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111. 发明专利

JPS5793535A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5793535A
公开(公告)日：1982-06-10
申请号：JP16955580
申请日：1980-12-03
申请人： HITACHI LTD
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L21/52 , H01L21/58 , H01L23/50
摘要： PURPOSE:To increase the securing strength of a semiconductor pellet by forming a chemical nickel plating layer on the surface secured with the pellet and securing a lead frame through a solder. CONSTITUTION:A pellet 14 is secured through a solder 17 onto the tab 12 of a lead frame. A chemical nickel plating layer 19 is merely formed at the side secured with the pellet 14. Thus, it can eliminate the metal such as expensive Au, can provide good wettability with the solder, and the securing of the tab to the pellet can be rigidly performed.

112. 发明专利

JPS5662342A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5662342A
公开(公告)日：1981-05-28
申请号：JP13765979
申请日：1979-10-26
申请人： HITACHI LTD
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L23/08 , H01L23/495 , H01L23/50
摘要： PURPOSE:To improve the heat dissipating effect and airtightness by simultaneously fusing a plated layer of gold formed on the surface of a lead frame and a metal layer so formed on the inner surface of upper and lower caps as to react with gold in a amorphous manner. CONSTITUTION:A lead frame 10 is formed from a deformed strip and a plated layer 14 of gold, silver or tin on the surface thereof. A metal layer 19 is formed on the inner surface of upper and lower caps composing a cavity package in such a manner as to react with the plated layer 14 of a low-melting point metal, gold, silver or tin in an amorphous manner. The lead frame 10 and the upper and lower caps 17 and 18 are fused together to package.

113. 发明专利

JPS564260A ELECTRONIC DEVICE 失效
公开(公告)号：JPS564260A
公开(公告)日：1981-01-17
申请号：JP7920479
申请日：1979-06-25
申请人： HITACHI LTD
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To improve the transfer of generated heat to a package sealed up with resin, by shaping the cross section of a tab hanger lead constituting a lead frame and the cross section of a lead on a part sealed up with resin, as U or V to increase the effective cross-sectional area. CONSTITUTION:A lead frame is composed of a tab 10 whereon a semiconductor pellet 16 is mounted, a tab hanger lead 8, an electrode lead 9, etc. The lead 9 is connected through a coupling wire 15 to the pad 14 of the pellet 16 secured on the tab 10 and is sealed up with resin to manufacture an electronic device to make a package. Flat flanges 13 are provided on the top of each of the leads 8, 9. The cross section of each lead is shaped as U or V. The tab 10 and the bottom of each lead are located at the same height. The flanges 13 are located higher than the tab 10. As a result, heat from the pellet 16 is efficiently transferred to the package and the wires 15 are located so high that a short circuit or the like does not occur.

114. 发明专利

JPS55154757A SMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME 失效
公开(公告)号：JPS55154757A
公开(公告)日：1980-12-02
申请号：JP6261479
申请日：1979-05-23
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： H01L23/34 , H01L21/60 , H01L23/28 , H01L23/50
摘要： PURPOSE:To eliminate shortcircuit of a semiconductor by fixing a semiconductor pellet onto a tab forming a lead frame, and integrating in advance the inner ends of a plurality of lead wires with the lower surface of the tab into a body with insulating reinforcing material when bonding the electrode terminal to the lead wires with wires. CONSTITUTION:A semiconductor pellet 5 is fixed onto a tab 4 of a lead frame provided with a tab 4 having a tab lead wire 2 and a plurality of lead wires 6, and an electrode terminal provided thereat is bonded to the respective lead wires 6 with wires 7. Then, when the pellet 5 is molded with the inner end portion of the lead wires 6 approaching the pellet 5 with resin 8, resin reinforcing material 12 having preferable insulating and thermal conductivity is integrally coated on the inner end of the lead wires 6 and the lower surface of the tab 4 before bonding. In this manner, exact bonding can be executed to avoid improper shortcircuit of the semiconductor.

