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121. 发明专利

JP2013501081A Flame retardant thermoplastic elastomer 有权
公开(公告)号：JP2013501081A
公开(公告)日：2013-01-10
申请号：JP2012521924
申请日：2009-07-31
申请人：ダウグローバルテクノロジーズエルエルシー
发明人：タイ，シアンヤン , ヤオ，ウェイグアン , キ，ユドン , チェン，ジン , エフ．イートン，ロバート
IPC分类号： C08L101/00 , C08K3/22 , C08K5/521 , H01B3/00 , H01B3/28 , H01B3/30 , H01B7/295
CPC分类号： C08L75/08 , C08G18/4238 , C08G18/4854 , C08G77/04 , C08K3/0058 , C08K3/016 , C08K3/22 , C08K5/0066 , C08K5/523 , C08L23/0853 , C08L31/04 , C08L75/06 , C08L2666/04 , C08L2666/06
摘要：本開示は、熱可塑性エラストマーと金属水和物及びオリゴマーリン酸エステルから成る難燃剤とを含む組成物を提供する。金属水和物のオリゴマーリン酸エステルに対する重量比は、１．４５：１より大きい。本組成物は、被覆ワイヤー又は被覆ケーブルなどの物品の成分であり得、この場合は該被覆物中に本組成物が存在する。

122. 发明专利

JP5114882B2 Ceramic composite material and a method for producing the resin, as well as the composite material sheet, film capacitor and a multilayer capacitor 有权
公开(公告)号：JP5114882B2
公开(公告)日：2013-01-09
申请号：JP2006187444
申请日：2006-07-07
申请人：株式会社村田製作所
发明人：隆平松
IPC分类号： C08L101/00 , C08J3/205 , C08K3/22 , H01B3/00 , H01G4/12 , H01G4/20 , H01G4/30

123. 发明专利

JP2012255116A Electrical insulating material and high voltage equipment using the same 有权
标题翻译：使用电绝缘材料和高压设备
公开(公告)号：JP2012255116A
公开(公告)日：2012-12-27
申请号：JP2011129747
申请日：2011-06-10
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： MATSUMOTO KEIKI , OTAKE ATSUSHI , TAKEUCHI MASAKI
IPC分类号： C08L63/00 , C08K3/00 , C08K9/04 , C08L21/00 , H01B3/00 , H01B3/40
CPC分类号： H01B3/40
摘要： PROBLEM TO BE SOLVED: To provide an electrical insulating material excellent in crack resistance properties without deteriorating the properties of an insulating resin in a solid insulation system, and to provide high voltage equipment using the same.SOLUTION: An electrical insulating material includes: an epoxy resin; a curing agent; and an elastomer particle and an inorganic particle as an additive material, wherein the elastomer particle is radiation cross-linked. There is provided high voltage equipment such as a transformer, a circuit breaker, a motor, and an inverter, in which this electrical insulating material is applied at a site requiring an electrical insulation of electrical equipment.
摘要翻译：要解决的问题：为了提供耐裂纹性优异的电绝缘材料，而不会劣化固体绝缘系统中的绝缘树脂的性能，并提供使用该绝缘材料的高压设备。电解绝缘材料包括：环氧树脂; 固化剂; 弹性体粒子和无机粒子作为添加剂材料，其中弹性体粒子是辐射交联的。提供了诸如变压器，断路器，电动机和逆变器的高压设备，其中这种电绝缘材料被施加在需要电气设备电绝缘的场所。版权所有（C）2013，JPO＆INPIT

124. 发明专利

JP5105657B2 Prepreg and laminate 有权
公开(公告)号：JP5105657B2
公开(公告)日：2012-12-26
申请号：JP2000113154
申请日：2000-04-14
申请人：三菱瓦斯化学株式会社
发明人：雅一茂木 , 勝之水野 , 孝昌中井 , 憲永井
IPC分类号： C08J5/24 , C08G73/00 , C08K3/00 , C08K3/22 , C08K3/24 , C08L63/00 , C08L63/04 , C08L79/00 , H01B3/00 , H01B3/30 , H01B3/40 , H01B17/56 , H05K1/03

