的布线并且具有优异的储存稳定性，并且对于提供通过使用用于形成太阳能电池银电极的银膏制造的太阳能电池元件和太阳能电池模块。解决方案：用于形成太阳能电池银电极的银糊包含纱条，聚乙烯醇缩醛树脂，玻璃料和有机溶剂。聚乙烯醇缩醛树脂含量为0.1〜5重量％，银粒子含量为70〜95重量％，玻璃料含量为0.1〜5重量％。版权所有（C）2011，JPO＆INPIT

19. 发明专利

JP2014053623A Processing method of wafer 有权
标题翻译： WAFER的处理方法
公开(公告)号：JP2014053623A
公开(公告)日：2014-03-20
申请号：JP2013211215
申请日：2013-10-08
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： TONEGAWA KYO , ASO TAKAHIRO , UEDA KOZO , YABUGUCHI HIROHIDE
IPC分类号： H01L21/02 , C09J11/06 , C09J201/00 , H01L21/683
CPC分类号： C30B33/00 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C30B29/06 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
摘要： PROBLEM TO BE SOLVED: To provide a processing method of wafer for processing a wafer while being fixed to a support plate via an adhesive composition, in which high production efficiency is achieved.SOLUTION: A processing method of wafer includes a support plate fixing step for fixing a wafer to a support plate via an adhesive composition containing an adhesive component, and a gas generating agent generating gas when being irradiated with UV ray, a wafer processing step for processing the wafer fixed to the support plate, and a support plate peeling step for peeling the support plate from the wafer by irradiating the wafer thus processed with UV ray thereby generating gas from the gas generating agent. In the support plate peeling step, the wafer is irradiated with spot-like or linear UV ray having irradiation intensity of 100 mW/cmor more so as to scan the whole surface.
摘要翻译：要解决的问题：提供一种通过经过粘合剂组合物固定到支撑板上的晶片加工方法，该粘合剂组合物实现了高生产效率。解决方案：晶片的加工方法包括：支撑板固定步骤，用于通过含有粘合剂组分的粘合剂组合物将晶片固定到支撑板上，以及当用紫外线照射时产生气体的气体发生剂，用于处理固定到支撑板上的晶片的晶片加工步骤和支撑板剥离步骤用于通过用紫外线照射如此处理的晶片从而从晶片剥离支撑板，从而从气体发生剂产生气体。在支撑板剥离工序中，利用具有100mW / cm 2以上的照射强度的斑点状或线状的紫外线照射晶片，以扫描整个表面。

20. 发明专利

JP2014019790A Adhesive composition, adhesive tape and processing method of wafer 审中-公开
标题翻译：胶粘组合物，胶粘带和加工方法
公开(公告)号：JP2014019790A
公开(公告)日：2014-02-03
申请号：JP2012159782
申请日：2012-07-18
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
发明人： ASO TAKAHIRO , TONEGAWA KYO
IPC分类号： C09J183/04 , C09J7/02 , C09J11/04 , C09J11/06 , C09J133/14 , C09J175/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having necessary and sufficient initial adhesive force to fix an adherend and easily peeling off without an adhesive residue even after a high-temperature processing of 200°C or more, and to provide an adhesive tape using the adhesive composition and a processing method of wafer using the adhesive composition.SOLUTION: An adhesive composition contains a silicone adhesive and a fumed silica having an average particle diameter of 0.05 to 3 μm.
摘要翻译：要解决的问题：为了提供具有必要且足够的初始粘合力的粘合剂组合物以固定被粘物，并且即使在200℃以上的高温处理之后也容易剥离而没有粘合残留物，并且提供使用粘合剂组合物和使用粘合剂组合物的晶片的处理方法。溶液：粘合剂组合物含有硅氧烷粘合剂和平均粒径为0.05〜3μm的热解法二氧化硅。

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