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    • 1. 发明专利
    • THERMAL HEAD
    • JPS63242654A
    • 1988-10-07
    • JP7777887
    • 1987-03-31
    • SONY CORP
    • YAGINO MASANORIITOU MICHIENDO TETSUOISHIKAWA OSAMU
    • B41J2/335
    • PURPOSE:To improve the contact characteristic of a platen, to widen a recording printing width and to perform high-speed, high-quality printing, by integrally bonding a pair of thermal heads each formed by providing a membrane layer composed of polycrystalline silicon on a substrate and forming a heat generating resistor and a drive circuit part on the same substrate and performing thermal recording by the side surface of the integrated thermal head on the heat generating resistor forming side thereof. CONSTITUTION:A thermal head is constituted by integrally bonding a pair of thermal head chips 10, 10 each constituted by forming a heat generating resistor 2 and a drive circuit part 3 on a substrate through an insulating adhesive 11 so as to allow the heat generating resistors 2, 2 to oppose to each other. The substrate 1 is polished in a curved surface shape on the side of the side end surface 1a thereof and the end surface of the adhesive 11 facing to the side end surface 1a is used as a slide surface in thermal recording and thermal recording paper 12 is pressed and held by a platen 13 to perform thermal recording. The active layer 3c constituting a membrane transistor of the heat generating resistor 2 and the drive circuit part 3 is constituted of a polycrystalline silicon membrane. The width (l) of the slide surface 16 of the thermal head can be expanded to a large extent and, when predetermined high density printing is desired to be obtained, high-speed printing is possible.
    • 2. 发明专利
    • THERMAL HEAD
    • JPS63182160A
    • 1988-07-27
    • JP1360687
    • 1987-01-23
    • SONY CORP
    • YAGINO MASANORIITOU YOSHITOMOISHIKAWA OSAMUENDO TETSUO
    • B41J2/335B41J2/345B41J2/35
    • PURPOSE:To ensure that the heating value of a heat generating resistor part is greater on the higher side of an inclined recording surface, the surface temperature of the recording surface can be set substantially uniform, the shape of developed color dots on a thermal recording paper can be uniformized and printing quality can be enhanced, by setting the resistance of the heat generating resistor part to be gradually higher in the direction of increasing height of the inclined recording surface. CONSTITUTION:The rear side 1b of a substrate 1 is slantly ground so that it is sloped down toward a front edge and the thickness thereof on a heat generating part 2A is a predetermined value, thereby providing a recording surface 1b1. The heat generating part 2A is located on the front edge side of the substrate 1 at a position where the thickness of the substrate 1 is relatively small due to the presence of the inclination of the back side 1b, so that favorable heat transmission to the recording surface 1b1 is obtained. In addition, the resistance of the part 2A is set to be gradually higher toward the higher side of the inclined recording surface 1b1, so that the heating value is increased in the same direction. Therefore, though the recording surface 1b1 slantly corresponds to the heat generating part 2A, it is substantially uniformly heated, dots can be printed on a thermal recording paper with a fixed developed color density without increasing the electric power inputted to the part 2A, and power efficiency is enhanced.
    • 3. 发明专利
    • THERMAL HEAD
    • JPS6395962A
    • 1988-04-26
    • JP24264986
    • 1986-10-13
    • SONY CORP
    • YAGINO MASANORIITOU YOSHITOMO
    • B41J2/335B41J2/345
    • PURPOSE:To make a device smaller in size and enhance performance or reliability, by a construction wherein at least a part of the side of a substrate opposite to the side on which heat generating resistors with a radiating support plate joined thereto is provided is made to be a slant surface, and is so ground as to leave an abrasion-resistant material layer. CONSTITUTION:A thermal head is so constructed that a semiconductor element 5 is driven by a driving current supplied through a connecting pin 14 to selectively cause heat generating resistors 4A to generate heat, thereby performing thermal recording on the side of the back surface 1b of a substrate 1, namely, on the side of a back surface 3b of an abrasion-resistant material layer 3. An oxidation-resisting layer 6 consisting of Si3N4, SiO2 or the like is provided on the heat generating resistors 4 contributing to thermal printing and on electrodes 13 for transmitting an external signal, and a radiating support plate 15 is joined thereon in a body through an adhesive layer 7 of a low melting point glass or the like provided on the layer 6. The adhesive layer 7 functions not only for adhesion but as a conventional glaze layer.
