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1. 发明专利

JP2013023766A Surface treatment method for conductive base material for mounting tape carrier-fitted semiconductor, conductive base material for mounting tape carrier-fitted semiconductor obtained by using the treatment method, and semiconductor package 审中-公开
标题翻译：用于安装带状载体半导体的导电基材的表面处理方法，用于使用处理方法获得的用于安装带状载体的半导体的导电基材和半导体封装
公开(公告)号：JP2013023766A
公开(公告)日：2013-02-04
申请号：JP2011163092
申请日：2011-07-26
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： INOUE FUMIO , YAMASHITA TOMOAKI , HIROYAMA YUKIHISA , SAKAYORI KAZUHIKO
IPC分类号： C23F1/18 , H01L23/12 , H01L23/28 , H01L23/50
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide: a surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor which can improve reliability and adhesive properties with a sealing material; a conductive base material for mounting a tape carrier-fitted semiconductor obtained by using the treatment method; and a semiconductor package obtained by using them.SOLUTION: The surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor includes a first roughening step of bringing a conductive base material for mounting a tape carrier-fitted semiconductor into contact with a first chemical roughening liquid including a corrosion inhibitor to form a roughened shape on the surface of the conductive base material for mounting a semiconductor. The surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor further includes a second roughening step of bringing the same into contact with a second chemical roughening liquid including a corrosion inhibitor after the first roughening step. The conductive base material for mounting a tape carrier-fitted semiconductor is obtained by using the surface treatment. The semiconductor package is obtained by using them.
摘要翻译：要解决的问题：提供一种用于安装带状载体配合半导体的导电性基材的表面处理方法，其能够利用密封材料提高可靠性和粘合性; 用于安装通过使用所述处理方法获得的带状载体配合半导体的导电基材; 以及通过使用它们获得的半导体封装。解决方案：用于安装带状载体安装半导体的导电基材的表面处理方法包括：第一粗糙化步骤，将用于安装载带配合半导体的导电性基材与第一化学粗糙化液接触，所述第一化学粗糙化液包括在用于安装半导体的导电性基材的表面上形成粗糙化形状的腐蚀抑制剂。用于安装带状载体半导体的导电基材的表面处理方法还包括在第一粗糙化步骤之后使其与含有腐蚀抑制剂的第二化学粗糙化液接触的第二粗糙化步骤。通过使用表面处理获得用于安装带状载体配合半导体的导电性基材。通过使用半导体封装。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012082528A Method for treating surface of copper 有权
标题翻译：铜的表面处理方法
公开(公告)号：JP2012082528A
公开(公告)日：2012-04-26
申请号：JP2012021932
申请日：2012-02-03
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： INOUE FUMIO , YAMASHITA TOMOAKI , HIROYAMA YUKIHISA , SAKAYORI KAZUHIKO
IPC分类号： C23C22/52 , H01L23/50
CPC分类号： H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for treating the surface of a conductive base material for semiconductor packaging, which has satisfactory adhesive properties with a sealing material or the like, can suppress deterioration in electrical properties and heat dissipation, can be subjected to low temperature treatment, has excellent productivity, and is hard to be attached with marks such as cracks and rubbing.SOLUTION: The method for treating the surface of copper includes a roughening process of contacting a chemical roughening liquid containing a corrosion inhibitor, sulfuric acid and hydrogen peroxide to form a roughened shape on the surface of copper. The corrosion inhibitor contains 1,2,3-benzotriazole and 5-amino-1H-tetrazole. The method for treating the surface of copper includes a film removing process of removing an organic film formed on the surface in the roughening process, by bringing the organic film into contact with an alkaline solution containing amine and an alkali metal compound selected from sodium hydroxide and potassium hydroxide, after the roughening process.
