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1. 发明专利

JP2005116762A Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device 审中-公开
标题翻译：用于保护半导体器件的方法，用于半导体器件的封装，半导体器件单元和半导体器件的封装结构
公开(公告)号：JP2005116762A
公开(公告)日：2005-04-28
申请号：JP2003348796
申请日：2003-10-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TASHIRO KAZUHIRO , FUKUDA KEISUKE , KOBASHI NAOTO , MARUYAMA SHIGEYUKI
IPC分类号： G01R31/26 , H01L21/50 , H01L21/66 , H01L21/673 , H01L23/00 , H01L23/04 , H01L23/544 , H01L23/58
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve a reliability of a test and to securely prevent a damage of a semiconductor device in shipping package in relation to a packaging structure of a cover for semiconductor device, a semiconductor device unit, and the semiconductor device, and a method for protecting the semiconductor device. SOLUTION: An IC cover 10A is fixed to the semiconductor device 11A having an irregular surface as a semiconductor chip 14 is formed on the surface of the device. The IC cover 10A has a protrusion 21 formed so as to contact a contact-available position 16 existing within the surface of the device 11A, and a base part 20A supported on the surface by the protrusion 21 so as to detach from the surface in the fixed condition. Further, the IC cover 10A is detachable to the semiconductor device 11A. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提高测试的可靠性并且相对于用于半导体器件的盖的封装结构，半导体器件单元和半导体器件可靠地防止运输封装中的半导体器件的损坏，以及保护半导体器件的方法。解决方案：IC器件盖10A固定到具有不规则表面的半导体器件11A上，因为半导体芯片14形成在器件的表面上。 IC盖10A具有形成为与设备11A的表面内存在的可触及位置16接触的突起21以及由突起21支撑在表面上的基部20A，以便从该表面脱离固定条件。此外，IC盖10A可拆卸到半导体器件11A。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2006269404A Contactor for electronic parts and contact method 有权
标题翻译：电子部件接触器和接触方式
公开(公告)号：JP2006269404A
公开(公告)日：2006-10-05
申请号：JP2005295639
申请日：2005-10-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOBASHI NAOTO , MARUYAMA SHIGEYUKI , ARISAKA GIICHI , MUROTANI HIROYUKI , ONO KATSUHIKO
IPC分类号： H01R13/24 , G01R1/073 , G01R31/26 , H01R33/76
CPC分类号： G01R1/0466 , G01R1/0483
摘要： PROBLEM TO BE SOLVED: To provide a contactor, and a contact method, capable of making a suitable and uniform contact with all terminals of electronic parts such as ICs. SOLUTION: The contactor for electronic parts 10 is provided with a base 12, a plurality of through-holes 12a, 12b formed in the base 12, and a plurality of contactors 11 equipped with a first contact part 11a at one end and a second contact part 11b at the other, each contained in the through hole 12a, 12b. The first contact part 11a has a concave part for housing an electrode terminal 15a of an IC 15, made movable in a horizontal direction in the through-holes 12a, 12b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够与诸如IC的电子部件的所有端子适当和均匀接触的接触器和接触方法。解决方案：电子部件10的接触器设置有基部12，形成在基部12中的多个通孔12a，12b，以及多个接触器11，其在一端配备有第一接触部11a，另一方面，第二接触部分11b包含在通孔12a，12b中。第一接触部分11a具有用于容纳IC 15的电极端子15a的凹部，该电极端子15a可在通孔12a，12b中沿水平方向移动。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2004294144A Module for testing, and testing method of semiconductor device 审中-公开
公开(公告)号：JP2004294144A
公开(公告)日：2004-10-21
申请号：JP2003084159
申请日：2003-03-26
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TANIGUCHI OSAMU , WATANABE NAOYUKI , MIZUKOSHI MASATAKA , OMOTE KOJI , FUKUDA KEISUKE , KOBASHI NAOTO
IPC分类号： G01R31/26 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide a module for testing that does not damage an electrode pad of a semiconductor device and restrains test costs, and to provide a testing method of the semiconductor device. SOLUTION: The module for testing comprises a test substrate having a bonding pad; the semiconductor device arranged on the test substrate; an anisotropic conductive sheet having conductivity only in the thickness direction in contact with the electrode of the semiconductor device; and a metal wire whose one end is connected to the bonding pad and whose the other end is connected to the anisotropic conductive sheet in a region for covering the electrode. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2006310631A Temperature control method and device thereof 有权