115. 发明专利

JPS55113349A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55113349A
公开(公告)日：1980-09-01
申请号：JP1983079
申请日：1979-02-23
申请人： HITACHI LTD
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L23/28 , H01L23/31 , H01L23/433 , H01L23/492 , H01L23/495
摘要： PURPOSE:To prevent the occurrence of cracks by providing arc-shaped notches on a substrate and thereby scattering the stress exerted on the resin when a semiconductor element is connected on a metal substrate and the element including a part of the substrate is molded by resin. CONSTITUTION:Semiconductor element 2 is fixed on metal substrate 1, made of copper and having screw hole 5. A molded body is formed by molding resin 3 covering the side and front surfaces of substrate 1 and element 2. In this structure, a plurality of notches 9 are formed near element 2 on substrate 1, and molding is operated by injecting resin here. By this, stress F exerted on resin 3 from substrate 1 is sustained by a part of notches 9, and thereby stress F is dispersed and there is no concetration of stress. As a result, no crack occurs in resin 3.

116. 发明专利

JPS5565450A RESINNMOLD TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5565450A
公开(公告)日：1980-05-16
申请号：JP13787878
申请日：1978-11-10
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI
IPC分类号： H01L23/34 , H01L23/12 , H01L23/28 , H01L23/48
摘要： PURPOSE:To improve the humidity resistance of a device, by providing on the upper side of the header on which a semiconductor pellet is to be mounted vertically cut grooves arranged along the edges of a mold part. CONSTITUTION:A plurality of V-shaped grooves 17 are placed on both sides of the place of mounting pellet 16 on header 15, made of metal of good heat conductivity. Next, in addition to these, on one side, L-shaped groove 18, which has vertical wall 20 and slanting wall 21, is cut on the edge of mold part 19 to be provided on this. On the other side, by cutting header 15, slanted surface 22 is formed. Subsequently, lead 24 is connected to the electrode of pellet 16 via wire 25. Lead 24 is projected outward, and mold part 19, which covers pellet 16 and wire 25, is formed on header 15. By this, mold part 19 is prevented from shifting, and no deterioration in the element characteristics occurs.

117. 发明专利

JPS54149579A Pellet bonding method 失效
标题翻译：泡沫粘结方法
公开(公告)号：JPS54149579A
公开(公告)日：1979-11-22
申请号：JP5762578
申请日：1978-05-17
申请人： Hitachi Ltd
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L21/52 , H01L21/58
CPC分类号： H01L24/29 , H01L24/27 , H01L24/32 , H01L24/743 , H01L2224/32245 , H01L2224/83101 , H01L2224/83805 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01014 , H01L2924/00
摘要： PURPOSE: To reduce preparatory processes, to spread uniformly metal foil right under a pellet, and to prevent the formation of the void, by making an eutectic connection of the pellet onto the metal foil, which changes into an eutectic, bonded on the entire surface of a lead frame.
CONSTITUTION: On lead frame 5 with both sides plated with Ag, metal foil 7, as an eutectic, clad with Au 12 and Ag 11 is amounted, and resistance welding is done by upper electrode 13 and lower electrode 15 so as to bond the entire surface of metal foil 7 to lead frame 5. Next, semiconductor pellet 10 is mounted on metal foil 7 and pressure is applied over a vibration to form an Au-Si eutectic layer, thereby attaining bonding. Consequently, preparatory processes of correcting the curvature of metal foil 7 are reduced in number, the metal foil spreads uniformly right under pellet 10, and no void is formed at the bonded part.
COPYRIGHT: (C)1979,JPO&Japio
摘要翻译：目的：为了减少制备过程，将金属箔均匀地均匀地均匀地散布在颗粒下方，并且通过将颗粒共晶连接在金属箔上，该金属箔变成共晶，结合在整个表面上的引线框架。构成：在两面镀有Ag的引线框架5上，以Au 12和Ag 11包覆金属箔7作为共晶体，并且通过上部电极13和下部电极15进行电阻焊接，从而将整个接着，将金属箔7安装在金属箔7上，通过振动施加压力，形成Au-Si共晶层，从而形成接合。因此，修正金属箔7的曲率的准备过程数量减少，金属箔在颗粒10下均匀地均匀扩散，并且在接合部分没有形成空隙。