摘要翻译：解决的问题：为了提供一种用于处理与密封材料等具有令人满意的粘合性能的用于半导体封装的导电性基材的表面的方法，可以抑制电性能和散热的劣化，可以是进行低温处理，生产率优异，难以附着，例如裂纹和摩擦等。解决方案：处理铜表面的方法包括使含有腐蚀抑制剂，硫酸和过氧化氢的化学粗化液体接触在铜表面上形成粗糙形状的粗糙化工艺。腐蚀抑制剂含有1,2,3-苯并三唑和5-氨基-1H-四唑。用于处理铜表面的方法包括通过使有机膜与含有胺和碱金属化合物的碱性溶液接触来除去在粗糙化工艺中在表面上形成的有机膜的膜去除方法，所述碱性溶液选自氢氧化钠和碱金属化合物，氢氧化钾，经过粗糙化处理。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2006316300A Method for surface-treating copper, and copper surface 审中-公开
标题翻译：表面处理铜和铜表面的方法
公开(公告)号：JP2006316300A
公开(公告)日：2006-11-24
申请号：JP2005138403
申请日：2005-05-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ITO TOYOKI , INOUE FUMIO , SHIMIZU AKIRA , YAMASHITA TOMOAKI , MATSUURA MASAHARU , INOUE YASUO , NAKASO AKISHI
IPC分类号： C23C28/04 , C23C28/00 , H01L23/14
CPC分类号： H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method for surface-treating copper, which secures adhesion strength between a copper surface and an insulation layer without forming unevenness exceeding 1 μm on the copper surface, and improves the reliability for insulation between arranged wires without deteriorating reliability for a chip, and to provide the copper surface. SOLUTION: The method for surface-treating copper comprises the steps of: oxidizing the copper surface; and then treating the surface with a liquid which includes at least one compound selected from between silica glass and a compound containing a ladder structure shown by the general formula (1): (wherein R each independently represents a group selected from among a hydrogen atom, a reactive group, a hydrophilic group and a hydrophobic group), and includes 200 mg/L or less alkali metal ions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面处理铜的方法，其确保铜表面和绝缘层之间的粘合强度，而不在铜表面上形成超过1μm的不均匀性，并且提高布置导线之间的绝缘的可靠性而不会降低芯片的可靠性，并提供铜表面。解决方案：铜表面处理方法包括以下步骤：氧化铜表面; 然后用包含至少一种选自二氧化硅玻璃和含有通式（1）所示的梯形结构的化合物的化合物的液体处理表面：（其中R各自独立地表示选自氢原子，反应性基团，亲水基团和疏水基团），并且包含200mg / L以下的碱金属离子。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2008088543A Copper surface treatment liquid set, surface treatment method for copper using the same, copper, wiring board and semiconductor package 有权
标题翻译：铜表面处理液体组合物，使用其的铜表面处理方法，铜，接线板和半导体封装
公开(公告)号：JP2008088543A
公开(公告)日：2008-04-17
申请号：JP2007039883
申请日：2007-02-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMASHITA TOMOAKI , INOUE FUMIO
IPC分类号： C23C22/63 , C23C22/78 , H01L23/12 , H05K3/38
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a copper surface treatment liquid set with which fine ruggedness with the Rz of ≤1 μm can be densely and uniformly formed on the surface of copper in a short time, to provide a surface treatment method for copper using the treatment liquid set, to provide copper surface-treated applying the surface treatment method, to provide a wiring board having copper wiring surface-treated applying the surface treatment method, and to provide a semiconductor package obtained by using the board. SOLUTION: The copper surface treatment liquid set is provided with: an acidic noble metal treatment liquid comprising the salt of a metal nobler than copper and discretely forming a metal nobler than copper on the surface of copper; and an alkaline oxidation treatment liquid comprising a phosphate and an oxidizer and oxidizing the surface of copper. Upon its use, a metal nobler than copper is discretely formed on the surface of copper using the noble metal treatment liquid, and thereafter, the copper surface is subjected to oxidation treatment using the oxidation treatment liquid, thus fine ruggedness by the dense and uniform crystals of copper oxide can be formed on the copper surface. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够在短时间内在铜表面上致密均匀地形成具有≤1μm的Rz的微细凹凸的铜表面处理液体组合物，以提供表面处理方法使用处理液体铜的铜，通过表面处理方法提供铜表面处理，以提供使用表面处理方法进行表面处理的铜布线的布线板，并提供通过使用该板获得的半导体封装。解决方案：铜表面处理液体设置有：酸性贵金属处理液，其包含比铜更贵的金属盐，并且在铜表面离子地形成比铜更贵的金属; 以及包含磷酸盐和氧化剂并氧化铜表面的碱性氧化处理液。使用时，使用贵金属处理液在铜表面上分离地形成比铜更贵的金属，然后利用氧化处理液对铜表面进行氧化处理，由此形成致密且均匀的晶体的微细凹凸的铜表面可以形成氧化铜。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007107080A Copper surface treatment method, and copper surface 审中-公开
