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    • 94. 发明专利
    • MANUFACTURE OF ELECTRODE ACTIVE MATERIAL HOLDING SUBSTRATE
    • JPH11288724A
    • 1999-10-19
    • JP9047398
    • 1998-04-02
    • MITSUBISHI MATERIALS CORP
    • HOSHINO KOJIMAYUZUMI YOSHIYUKIWAKITA SABURO
    • H01M4/70H01M4/80
    • PROBLEM TO BE SOLVED: To enhance the connecting strength to prevent peeling in sintering by temporarily sintering a green sheet formed of a metal slurry obtained by mixing a foaming agent to a metal powder to form a temporarily sintered body, and sticking this temporarily sintered body to a reinforcing metal plate followed by main sintering to connect the both. SOLUTION: A mixed slurry 1 obtained by mixing nickel powder, a binder and a plasticizer to a solvent is formed into a sheet to form a green sheet 2, and the green sheet 2 is foamed to form a porous foamed sheet 3. The foamed sheet 3 is temporarily sintered at 800-900 deg.C to form a temporarily sintered body 4, which is then put on a reinforcing metal plate 5 to form an integrated base 6. A weight 7 is put thereon, and a main sintering is performed at 1,000-1,200 deg.C in 5% hydrogenous nitrogen. Consequently, the temporarily sintered body 4 is made into a porous sintered metal plate 8 and bonded to the reinforcing metal plate 5 to form an integrated active material holding substrate 9. According to this, the temporarily sintered body 4 is bonded to the reinforcing metal plate 5 by surface contact, and hardly peeled with a high bonding strength.