    • 4. 发明专利
    • THERMAL HEAD
    • JPS6235859A
    • 1987-02-16
    • JP17612685
    • 1985-08-09
    • SONY CORP
    • GOTO SATORUYAGINO MASANORINAKANO YUJIENDO TETSUO
    • B41J2/345B41J2/355B41J2/36
    • PURPOSE:To obtain good image quality generating no blotting of a picture element at the time of high-density printing and not interfered by the density of the adjacent picture element by eliminating the dropouts of picture elements at the time of low-density printing, by providing an auxiliary heat generator element narrower than each main heat generator element between a plurality of main heat generator elements. CONSTITUTION:Because a predetermined drive current is supplied to auxiliary heat generator elements 8, 8 at the time of low-density printing and the auxiliary heat generators 8, 8 generate heat, the temp. characteristic of thermal recording paper in the horizontal direction X comes to the state shown by A and predetermined temp. is kept even at the part corresponding to the space between main heat generator elements 2a, 2b, that is at the space between picture elements and no dropout is generated. At the time of high-density printing, no drive current is supplied to the auxiliary heat generator elements 8, 8 and, because said auxiliary heat generator elements 8, 8 have extremely good heat conductivity, the heat between the main heat generator elements 2a, 2b, that is, between the picture elements is dissipated through said auxiliary heat generator elements 8, 8. Then the temp. characteristic of the thermal recording paper in the horizontal direction X is shown by C with no interference acting between the adjacent main heat generator elements 2a, 2b and the blotting of the picture element is improved without being interfered by the density between adjacent picture elements. Accordingly, printing high quality is obtained.
    • 5. 发明专利
    • INDUCTOR AND MANUFACTURE THEREFOR
    • JPS5840807A
    • 1983-03-09
    • JP13908881
    • 1981-09-03
    • SONY CORP
    • YAGINO MASANORISAITOU SHIYOUSHICHI
    • H01F17/04H01F41/04
    • PURPOSE:To obtain chip inductors of magnetic shield structure with a low cost by a method wherein a square external core having recessed grooves at the center and a square internal core having collar sections at both sides and applying a winding at a barrel section are made and the collar section side of a middle core is inserted while contacting with the inside of the grooves of the external core and an electrode is provided at the end of the opening side of the external core. CONSTITUTION:A plurality of recessed grooves 11 are provided at one face of a magnetic material substrate 10 and conductive layers 12 becoming an electrode section are formed at the projected surface only by the printing baking of Ag paste to compose an external core grooved plate 13. A magnetic plate 14 having the same length of that of the grooves 11 is provided and grooves 15 and 16 are furnished on the both sides, surface and rear, with the same pitch and width and the magnetic plate 14 is cut into many pieces so that the pieces 14 may be engaged with the grooves 11 and middle core blocks 17 are made. Next, a winding 19 is wound on winding guide grooves 18 consisting of these grooves 15 and 16 and a winding block 20 is made. The winding blocks 20 are buried in the grooves 11 to obtain individual inductors 24 by cutting the winding blocks 20 in the right angle direction against the grooves 11 and the windings 19 are connected to the conductive layers 12.
    • 6. 发明专利
    • PREPARATION OF THERMAL HEAD
    • JPS63165156A
    • 1988-07-08
    • JP31615386
    • 1986-12-26
    • SONY CORP
    • YAGINO MASANORIISHIKAWA OSAMUITOU MICHITAKANO TOSHIMITSU
    • B41J2/335
    • PURPOSE:To achieve miniaturization and, at the same time, to improve the contact of a platen and to obtain excellent printing quality, by performing thermal recording on the rear surface side of a surface having a heat generating resistor or a drive circuit part formed thereto. CONSTITUTION:Heat generating resistor patterns 2a, 2b divided into the first half part and the latter half part and a drive circuit part 3 are formed on one plane 1a of an abrasion resistant substrate l and a support heat radiation plate 10 is integrally bonded to the substrate on the sides of the heat generating resistor patterns 2a, 2b and a semiconductive element 3 through an oxidation resistant layer 8 and an adhesive layer 9. The other surface (back surface side) 1b of the substrate 1 becomes a thermal recording surface and the rear surface side 1b thereof is formed into a thin inclined surface 1b1 at the part corresponding to the heat generating part 2A of one heat generating resistor pattern 2a and thermal recording paper (p) is allowed to slide with said inclined surface 1b1 to be pressed and held by a platen P to perform thermal recording to the thermal recording paper (p).