标题翻译：铜表面处理方法和铜表面
公开(公告)号：JP2007107080A
公开(公告)日：2007-04-26
申请号：JP2005301661
申请日：2005-10-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ITO TOYOKI , INOUE FUMIO , SHIMIZU AKIRA , YAMASHITA TOMOAKI , MATSUURA MASAHARU , INOUE YASUO , NAKASO AKISHI
IPC分类号： C23C28/00 , C23C8/10 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a copper surface treatment method, and a copper surface capable of ensuring the adhesive strength of a copper surface to an insulation layer and excellent in pink-ring resistance without forming unevenness exceeding 1 μm on the copper surface. SOLUTION: The copper surface treatment method comprises a step of forming a metal layer containing at least one metal selected from copper, tin, chromium, nickel, zinc, aluminum, cobalt, gold, platinum, silver and palladium, and a step of subsequently treating the copper surface with a liquid containing at least one of alkali silicate, ester silicate, poly-silazane, or dual-functional silane compound. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供铜表面处理方法和能够确保铜表面与绝缘层的粘合强度并且具有优异的粉红色环电阻而不形成超过1μm的不均匀性的铜表面表面。解决方案：铜表面处理方法包括形成含有选自铜，锡，铬，镍，锌，铝，钴，金，铂，银和钯中的至少一种金属的金属层的步骤，以及步骤随后用含有碱金属硅酸盐，硅酸酯，聚硅氮烷或双功能硅烷化合物中的至少一种的液体处理铜表面。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006317267A Method of measuring adhesive strength between thin resin layer and substrate 审中-公开
标题翻译：测量薄树脂层和基材之间的粘合强度的方法
公开(公告)号：JP2006317267A
公开(公告)日：2006-11-24
申请号：JP2005139914
申请日：2005-05-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUURA MASAHARU , INOUE FUMIO , SHIMIZU AKIRA , ITO TOYOKI , YAMASHITA TOMOAKI , INOUE YASUO , NAKASO AKISHI
IPC分类号： G01N19/04 , G01N3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of measuring the adhesive strength between a thin resin layer and a substrate so that the estimate and result in a reliability test or development coincide with each other in the measurement of the adhesive force (adhesive strength) between the thin resin layer and the substrate by reducing obscurity and removing the stage due to the giving of marks.
SOLUTION: In the measuring method of the adhesive strength between the thin resin layer, which is formed on the surface of the substrate, and the substrate, a metal layer is formed on the thin resin layer and the thin resin layer is subsequently peeled along with the metal layer to measure the adhesive strength between the thin resin layer and the substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种测量薄树脂层和基底之间的粘合强度的方法，使得在测量粘合力（粘合剂）时可靠性测试或显影的估计和结果彼此一致强度）在薄树脂层和基板之间，通过减少晦暗性并且由于产生标记而去除阶段。解决方案：在形成在基板表面上的薄树脂层与基板之间的粘合强度的测量方法中，在薄树脂层上形成金属层，随后形成薄树脂层与金属层一起剥离以测量薄树脂层和基材之间的粘合强度。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006249573A Surface treatment method for copper, and copper 有权
标题翻译：铜和铜的表面处理方法
公开(公告)号：JP2006249573A
公开(公告)日：2006-09-21
申请号：JP2005206083
申请日：2005-07-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMASHITA TOMOAKI , INOUE YASUO , MATSUURA MASAHARU , ITO TOYOKI , SHIMIZU AKIRA , INOUE FUMIO , NAKASO AKISHI
IPC分类号： C23C22/78 , C23C22/06 , C23C22/63
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for copper by which adhesive strength between a copper surface and an insulating layer is secured without forming ruggedness of >1 μm on the copper surface of copper, and insulation reliability between wiring therefore can be improved, and to provide copper. SOLUTION: The surface treatment method for copper comprises: a step where a metal nobler than copper is formed on a copper surface; and a step where the copper surface is subjected to oxidation treatment. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供铜的表面处理方法，其中铜表面和绝缘层之间的粘合强度被确保，而铜的铜表面上不形成>1μm的粗糙度，并且因此布线之间的绝缘可靠性可以改进，并提供铜。解决方案：铜的表面处理方法包括：在铜表面上形成比铜更贵的铜的步骤; 以及铜表面进行氧化处理的工序。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006249519A Surface treatment method for copper and copper 审中-公开
