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    • 99. 发明专利
    • Frit glass for cerdip
    • CERDIP的玻璃
    • JPS59152242A
    • 1984-08-30
    • JP1612883
    • 1983-02-04
    • Toshiba Corp
    • KOBAYASHI KEIJI
    • C03C3/14C03C8/10H01L23/02H01L23/10H01L23/12
    • PURPOSE: The titled glass capable of being bonded to copal and alumina in high yield, consisting of glass having a coefficient of linear thermal expansion between those of copal and alumina, softening point of ≤ a specific temperature, and ≤ specific value of OH group content.
      CONSTITUTION: Frit glass having a coefficient of thermal expansion of glass between those of copal and alumina, ≤400°C softening point, and ≤500ppm OH group content in the glass, being fluidized at low temperature, capable of bonding glass to copal and alumina, useful for bonding containers housing semiconductor. When IC package is sealed using this glass, it can be bonded to copal and alumina at ≤400°C low temperature in high yield without causing cracks, packages having high reliability can be prepared, yield of elements housed in them is raised by about 10%.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:能够以高产率与粘结剂和氧化铝结合的标题玻璃,由玻璃构成,玻璃具有在反应物和氧化铝之间的线性热膨胀系数,软化点<=特定温度,和<= OH的比值 组内容 构成:在玻璃中的玻璃与玻璃之间的玻璃的热膨胀系数在玻璃中的<400℃软化点和<= 500ppm的OH基含量在玻璃中的热膨胀系数在低温下流化,能够将玻璃粘合 椰子和氧化铝,用于粘结容纳半导体的容器。 当使用这种玻璃密封IC封装时,可以在<= 400摄氏度低温下高收率地将其接合到氧化铝和氧化铝上,而不会产生裂纹,可以制备具有高可靠性的包装,其中容纳的元件的产量由 约10%。
    • 100. 发明专利
    • Glass composition for sealing
    • 玻璃组合物密封
    • JPS5918132A
    • 1984-01-30
    • JP12764582
    • 1982-07-23
    • Iwaki Glass Kk
    • SEKI HIROSHIISHII ATSUMIIWAI TAKASHI
    • C03C3/074C03C3/16C03C8/10C03C8/24H01L23/10
    • PURPOSE: To prepare a glass composition for sealing, having excellent water- resistance, acid-resistance and electrical insulation, and low dielectric constant, by mixing powder of glass having low melting point, powder of refractory having low thermal expansion, and powder of ceramic having high strength at specific ratios.
      CONSTITUTION: The objective mixture composition is composed of (A) 55W75% of the powder of glass having low melting point and composed of 74W87% of PbO, 6W15% of B
      2 O
      3 , 0.5W6.5% of ZnO, 0.3W3.0% of SiO
      2 , 0.1W3.0% of V
      2 O
      5 , 0W4% of CuO, 0W7% of Bi
      2 O
      3 , and 0W2% of SnO
      2 , (B) 24W44% of the powder of refractory having low thermal expansion and selected from cordierite, β-eucryptite and β-spodumene, and (C) 0.3W20% of the powder of ceramic having high strength and selected from alumina, spinel, titanium oxide, and other oxides. It exhibits sufficient fluidity at a temperature of as low as ≤430°C, gives a hermetic sealing to alumina, metallic lead wire, etc. with high strength and excellent thermal shock resistance, and has excellent water-resistance, acid resistance and insulation, and low dielectric constant.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过混合具有低熔点的玻璃粉末,具有低热膨胀性的耐火材料粉末和陶瓷粉末制备密封玻璃组合物,具有优异的耐水性,耐酸性和电绝缘性以及低介电常数 具有特定比例的高强度。 构成:目标混合物组成由(A)55-75%的低熔点玻璃粉末组成,由74%至87%的PbO,6-15%的B2O3,0.5-6.5%的ZnO,0.3 -3.0%的SiO 2,0.1-3.0%的V 2 O 5,0-4%的CuO,0-7%的Bi 2 O 3和0-2%的SnO 2,(B)24-44% 膨胀并选自堇青石,β-锂辉石和β-锂辉石,(C)0.3-20%的高强度陶瓷粉末,选自氧化铝,尖晶石,氧化钛等氧化物。 它在低于<= 430℃的温度下表现出足够的流动性,对氧化铝,金属引线等进行气密密封,具有高强度和优异的耐热冲击性,并且具有优异的耐水性,耐酸性和 绝缘和低介电常数。