125. 发明专利

JP2012253167A Thermally conductive insulation sheet, metal base substrate and circuit board 审中-公开
标题翻译：导热绝缘片，金属基底板和电路板
公开(公告)号：JP2012253167A
公开(公告)日：2012-12-20
申请号：JP2011123971
申请日：2011-06-02
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： MIYATA KENJI , YAMAGATA TOSHITAKA
IPC分类号： H05K1/05 , B32B9/00 , H01B3/00 , H01L23/12 , H01L23/373 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive insulation sheet exhibiting excellent insulation and heat dissipation, and to provide a metal base substrate and a circuit board.SOLUTION: On one or a plurality of longitudinally oriented sheets 4 where hexagonal boron nitrides 2 are oriented in the thickness direction, one or a plurality of laterally oriented sheets 3 where hexagonal boron nitrides 2 are oriented in the width direction or the length direction are laminated to produce a thermally conductive insulation sheet 1. Total thickness of the longitudinally oriented sheets 4 is set thicker than the total thickness of the laterally oriented sheets 3. In addition, the thermally conductive insulation sheet 1 and a conductive layer are laminated, in this order, on a metal base material so that the laterally oriented sheet 3 is disposed on the conductor layer side thus obtaining a metal base substrate. Furthermore, a metal base circuit board is produced by processing the conductor layer of the metal base substrate.
摘要翻译：要解决的问题：提供一种绝缘性和散热性优异的导热绝缘片，提供金属基底基板和电路基板。解决方案：在六方硼氮化物2沿厚度方向取向的一个或多个纵向取向片材4上，一个或多个横向取向片材3，其中六角形氮化硼2沿宽度方向或长度方向层叠以制造导热绝缘片1.纵向取向片材4的总厚度被设定为比横向取向片材3的总厚度厚。此外，导热绝缘片材1和导电层被层压，在金属基材上，使横向取向片3配置在导体层侧，得到金属基底。此外，通过处理金属基底基板的导体层来制造金属基底电路板。版权所有（C）2013，JPO＆INPIT

126. 发明专利

JP5104086B2 Complex clusters and complex crystals, as well as the dielectric constant adjusting agent and a conductive material, including these 有权
公开(公告)号：JP5104086B2
公开(公告)日：2012-12-19
申请号：JP2007185749
申请日：2007-07-17
申请人：学校法人北里研究所
发明人：顕子堀
IPC分类号： C07C49/92 , C07F1/08 , C07F15/00 , H01B1/12 , H01B3/00

127. 发明专利

JP5087819B2 Resin composition, method for producing a laminate, circuit board and wiring board 有权
公开(公告)号：JP5087819B2
公开(公告)日：2012-12-05
申请号：JP2005103566
申请日：2005-03-31
申请人：住友ベークライト株式会社
发明人：範行大東
IPC分类号： H01B3/44 , B32B15/08 , B32B27/00 , C08F299/00 , C08K3/36 , C08K5/10 , C08L45/00 , C08L63/00 , H01B3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excelling in an electric characteristic and adhesiveness when forming a resin layer of a wiring board; to provide a layered product excelling in machinability; to provide a wiring board excelling in an electric characteristic; and to provide its manufacturing method. SOLUTION: This resin composition constitutes an insulation layer of a wiring board and is characterized by containing a cyclic olefin-based resin and a compound having a polymerizable double bond or triple bond. In the resin composition, the compound having a polymerizable double bond or triple bond has a group selected from an aryl group, a vinyl group, a (meth)acrylic group, an ethynyl group and a phenylethynyl group. In the resin composition, the compound having a polymerizable double bond or triple bond has two or more epoxy groups in each molecule thereof. This layered product is used for a wiring board and characterized by being composed by stacking a resin layer formed of the resin composition and a carrier film. This wiring board is characterized by having a resin layer formed by using the layered product. COPYRIGHT: (C)2007,JPO&INPIT

