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101. 发明专利

JP2005238308A Solder supply device 有权
标题翻译：焊接设备
公开(公告)号：JP2005238308A
公开(公告)日：2005-09-08
申请号：JP2004054725
申请日：2004-02-27
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： MATSUSHITA KOTARO
IPC分类号： B23K3/06
摘要： PROBLEM TO BE SOLVED: To provide a solder supply device excellent in reproducibility of setting a needle position and a tilt angle, in which they can be easily reset even after they are set once and then are released.
SOLUTION: Rectilinear scales 23 and 28 are attached to a supporter rod 18 freely displaceably supported by a supporting base member 17, and to a needle holder 10 freely displaceably supported by a holder guide 26, respectively. An angular scale 33 is attached to a coupling arm 31 coupling the supporter rod 18 and the holder guide 26 freely turnably. An indicator needle 34 pointing the angular scale 33 is formed on the holder guide 26. An initial setting of a position and tilt angle of a needle 9 is reproduced by the respective scales 23, 28 and 33.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在设置针位置和倾斜角的再现性方面优异的焊料供给装置，即使在一次设置一次然后被释放之后它们也可以容易地重置。解决方案：直线标尺23和28分别附接到支撑杆18，支撑杆18可自由移动地由支撑基部构件17支撑，并且分别连接到由保持器引导件26可自由移位地支撑的针保持器10。角度刻度33附接到联接臂31，联接臂31可自由转动地联接支撑杆18和保持器引导件26。指示角度刻度33的指示针34形成在保持器引导件26上。针9的位置和倾斜角度的初始设置由相应的刻度23,28和33再现。（C） 2005年，JPO＆NCIPI

102. 发明专利

JP2005230861A Solder feeding apparatus 审中-公开
标题翻译：焊机送料装置
公开(公告)号：JP2005230861A
公开(公告)日：2005-09-02
申请号：JP2004043390
申请日：2004-02-19
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： MIYAMA TOMOAKI , MATSUSHITA KOTARO
IPC分类号： B23K3/06 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain a solder feeding apparatus having superior setting reproducibility in which a needle position, an inclined angle and the like can be easily reset after the setting is released.
SOLUTION: A scale 23 is marked on a supporting rod 18 which is held in a freely displaceable manner on a holding base material 17 while a scale 28 is also marked on a needle holder 10 which is held in a freely displaceable manner on a holder guide 26. Setting the position of the supporting rod 18 and the needle holder 10 with these scales 23, 28 facilitates the resetting after the earlier setting is once released. In addition, a pin 38 and a pin hole 39 are provided by which a first and second connecting members 31, 32 connecting the supporting rod 18 to the holder guide 26 are freely separated from each other and engaged with each other at the time of connection. As a result, by merely connecting both the connecting members 31, 32, the needle 9 is positioned at a prescribed inclined angle.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得具有优异的设置再现性的焊料馈送装置，其中在释放设置之后，可以容易地重置针位置，倾斜角度等。解决方案：标尺23标记在支撑杆18上，支撑杆18以可自由移动的方式保持在保持基材17上，而标尺28也标记在针保持器10上，针保持器10以可自由移位的方式保持在保持器引导件26.利用这些标尺23,28来设置支撑杆18和针保持器10的位置有助于在较早的设置被释放之后进行复位。此外，销38和销孔39设置成将支撑杆18连接到保持器引导件26的第一和第二连接构件31,32彼此自由地分离并且在连接时彼此接合。结果，通过仅连接两个连接部件31,32，针9被定位在规定的倾斜角度。版权所有（C）2005，JPO＆NCIPI

103. 发明专利

JP2004344920A Iron tip cleaning device for soldering iron 审中-公开
公开(公告)号：JP2004344920A
公开(公告)日：2004-12-09
申请号：JP2003143863
申请日：2003-05-21
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： MIZOGUCHI SHINJI
IPC分类号： B23K3/08 , B23K3/02
摘要： PROBLEM TO BE SOLVED: To surely peel off and remove solder chips deposited on the iron tip of a soldering iron from the iron tip while preventing the generation of oxides.
SOLUTION: The iron tip cleaning device for the soldering iron has a box-shaped cleaner case 2 provided with an insertion port 10 for inserting the iron tip 1a of the soldering iron 1, an injection nozzle 3 for injecting a gas toward the iron tip 1a of the soldering iron 1, and a gas feeding device 4 for feeding a compressed gas to the injection nozzle 3. An inert gas such as a nitrogen gas is fed to the injection nozzle 3 from the gas feeding device 4.
COPYRIGHT: (C)2005,JPO&NCIPI

104. 发明专利

JP3590320B2 Soldering method and apparatus 有权
公开(公告)号：JP3590320B2
公开(公告)日：2004-11-17
申请号：JP2000066596
申请日：2000-03-10
申请人：株式会社ジャパンユニックス
发明人：田貞二小
IPC分类号： B23K3/06 , B23K1/00 , B23K31/02 , B23K101/36 , H05K3/34

105. 发明专利

JP2004276081A Cleaning device for soldering iron bit 有权
公开(公告)号：JP2004276081A
公开(公告)日：2004-10-07
申请号：JP2003072502
申请日：2003-03-17
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： KYODA NORIHISA
IPC分类号： B23K3/02
摘要： PROBLEM TO BE SOLVED: To attain a cleaning device for a soldering iron bit which does not pollute working environment by scattering hot solder waste outside together with air, does not cause a burn to an operator, and is sanitary and excellent in safety.
SOLUTION: The cleaning device for solder iron bit comprises a cleaner part 1 which peels off the solder waste adhering to the bit of the solder iron 5 by air jet from a jet nozzle 4 and collects it, a vacuum part 2 which sucks and cleans the air inside the cleaner part 1 and exhausts it outside, and a first air source 3 to supply the air to the jet nozzle 4. The vacuum part 2 comprises an ejector 31 to generate negative pressure in a suction mouth 36 by supplying high velocity air stream to an input mouth 45 and a switching valve 32 to open and close an air passage between the input mouth 45 of the ejector 31 and a second air source 49, and the suction mouth 36 of the ejector 31 is connected to the cleaner part 1 via a suction hose 6.
COPYRIGHT: (C)2005,JPO&NCIPI

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