    • 7. 发明专利
    • THERMAL HEAD
    • JPS6371364A
    • 1988-03-31
    • JP21407886
    • 1986-09-12
    • SONY CORP
    • YAGINO MASANORITANIGUCHI MASATOITOU MICHI
    • B41J2/335B41J2/345
    • PURPOSE:To reduce the dimensional restriction of a substrate, to achieve miniaturization, to improve the contact of a platen and to obtain excellent printing quality, by bonding a support heat radiating plate to the substrate on the side of the heat generating resistor thereof and grinding a part of the rear surface of the substrate and performing thermal recording on the ground surface of the substrate. CONSTITUTION:Heat generating resistors 2a, 2b and a semiconductive element 3 are formed on one plane 1a of a substrate 1 and a support heat radiating plate 10 is integrally bonded to the substrate 1 through an oxidation resistant layer 8 and an adhesive layer 9 and a platen 13 is pressed and held to the sliding groove 12 of the platen 13 provided on the side of the back surface 1b of the substrate 1 through thermal recording paper 14 to perform thermal recording on the thermal recording paper 14. The thickness of the substrate 1 can be freely set by regulating the grinding amount of the substrate.
    • 8. 发明专利
    • MEMBRANE THERMAL HEAD
    • JPS62288063A
    • 1987-12-14
    • JP13135286
    • 1986-06-06
    • SONY CORP
    • YAGINO MASANORIENDO TETSUO
    • B41J2/345
    • PURPOSE:To easily cope with diversified kinds of electric elements and to obtain a high quality printed character or image, by bonding a large number of fundamental cells, wherein heat generating resistors and drive circuit parts are formed on the same substrate by utilizing a polycrystalline silicon membrane, to a support heat radiating plate in parallel so as to obtain a predetermined printing width to integrate the same. CONSTITUTION:A polycrystalline silicon membrane, a conductor film and an insulating film are successively laminated to a wafer 30 to serve as a substrate over the entire surface thereof, and heat generating resistor groups 31 and drive circuit parts each comprising a membrane transistor are collectively formed thereon. The heat generating resistor groups 31 are formed at a predetermined pitch so as to be divided at every fundamental cell 1 and further formed in the fundamental cells 1 linearily in parallel. The number of fundamental cells formed on the wafer 30 and the number of the heat generating resistors in the fundamental cells 1 may be set appropriately. Thereafter, the substrate is sliced at the slicing positions shown by dotted lines to cut a large number of fundamental cells 1 each having an almost rectangular shape and the cut cells 1 are inspected and sorted. Good quality fundamental cells 1 are bonded to a support heat radiating plate through adhesive to be integrated to form a membrane thermal head having a predetermined printing width L.
    • 9. 发明专利
    • THIN MEMBRANE THERMAL HEAD
    • JPS62282948A
    • 1987-12-08
    • JP12600286
    • 1986-05-31
    • SONY CORP
    • YAGINO MASANORIHAYASHI HISAO
    • B41J2/335
    • PURPOSE:To achieve super-miniaturization and to enhance mass productivity, by a method wherein a drive circuit part is provided in continuity relation to the connection part provided to the under surface side of a semiconductor substrate through the low resistance part provided to the semiconductor substrate by an ion diffusion method so as to pierce through said substrate. CONSTITUTION:A drive circuit part 3 utilizing a polycrystalline silicon membrane and a heat generating resistor 4 are provided to the upper surface of an N-type Si-substrate 1 through an SiO2 film 2 being an insulating material. The drive circuit part 3 is formed of a membrane transistor having the polycrystalline membrane as an active layer. That is, low resistance N-type regions 5a, 5b doped with a predetermined N-type impurity are formed to both terminal parts of the polycrystalline membrane 5 constituting the drive circuit part 3 and respectively constitute a source region 6 and a drain region 7.
    • 10. 发明专利
    • THIN FILM THERMAL HEAD
    • JPS62220352A
    • 1987-09-28
    • JP6315186
    • 1986-03-20
    • SONY CORP
    • HAYASHI HISAOYAGINO MASANORI
    • B41J2/335B41J2/345
    • PURPOSE:To obtain a thin film thermal head superior in productivity, mass production properties, and production cost, by forming a recording portion on a drive circuit portion through an insulating layer. CONSTITUTION:A drive element portion 11 and a control element portion 21 having a logic circuit are made of a thin film transistor and formed on a planar face of a substrate 1. Moreover, on the drive transistor 11, a heating resistor 25 is formed through an insulating layer 10. In the drive transistor 11, a semiconductor thin film 2 of a polycrystalline silicon thin film is provided with low- resistance n-type areas 2a, 2b doped with a predetermined n-type impurity at the both ends thereof. These n-type areas 2a, 2b respectively form a drain area 3 and source area 4. In the acting condition, the portion between the drain area 3 and the source area 4 in the semiconductor thin film 2 has a channel, thus making an activated layer 2c. In this manner, a large number of head chips can be formed together on the single substrate, which enables the improvement in a productivity and a mass production properties and the remarkable reduction of the production cost.