标题翻译：温度控制方法及其装置
公开(公告)号：JP2006310631A
公开(公告)日：2006-11-09
申请号：JP2005132550
申请日：2005-04-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , MISAWA HIROSHI , KOBASHI NAOTO
IPC分类号： H01L23/34 , G01R31/26 , H01L35/30
CPC分类号： G01R31/2874 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a temperature control method and device which can quickly cool or heat such an electronic component as a semiconductor device while avoiding application of a thermal stress. SOLUTION: A heat conductor 103 is used having a second main surface 102 of a surface area larger than a first main surface 101 to be contacted with an electronic component 1. A heater 104 and a cooler 105 are provided on the second main surface 102 to be simultaneously operated in response to the self heating of the electronic component 1. Consequently, the temperature of the object 1 to be processed can be quickly controlled reliably. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以在避免施加热应力的同时快速冷却或加热诸如半导体器件的电子部件的温度控制方法和装置。解决方案：使用热导体103，其具有大于第一主表面101的表面积的第二主表面102与电子部件1接触。加热器104和冷却器105设置在第二主体表面102响应于电子部件1的自热而同时操作。因此，可以可靠地快速地控制待处理对象1的温度。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2008026336A Contactor 审中-公开
标题翻译：接触器
公开(公告)号：JP2008026336A
公开(公告)日：2008-02-07
申请号：JP2007252015
申请日：2007-09-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , WATANABE NAOYUKI , TASHIRO KAZUHIRO , KOBASHI NAOTO , IGAWA OSAMU , FUJISAWA TETSUYA
IPC分类号： G01R1/067 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a contactor that can arrange contact electrodes by inflection needle type at a fine pitch and can be formed inexpensively.
SOLUTION: The contactor comprises a contactor substrate 11, and a plurality of contact electrodes 10 formed on the contactor substrate. Each of contact electrodes 10 is a bar-like member whose one end is joined to the contactor substrate. The other end of the contact electrode 10 has two inclined planes inclined mutually oppositely with respect to the axis of the contact electrode, and the tip formed by two inclined planes is off the center of the cross section of the bar-like member.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种接触器，其能够以细间距以弯针形式布置接触电极，并且可以廉价地形成。解决方案：接触器包括接触器基板11和形成在接触器基板上的多个接触电极10。每个接触电极10是其一端接合到接触器基板的棒状部件。接触电极10的另一端具有相对于接触电极的轴线相对地倾斜的两个倾斜面，由两个倾斜面形成的尖端偏离棒状部件的截面的中心。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2003344483A Handling device and testing device using the same 审中-公开
标题翻译：处理装置和使用该装置的测试装置
公开(公告)号：JP2003344483A
公开(公告)日：2003-12-03
申请号：JP2002158996
申请日：2002-05-31
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FUJISHIRO KEIJI , SATOU YASUNORI , MARUYAMA SHIGEYUKI , KOBASHI NAOTO
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R31/2893 , G01R31/2851 , G01R31/2887 , H01R13/6315
摘要： PROBLEM TO BE SOLVED: To provide a handling device that can bring an electronic part into high precision contact with a contact electrode and increase the stability of the electronic part during handling.
SOLUTION: The handling device comprises a body part 72 and a holding part 71 supported on the body part 72 to hold an object to be handled, and can at least move the handled object to a target. The handling device further comprises supporting means 73 for supporting the holding part 71 for displacement relative to the body part 72, and latching means 74 for selectively realizing a latching state of restraining displacement of the holding part 71 relative to the body part 72 or an unlatching state of releasing the restraint on displacement of the holding part 71.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种处理装置，其能够使电子部件与接触电极进行高精度接触，并且在处理期间增加电子部件的稳定性。解决方案：处理装置包括主体部分72和支撑在主体部分72上以保持待处理对象的保持部分71，并且可以至少将被处理对象移动到目标。处理装置还包括用于支撑相对于主体部分72移位的保持部分71的支撑装置73和用于选择性地实现保持部分71相对于主体部分72的限制位移的闩锁状态的锁定装置74或者解锁释放保持部71的位移限制的状态。（C）2004，JPO

