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    • 101. 发明专利
    • Dicing sheet with protective film forming layer and method for fabricating semiconductor chip
    • 具有保护膜形成层的表和用于制造半导体芯片的方法
    • JP2013120839A
    • 2013-06-17
    • JP2011267990
    • 2011-12-07
    • Lintec Corpリンテック株式会社
    • SHINODA TOMONORIKOYAKATA MASAHIROTAKANO TAKESHI
    • H01L21/301C09J7/02
    • PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property.SOLUTION: A dicing sheet comprises a protective film forming layer 4 on an adhesive layer of an adhesive sheet 3 consisting of a base film 1 and the adhesive layer 2, the protective film forming layer is formed on an inner perimeter of the adhesive sheet, and the adhesive layer is exposed to an outer perimeter of the adhesive sheet. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours, is -1 to +1%.
    • 要解决的问题:为了提供具有高均匀度的保护膜形成层的切割片,可以容易地制造具有良好打印精度的保护膜的半导体芯片,并且具有耐热性。 解决方案:切割片在由基膜1和粘合剂层2组成的粘合片3的粘合剂层上包括保护膜形成层4,保护膜形成层形成在粘合剂的内周上 并且粘合剂层暴露于粘合片的外周。 基膜的熔点超过130℃,或者基膜不具有熔点,在130℃加热2小时的基膜的热收缩率为-1〜+ 1%。 版权所有(C)2013,JPO&INPIT
    • 103. 发明专利
    • Moisture-sensitive adhesive force-variable adhesive agent composition, and its use
    • 水敏性粘合剂可变粘合剂组合物及其用途
    • JP2013104054A
    • 2013-05-30
    • JP2011251061
    • 2011-11-16
    • Lintec Corpリンテック株式会社
    • SAKABE EIKOSATO AKINORI
    • C09J201/00C09J5/00C09J7/02C09J9/00C09J171/02H01L21/304
    • PROBLEM TO BE SOLVED: To provide an adhesive agent composition and an adhesive sheet, which have a sufficient adhesive force in a normal state, can be controlled in the adhesive force by a simple means, and is reduced in the adhesive agent residue on an adherend after being peeled off.SOLUTION: The moisture-sensitive adhesive force-variable adhesive agent composition contains 100 pts.mass of an adhesive polymer, and 0.01 to 15 pts.mass of a polyalkylene glycol glycidyl ether (meth)acrylate, wherein the ratio B/A×100 (%) of the adhesive force A to a silicone wafer mirror surface after left to stand in a 23°C and 50 %RH environment for 30 min and the adhesive force B to a silicone wafer mirror surface after left to stand in a 60°C and 90 %RH environment for 2 hours is in the range of 3 to 70%.
    • 待解决的问题:通过简单的手段,可以通过简单的手段将具有足够粘合力的粘合剂组合物和粘合片在正常状态下进行控制,并减少粘合剂残留物 被剥离后的被粘物上。 < P>解决方案:水分敏感性粘合力变量粘合剂组合物含有100份粘合剂聚合物和0.01至15份聚亚烷基二醇缩水甘油醚(甲基)丙烯酸酯,其中B / A 在23℃,50%RH环境下放置30分钟后,将硅胶晶片反射镜表面的粘合力A×100(%)粘贴在聚硅氧烷晶片镜面上, 60℃和90%RH环境下2小时在3至70%的范围内。 版权所有(C)2013,JPO&INPIT
    • 105. 发明专利
    • Roll protector, roll holder and roll storage method
    • 滚筒保护器,滚动支架和滚筒存储方法
    • JP2013095470A
    • 2013-05-20
    • JP2011239466
    • 2011-10-31
    • Lintec Corpリンテック株式会社
    • WAKAYAMA YOJITSUCHIYAMA SAYAKANEZU YUSUKE
    • B65D59/02B65D85/672B65H75/14
    • PROBLEM TO BE SOLVED: To provide a roll protector for preventing wrinkles of a film member wound around a roll, peeling or the like of laminated members, and to provide a roll holder, and a method of storing the roll.SOLUTION: The roll protector 1 includes: a first base plate 10 fitted in contact with one end face side of the roll 40 formed by winding a film member 42 around a core material 41; a second base plate 20 fitted in contact with the other end face side of the roll 40; and a support part 30 connecting the first base plate 10 and the second base plate 20 and resisting to a force to be applied from the first base plate 10 and the second base plate 20 to the lateral inside of the roll 40 when the first base plate 10 and the second base plate 20 are fitted to the roll 40.