118. 发明专利

JPS5486273A STEM AND ITS MANUFACTURE 失效
公开(公告)号：JPS5486273A
公开(公告)日：1979-07-09
申请号：JP15292177
申请日：1977-12-21
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： H01L23/48
摘要： PURPOSE:To reduce parts in number by protruding a lead frame from one side surface of a header and folding it at its middle part allowing terminal part of each lead of the frame to face the circuit-element fitting part closely and the other terminal to protrude toward the side over the head. CONSTITUTION:A copper plate with a thick part and thin part is punched to form thick header part 14 and thin lead frame part 15. In this case, header part 14 is shaped in a square and fitting grooves 16 are provide to center parts of both edges; and two-step support part 17 extending upward is formed at one side of this groove 16 and junction cut-in groove 18 with frame part 15 is formed at its tip. On the other hand, thick link part 19 is elongated from the opposite side to support part 17 encircling fitting groove 16 of header part 14 and its tip is connected to internal frame 20 of frame part 15. Further, longitudinal frame 22 of frame part 15 is provided with alternative path 25 protruding from header part 14 and each lead 23 is curved as it approches the internal frame with its tip made to face the center part of the frame.

119. 发明专利

JP2003249619A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003249619A
公开(公告)日：2003-09-05
申请号：JP2003081023
申请日：2003-03-24
申请人： HITACHI LTD
发明人： MIYAKI YOSHINORI , SUZUKI HIROMICHI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve reliability and standardize a lead frame. SOLUTION: A semiconductor device comprises a plurality of inner leads 1b extending on the periphery of a semiconductor chip 2, a tape substrate 5 supporting the chip 2 and bonded to the ends of the inner leads 1b, wires connecting a pad and the inner leads 1b formed on the main face 2c of the semiconductor chip 2, a sealing portion formed by sealing the chip 2 and the wires, and a plurality of outer leads continuing to the inner leads 1b and projected from the sealing part to the four-directional outside. Since the relationship of the short side length (a) of the chip 2 and the clearance (b) of the chip 2 of the inner lead 1b whose edge portion is most remote from the chip 2 is a≤2b, a narrow pad pitch can be achieved, the small chip 2 can be mounted, and the standardization of the lead frame can be achieved. COPYRIGHT: (C)2003,JPO

120. 发明专利

JP2002329830A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：JP2002329830A
公开(公告)日：2002-11-15
申请号：JP2002128666
申请日：2002-04-30
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： KAJIWARA YUJIRO , SUZUKI KAZUNARI , TSUBOSAKI KUNIHIRO , SUZUKI HIROMICHI , MIYAKI YOSHINORI , NAITO TAKAHIRO , KAWAI SUEO
IPC分类号： H01L23/50 , H01L21/48 , H01L21/52 , H01L21/60 , H01L23/495
摘要： PROBLEM TO BE SOLVED: To facilitate precise positioning of a semiconductor chip in a bonding position or appearance inspection after positioning. SOLUTION: In a semiconductor integrated circuit device wherein the outside dimensions of a die pad 3 as chip placement portion are larger than the outside dimensions of the semiconductor chip 2, V-grooves (or projections) 22 are formed on part of suspending leads 4 for supporting the die pad at equal intervals. The V-grooves 22 are used as graduations during positioning or appearance inspection. Precise positioning of the semiconductor chip 2 or appearance inspection in an appearance inspection process subsequent to positioning is carried out by making good use of the V-grooves 22.

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