7. 发明专利

JP2003294787A Contactor, its manufacturing method, and testing method using contactor 有权
标题翻译：接触器及其制造方法和使用接触器的测试方法
公开(公告)号：JP2003294787A
公开(公告)日：2003-10-15
申请号：JP2002099133
申请日：2002-04-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , WATANABE NAOYUKI , TASHIRO KAZUHIRO , KOBASHI NAOTO , IGAWA OSAMU , FUJISAWA TETSUYA
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66 , H05K7/10
CPC分类号： G01R1/0675 , G01R3/00 , H05K7/1069
摘要： PROBLEM TO BE SOLVED: To provide a contactor capable of arranging bending needle type contact electrodes at fine pitches, and inexpensively being formed, and to provide a method of manufacturing the contactor. SOLUTION: This contactor has a contact substrate 41 and a plurality of contact electrodes 40 formed on the contact substrate. Each contact electrode 40 is connected to the contact substrate 41 at its one end and formed with a metal wire 42 bent between one end and the other end. An inclined surface 42b comprising a cut surface and a ruptured surface 42c caused by tension are formed at the tip part of the contact electrode 40. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够以细间距布置弯曲针型接触电极并且廉价地形成的接触器，并且提供一种制造接触器的方法。解决方案：该接触器具有接触基板41和形成在接触基板上的多个接触电极40。每个接触电极40在其一端连接到接触基板41，并且形成有在一端和另一端之间弯曲的金属丝42。在接触电极40的前端形成有由张力引起的切断面和断裂面42c的倾斜面42b。（C）2004，JPO

8. 发明专利

JP2001066345A BURN-IN BOARD OF SEMICONDUCTOR IC 失效
公开(公告)号：JP2001066345A
公开(公告)日：2001-03-16
申请号：JP24226599
申请日：1999-08-27
申请人： FUJITSU LTD
发明人： KOBASHI NAOTO , KUMAZAWA KATSUMI , KITAOKA TOMOKAZU , YOSHIOKA HIROYUKI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To easily and securely suppress noise which is easy to generate, specially, between a socket substrate and an inspection substrate as to the constitution of the burn-in board of a semiconductor IC. SOLUTION: This burn-in board is constituted including a socket substrate 22 on which an IC socket 222 is mounted, an inspection substrate 21 which is sized corresponding to multiple socket substrates, and a connector device 23 connecting the socket substrate 22 and inspection substrate 21. The connector device is composed of a plug connector 235 mounted on the socket substrate and a jack connector 231 mounted on the inspection substrate.

9. 发明专利

JPH05304200A 失效
公开(公告)号：JPH05304200A
公开(公告)日：1993-11-16
申请号：JP10711992
申请日：1992-04-27
申请人： FUJITSU LTD
发明人： KOBASHI NAOTO , AKIYAMA HIDEKI
IPC分类号： G01R31/26 , G01V9/00 , H01L21/66 , H01L21/67 , H01L21/68
摘要： PURPOSE:To obtain a mechanism, in which even an IC in a thin package can be detected stably by a sensor, regarding an IC-loading detection mechanism preventing erroneous sorting by the two superposition of ICs and the damage of the package by detecting the presence of the ICs on a socket in a device, in which the ICs are inserted into the socket and tested. CONSTITUTION:In an IC-loading detection mechanism detecting the presence of the loading of an IC 6 to a socket 51 by the position of a detecting lever 31 brought into contact with the IC 6, a mechanism, in which the magnitude of the movement of the detecting lever 31 is magnified doubly and detected by a link mechanism 2 and structure, in which the recessed section of the socket 51 is formed, is provided.

10. 发明专利

JPH11148962A INSPECTION DEVICE FOR IC SOCKET 失效
公开(公告)号：JPH11148962A
公开(公告)日：1999-06-02
申请号：JP31306397
申请日：1997-11-14
申请人： FUJITSU LTD
发明人： KOBASHI NAOTO
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To easily inspect the shape of contact and good or bed of array state, by deforming a spring member by adding pressure, and moving the mirror part of the spring member to a gap direction when the spring member at the tip end of a shaft touches an IC package put surface in an IC socket. SOLUTION: Inserting a spring member 25 into an opening 8a of a push lid of an inspection object IC socket, a tip end of legs 21b and 21c of a base part 21 pressed on the surface of the push lid 8 and pressure Pa is added so that the tip end of a contact rises up. In this state, a tip end button 26 of shaft 23 is pushed down and a spring member 25 is touched to an IC package mounting surface 5a. If the pressing force Pb of the button 26 is further increased, the spring member deforms and a mirror part 25a goes under the tip end of contact 7 in floating state. As the results, only by peeping through the gap of legs of the base part 21 into the mirror part 25a as shown by an arrow, the image of contact part can be seen.

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