    • 要解决的问题:提供一种用于防止缠绕在卷上的薄膜构件的褶皱,层压构件的剥离等的辊保护器,以及提供辊保持器以及存储该辊的方法。 解决方案:辊保护器1包括:第一基板10,其与通过将膜构件42卷绕在芯材41上而形成的辊40的一个端面侧接触; 与辊40的另一端面相接触的第二底板20; 以及支撑部30,其将第一基板10和第二基板20连接,并且当第一基板和第二基板20抵抗从第一基板10和第二基板20向辊40的侧向内侧施加的力时 10和第二基板20安装在辊40上。版权所有(C)2013,JPO&INPIT
    • 106. 发明专利
    • Tamper-proof label
    • 防篡改标签
    • JP2013076768A
    • 2013-04-25
    • JP2011215455
    • 2011-09-29
    • Lintec Corpリンテック株式会社
    • KAWADA TOMOHITOONO YOSHITOMOINAO YOICHI
    • G09F3/03B32B7/12C08G18/10G09F3/10
    • PROBLEM TO BE SOLVED: To provide a tamper-proof label which has an excellent adhesive force and cannot be easily peeled because of the difficulty in making a trigger to peel the label after being pasted and, even after being peeled, can prevent concealment of the fact that the label has been peeled, because allowing this fact to be easily found.SOLUTION: The tamper-proof label includes a substrate and an adhesive layer. The substrate has a thickness of 0.5 to 5.0 μm, the adhesive layer has a thickness of 0.7 to 9.0 μm, and the tamper-proof label has a thickness of 1.2 to 12.0 μm.
    • 要解决的问题:为了提供具有优异粘合力的防篡改标签,并且由于在粘贴之后难以使触发器剥离标签而难以剥离,并且即使在剥离之后也可以防止 隐藏标签被剥离的事实,因为允许这个事实被容易地找到。 解决方案:防篡改标签包括基材和粘合剂层。 基板的厚度为0.5〜5.0μm,粘合剂层的厚度为0.7〜9.0μm,防干扰标签的厚度为1.2〜12.0μm。 版权所有(C)2013,JPO&INPIT
    • 108. 发明专利
    • Resin film-forming sheet for chip and method for manufacturing semiconductor device
    • 用于芯片的树脂成膜片及制造半导体器件的方法
    • JP2013075951A
    • 2013-04-25
    • JP2011215379
    • 2011-09-29
    • Lintec Corpリンテック株式会社
    • WAKAYAMA YOJISHIZUHATA HIRONORI
    • C09J7/02C09J11/04C09J11/06C09J201/00H01L21/322
    • PROBLEM TO BE SOLVED: To provide a semiconductor device capable of imparting gettering performance without such a special treatment that it increases numbers of processes in semiconductor wafer and chip processing, and it also makes processing troublesome.SOLUTION: A resin film-forming sheet for chips includes a support sheet and a resin film-forming layer made on the support sheet, wherein the resin film-forming layer has a gettering agent (A), a binder polymer component (B) and a curing component (C). The gettering agent (A) includes a metal compound. In resin film-forming layer after Ar sputtering (sputtering condition: accelerating voltage of 4 kV, sputtering region: 2×2 mm, sputtering time: 600 s), when measured by X-ray photoelectron spectroscopy, the total concentration of the same type of metallic elements as a metallic element of the metal compound constituting the gettering agent (A) is ≥2.0 mol%.