标题翻译：铜和铜的表面处理方法
公开(公告)号：JP2006249519A
公开(公告)日：2006-09-21
申请号：JP2005069058
申请日：2005-03-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMASHITA TOMOAKI , INOUE YASUO , MATSUURA MASAHARU , ITO TOYOKI , SHIMIZU AKIRA , INOUE FUMIO , NAKASO AKISHI
IPC分类号： C23C22/78 , C23C22/63 , C23C22/83
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for copper by which adhesive strength between a copper surface and insulating layer is secured without forming ruggedness of >1 μm on the copper surface, and insulation reliability between wiring therefore can be improved, and to provide copper. SOLUTION: The surface treatment method for copper comprises: a step where a metal nobler than copper is formed on a copper surface; and a step where the copper surface is subjected to oxidation treatment. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供铜的表面处理方法，其在铜表面上确保铜表面和绝缘层之间的粘合强度而不在铜表面上形成>1μm的粗糙度，并且因此可以改善布线之间的绝缘可靠性，并提供铜。解决方案：铜的表面处理方法包括：在铜表面上形成比铜更贵的铜的步骤; 以及铜表面进行氧化处理的工序。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2007291448A Copper foil surface treatment method, and copper foil 有权
标题翻译：铜箔表面处理方法和铜箔
公开(公告)号：JP2007291448A
公开(公告)日：2007-11-08
申请号：JP2006120473
申请日：2006-04-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMASHITA TOMOAKI , INOUE YASUO , MATSUURA MASAHARU , ITO TOYOKI , SHIMIZU AKIRA , INOUE FUMIO , NAKASO AKISHI
IPC分类号： C23C22/63 , C23C22/78 , C23C22/83
摘要： PROBLEM TO BE SOLVED: To provide a copper foil surface treatment method, and a copper foil capable of ensuring the bonding strength of an insulating resin such as a base resin and a surface of a copper foil by forming uniform unevenness without forming unevenness exceeding 1 μm on a surface of the copper foil, excellent in the etching property, and capable of forming a very fine wiring. SOLUTION: In the copper foil surface treatment method, a step of discretely depositing a metal nobler than copper on a surface of a copper foil and a step of performing the oxidation treatment thereafter on the surface of the copper foil with an alkaline solution containing an oxidizing agent are provided in a step of coarsening the copper foil. Further, in the copper foil, a metal nobler than copper is discretely deposited on the surface of the copper foil, and thereafter, the surface of the copper foil is subjected to oxidation treatment with the alkaline solution containing the oxidizing agent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供铜箔表面处理方法和能够通过形成均匀的凹凸而不形成不均匀性来确保基底树脂等绝缘树脂和铜箔的表面的接合强度的铜箔在铜箔表面上超过1μm，蚀刻性能优异，能够形成非常精细的布线。解决方案：在铜箔表面处理方法中，在铜箔的表面上离子沉积比铜更贵的步骤，然后用碱性溶液在铜箔的表面上进行氧化处理的步骤在使铜箔粗化的工序中设置含有氧化剂的工序。此外，在铜箔中，比铜更贵的金属离散地沉积在铜箔的表面上，然后用含有氧化剂的碱性溶液对铜箔的表面进行氧化处理。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007116077A Pretreatment of copper surface and wiring substrate using the same 有权
标题翻译：铜表面的预处理和使用该表面的布线基板
公开(公告)号：JP2007116077A
公开(公告)日：2007-05-10
申请号：JP2006032600
申请日：2006-02-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMASHITA TOMOAKI , INOUE YASUO , MATSUURA MASAHARU , ITO TOYOKI , SHIMIZU AKIRA , INOUE FUMIO , NAKASO AKISHI
IPC分类号： H05K3/06 , C23C18/16 , C23C22/63 , C23C28/00 , C23F1/34 , H05K3/18 , H05K3/28 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide the pretreatment of a copper surface and a wiring substrate capable of securing the unglossiness of the copper surface and adhesion between the copper surface and a resist, and completely removing the resist from the copper surface in development or exfoliation of the resist. SOLUTION: The pretreatment in forming the resist or a cover ray on the copper surface is the pretreatment having a process that dispersively forms a metal more precious than copper on the copper surface and then, and a process that performs oxidation treatment on the copper surface. COPYRIGHT: (C)2007,JPO&INPIT

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