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    • 91. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
    • JPS5821363A
    • 1983-02-08
    • JP11761081
    • 1981-07-29
    • MATSUSHITA ELECTRIC IND CO LTD
    • MATSUZAWA AKIRAINOUE MICHIHIRO
    • H01L21/70H01L21/331H01L21/761H01L21/822H01L27/04H01L29/73H01L29/8605
    • PURPOSE:To obtain the titled IC having high density by a method wherein an epitaxial layer is pinched by using an isolating diffusing layer from the upper section of a wafer and changed into a high resistor, and a collector and a load resistance can be unified to a transistor using the epitaxial layer as the collector. CONSTITUTION:B Is is diffused to a p type substrate, a reserve isolating layer 22 is formed and the epitaxial layer 23 is stacked. B Is diffused from the upper section of the n layer 23, and the isolating layers 24A are shaped, and connected to the layer 22. A p layer 24B is formed at the same time, and an n layer 25 is diffused while surrounding the layer 24B, used as both ends of the resistor and connected to wiring metals 29. That is, high resistance is shaped by employing the epitaxial layer as the resistor and positioning the p layer 24B in the epitaxial layer 23. The depth of the p layer 24B is made approximately half the epitaxial layer 23 and the high resistance value of approximately twice as high as when using epitaxial layer itself, the potential of the epitaxial layer is made considerably higher than the substrate, or remarkably high resistance value is acquired when the epitaxial layer is brought to low concentration and depletion layer diffuses to the epitaxial layer. According to this constitution, the resistor can be formed with high density without increasing processes.
    • 93. 发明专利
    • Semiconductor device
    • 半导体器件
    • JPS5771164A
    • 1982-05-01
    • JP14783180
    • 1980-10-22
    • Fujitsu Ltd
    • YAMAUCHI TSUNENORI
    • H01L27/04H01L21/822H01L29/8605
    • H01L29/8605
    • PURPOSE:To make a high-resistor element with a small occupied are by an N-P-N transistor process by a method wherein a one conductivity-type and high-concentration layer is diffused to reverse conductivity-type epitaxial layer provided on a substrate with the one conductivity-type from the position deviated in the transverse direction of the substrate side and the surface side. CONSTITUTION:After forming a P type impurity region 18 used as a diffusion source from a substrate side by ion implantation on a P type substrate 11 by an isolation region formation process, an N type epitaxial layer 12 is grown and the implantation region is simultaneously diffused upwards. Next, a P diffusion layer 13A is formed on the surface of the layer 12 at the position alternatively offset from the diffusion layer 18 by a process diffusing a P layer 13 demarcating the isolation region. Next, electrodes 16, 17 are provided by forming an N region 14 on the layer 12 by a collector contact formation process, for example and a nearly U- shaped N type resistor layer is formed between the electrodes 16, 17. In this way, effective length of resistor can be increased comparing with normal pinch resistor and resistor element having a high resistance value can be made with a small area.
    • 目的:通过NPN晶体管工艺制造具有较小占用面积的高电阻元件,其中将一个导电型和高浓度层扩散到具有一个电导率的基板上提供的反向导电型外延层的方法 型从基板侧的横向偏离的位置和表面侧。 构成:通过隔离区域形成工艺在P型衬底11上通过离子注入从衬底侧形成用作扩散源的P型杂质区18后,生长N型外延层12,同时扩散注入区 向上。 接下来,通过扩散划分隔离区域的P +层13的工艺,在与扩散层18交替偏移的位置的层12的表面上形成P +扩散层13A。 接下来,例如通过集电极接触形成工艺在层12上形成N +区14来提供电极16,17,并且在电极16,17之间形成大致U形的N型电阻层。 这样,与普通的夹持电阻器相比,电阻器的有效长度可以增加,并且可以以小的面积进行具有高电阻值的电阻器元件。
    • 94. 发明专利
    • Resistance element and its manufacture
    • 电阻元件及其制造
    • JPS5732663A
    • 1982-02-22
    • JP10853880
    • 1980-08-04
    • Mitsubishi Electric Corp
    • TORII YUTAKA
    • H01L27/04H01L21/822H01L27/01H01L29/8605
    • H01L29/8605
    • PURPOSE:To obtain a high resistor stably in excellent reproducibility even by a minute occupying area by putting an insulating film with an opening section between conductive layers and forming a resistance film, which can contact with the upper and lower conductive layers, in the opening section. CONSTITUTION:Nitrogen ions are injected to the surface of a semiconductor layer 2 and the sections where aluminum electrodes are formed are nitrified before shaping aluminum electrodes 4, 4'. When ions with 40KeV energy and of the amount of N doped in 1X10 pcs./cm are injected, the surfaces of the semiconductor layer 2 are nitrified, the silicon nitride films 7 with approximately 100-200Angstrom thickness are formed to the surfaces, and the silicon nitride films 7 function as the high resistors.
    • 目的:即使通过在导电层之间放置具有开口部分的绝缘膜并且在开口部分中形成可与上部和下部导电层接触的电阻膜,即使通过微小的占据面积也能以优异的再现性稳定地获得高电阻 。 构成:在形成铝电极4,4'之前,将氮离子注入到半导体层2的表面,并且形成有铝电极的部分被硝化。 当注入具有40KeV能量和在1×10 17 / cm 2中掺杂的N +的量的离子时,半导体层2的表面被硝化,氮化硅膜7具有大约100-200A 厚度形成在表面上,氮化硅膜7用作高电阻。
    • 95. 发明专利
    • FORMATION OF RESISTANCE FOR INTEGRATED CIRCUIT
    • JPS56158465A
    • 1981-12-07
    • JP6191580
    • 1980-05-09
    • HITACHI LTD
    • KUDOU HIROYUKIMAKINO JIYUNICHIMIYAGAWA NOBUAKI
    • H01L27/04H01L21/822H01L29/8605
    • PURPOSE:To accurately control the resistance value or the ratio of the resistance value and enable to change the characteristics of the circuit having the same function for subject resisting material by a method wherein the shape of a diffusion mask is partially changed in proportion to the resistance value within the prescribed diffused resistance formed region. CONSTITUTION:For instance, in order to obtain the circuit having a different gain in the amplifying circuit consisting of an arithmetic operational amplifier A, resistors Ri, Rf and Rg, the resisting material for which the resistance value of Rf is formed by having the same Ri, for example. The resisting material to be used for the circuit is formed by providing the diffusing region of a reverse conductive type in an isolated island, but the diffusing region is limited within the fixed range when the resistance value is to be changed and the patterning of the diffusion mask is performed by making a partial change on it. To be more precise, the length l1 section in a resistance layer, consisting of width w0 and length l0, for example, is changed to a narrower width w1, a diffusion layer is provided within the region of the length l0 in a Z-shape and the width w1 is changed (l1 is also changed). Through these procedures, the resistance material having a different resistance value and a resitance ratio can be controllably formed and also this can be applied to the circuit having different characteristics.