    • 要解决的问题:提供能够赋予吸气性能而不进行特殊处理的半导体器件,其增加半导体晶片和芯片处理中的工艺数量,并且还使处理变得麻烦。 解决方案:用于切屑的树脂成膜片包括支撑片和在支撑片上制成的树脂膜形成层,其中树脂成膜层具有吸气剂(A),粘合剂聚合物成分( B)和固化组分(C)。 吸气剂(A)包括金属化合物。 在Ar溅射(溅射条件:4kV的加速电压,2×2mm,溅射时间:600μs)后的树脂膜形成层中,当通过X射线光电子能谱测定时,相同类型的总浓度 作为构成吸气剂(A)的金属化合物的金属元素的金属元素为≥2.0摩尔%。 版权所有(C)2013,JPO&INPIT
    • 109. 发明专利
    • Sheet sticking apparatus and sticking method, and sheet manufacturing apparatus and manufacturing method
    • 板材制造装置和制造方法及其制造装置和制造方法
    • JP2013074100A
    • 2013-04-22
    • JP2011211951
    • 2011-09-28
    • Lintec Corpリンテック株式会社
    • ISHIHARA TAKASHI
    • H01L21/683
    • PROBLEM TO BE SOLVED: To allow an unnecessary sheet to be successfully peeled and an adhesive sheet to be successfully stuck, even for the adhesive sheet having an arc portion and a straight portion in a tip end and a rear end in a delivering direction.SOLUTION: A sheet sticking apparatus 10 comprises: delivery means 14 for delivering a master roll RS in which a belt-like sheet WS is tentatively adhered to a belt-like peeling sheet RL; cutting means 15 for forming a notch CU having an arc shape in the belt-like sheet WS to form an adhesive sheet AS inside the notch CU and to form an unnecessary sheet US outside the notch CU; and a peeling plate 18 for peeling the adhesive sheet AS from an initial stage peeling region (a tip end in a delivering direction) Sa. The cutting means 15 is provided so as to form a strip-like notch St at a position continuous with the notch CU of the initial stage peeling region in the unnecessary sheet US to form a strip portion TS.
    • 要解决的问题:即使对于具有弧形部分和直线部分的粘合片在前端和后端中的输送中,为了允许成功地剥离不必要的片材并且粘合剂片材被成功地粘贴, 方向。 纸张粘贴装置10包括:传送装置14,用于传送主辊RS,其中带状片材WS临时粘附到带状剥离片材RL; 切割装置15,用于在带状片材WS中形成具有弧形的凹口CU,以在凹口CU内形成粘合片AS,并在凹口CU外部形成不必要的片材US; 以及剥离板18,用于剥离粘合片AS从初始阶段剥离区域(输送方向的前端)Sa。 切割装置15设置成在与不需要的纸张US中的初始阶段剥离区域的凹口CU连续的位置处形成条状切口St,以形成条带部分TS。 版权所有(C)2013,JPO&INPIT
    • 110. 发明专利
    • Housing case
    • 住房案例
    • JP2013069335A
    • 2013-04-18
    • JP2012278251
    • 2012-12-20
    • Lintec Corpリンテック株式会社
    • OKAMOTO NAOYA
    • G06K19/00A47F5/00B42D15/10G06K17/00G06K19/07G06K19/077
    • PROBLEM TO BE SOLVED: To provide a housing case capable of being used on a wireless tag reading tool that can accurately read information on each of wireless tags of plural articles with wireless tags used for article management and the like attached thereto.SOLUTION: A housing case for an article having a metal film on its surface is composed of a bag obtained by bending a resin sheet or hard resin upper and bottom covers. A wireless tag mounting part is provided at an edge or in the vicinity of an edge of the housing case. The housing case includes housing position control means for preventing the article having the metal film on its surface from moving to and overlapping with the wireless tag mounting part in the housing case.
    • 要解决的问题:提供一种能够在无线标签读取工具上使用的外壳,其能够利用附加到其上的物品管理等的无线标签,精确地读取多个物品的无线标签的每个无线标签上的信息。 解决方案:用于在其表面具有金属膜的制品的外壳由通过弯曲树脂片或硬树脂上盖和底盖获得的袋组成。 无线标签安装部设置在壳体的边缘的边缘或附近。 壳体包括壳体位置控制装置,用于防止其表面上的金属膜的物品移动到壳体中的无线标签安装部分并与其重叠。 版权所有(C)2013,JPO&INPIT