128. 发明专利

JP2012232892A Dielectric ceramic composition and ceramic electronic component 有权
标题翻译：电介质陶瓷组合物和陶瓷电子元件
公开(公告)号：JP2012232892A
公开(公告)日：2012-11-29
申请号：JP2012141898
申请日：2012-06-25
申请人： Tdk Corp , Tdk株式会社
发明人： KOMATSU KAZUHIRO , HOSHI YOICHIRO , YOSHIKAWA SHUHEI , SUEDA YUICHIRO
IPC分类号： C04B35/468 , H01B3/00 , H01B3/12 , H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a dielectric ceramic composition which exhibits good properties even when a dielectric layer is made thin.SOLUTION: The dielectric ceramic composition contains, as a main component, a compound having a perovskite type crystal structure represented by BaTiO, and contains, as subsidiary components, in terms of respective elements with respect to 100 moles of the compounds, 0.6-2.0 moles of an oxide of Mg, 0.010-0.6 mole of an oxide of Mn and/or Cr, 0.010-0.2 mole of an oxide of at least one selected from V, Mo and W, 0.10-1.0 mole of an oxide of R1 (R1 is at least one selected from Y, Yb, Er and Ho), 0.10-1.0 mole of an oxide of R2 (R2 is at least one selected from Dy, Gd and Tb), and 0.2-1.5 moles of a component comprising an oxide of Ba and/or an oxide of Ca and an oxide of Si.
摘要翻译：要解决的问题：为了提供即使当电介质层变薄时也表现出良好性能的电介质陶瓷组合物。解决方案：介电陶瓷组合物以BaTiO 3 为代表的具有钙钛矿型晶体结构的化合物作为主要成分，含有作为辅助成分的术语的相应元素相对于100摩尔化合物，0.6-2.0摩尔Mg的氧化物，0.010-0.6摩尔的Mn和/或Cr的氧化物，0.010-0.2摩尔的选自V的至少一种的氧化物，Mo和W为0.10-1.0摩尔的R1的氧化物（R1为选自Y，Yb，Er和Ho中的至少一种），0.10-1.0摩尔的R2的氧化物（R2为选自Dy， Gd和Tb）和0.2-1.5摩尔包含Ba的氧化物和/或Ca的氧化物和Si的氧化物的组分的组分。版权所有（C）2013，JPO＆INPIT

129. 发明专利

JP5060137B2 Ceramic paste for the ceramic green sheet, the ceramic green sheet and a multilayer ceramic capacitor 有权
公开(公告)号：JP5060137B2
公开(公告)日：2012-10-31
申请号：JP2007026932
申请日：2007-02-06
申请人：積水化学工業株式会社
发明人：幸和佃 , 健晴森田 , 弘司福井
IPC分类号： C04B35/622 , C04B35/632 , H01B3/00 , H01G4/12
摘要： PROBLEM TO BE SOLVED: To provide a ceramic paste for a ceramic green sheet which is excellent in sheet strength even if it is thinned and characterized in that the sheet attack phenomenon does not occur when it is coated with a conductive paste. SOLUTION: The ceramic paste for the ceramic green sheet contains resin components comprising a binder resin and a curable resin which starts curing reaction by the irradiation with light and/or heating, a curing agent for initiating the curing reaction by the irradiation with light and/or heating, a ceramic powder, and a solvent. The difference between the solubility parameters of the binder resin and the curable resin which starts the curing reaction by the irradiation with light and/or heating is ≤0.8, and the content of the curable resin is 10-80 wt.% based on the total resin components. COPYRIGHT: (C)2008,JPO&INPIT

130. 发明专利

JP5060121B2 Low melting glass dispersed paste, and a method of manufacturing a plasma display panel 有权
公开(公告)号：JP5060121B2
公开(公告)日：2012-10-31
申请号：JP2006343417
申请日：2006-12-20
申请人：積水化学工業株式会社
发明人：泰享家田 , 健司山内 , 宏至平池 , 慎太郎森口 , 弘司福井
IPC分类号： C08L29/14 , C03C8/16 , C08F16/38 , C08K3/40 , C08L29/04 , H01B3/00 , H01J9/02 , H01J11/22 , H01J11/34 , H01J11/36 , H01J11/38 , H01J11/42

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