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    • 98. 发明专利
    • Resin composition for low-shrinking molding
    • 用于低收缩成型的树脂组合物
    • JPS5747335A
    • 1982-03-18
    • JP12237680
    • 1980-09-05
    • Hitachi Ltd
    • ISHII TAKEOOGATA MASAJI
    • C08F20/00C08F20/52C08F26/00C08F220/52C08F226/06C08F299/00C08J9/04
    • PURPOSE: The titled composition that comprises a specific maleimide, a triarylisocyanurate, a polymerization initiator, a foaming agent and a filler, thus showing high heat resistance, mechanical properties and electrical properties.
      CONSTITUTION: To a mixture consisting of (A) 100pts.wt. of at least one of maleimides selected from N-substituted maleimides of formula I (R
      1 is monovalent organic group) such as N-phenylmaleimide, N,N'-bismaleimides of formula II (R
      2 is divalent organic group) such as N,N'-4,4-diphenylmethanebismaleimide and polyphenylmethylene)polymaleimides of formula III (n is 1W5) and of, (B) preferably 30W300pts. of, a triarylisocyanurate, are added (C) 0.1W5wt% of a polymerization initiator such as dicumylperoxide, (D) 0.5W10wt% of a foaming agent such as azodicarbonamide, (E) 10W75vol% of a filler such as calcium carbonate and, when necessary, (F) other additives.
      COPYRIGHT: (C)1982,JPO&Japio
    • 目的:包含特定的马来酰亚胺,三芳基异氰脲酸酯,聚合引发剂,发泡剂和填料的标题组合物,因此具有高耐热性,机械性能和电性能。 构成:对(A)100pts.wt。 的选自式I的N-取代的马来酰亚胺(R1是一价有机基团)的马来酰亚胺中的至少一种,例如N-苯基马来酰亚胺,式II的N,N'-双马来酰亚胺(R2是二价有机基团)如N,N' -4,4-二苯基甲烷双马来酰亚胺和聚苯亚甲基)聚马来酰亚胺(n为1-5),(B)优选为30-300pts。 (C)0.1-5重量%的聚合引发剂如二枯基过氧化物,(D)0.5-10重量%的发泡剂如偶氮二酰胺,(E)10-75体积%的填料如钙 碳酸盐和必要时(F)其他添加剂。