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1. 发明专利

JPS5528243A ELECTROMAGNETIC RELAY 失效
公开(公告)号：JPS5528243A
公开(公告)日：1980-02-28
申请号：JP10066278
申请日：1978-08-18
申请人： FUJITSU LTD
发明人： HIROSE TORIMASA , CHIBA KIYOSHI , OCHIAI RIYOUICHI
IPC分类号： H01H49/00 , H01H50/14 , H01H50/34 , H01H50/54 , H01H50/56

2. 发明专利

JPH0945809A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE-MOUNTING BOARD 失效
公开(公告)号：JPH0945809A
公开(公告)日：1997-02-14
申请号：JP19545695
申请日：1995-07-31
申请人： FUJITSU LTD
发明人： AZUMAGUCHI YUTAKA , INAGAKI MITSUO , KUMAI TOSHIO , OCHIAI RYOICHI , TEJIMA YASUHIRO , SHINJO MAMORU , KOBAYASHI YASUSHI , TAMURA HIDEAKI , IIMURA HIROSHI , CHIBA KIYOSHI , SEKIYA YUKIO , IGARASHI SHUZO , ICHIHARA YASUHIRO
IPC分类号： H01L23/12 , H01L23/057 , H01L23/31 , H01L23/498 , H01L23/50 , H05K1/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To increase reliability of bonding part after mounting a semiconductor device by a method wherein a groove is provided on the surface opposing to a package, the package is made deformable by fixing the first terminal to the second terminal on a wiring board by soldering, and the stress of the solder junctioned part of the second terminal is alleviated. SOLUTION: V-shaped slits 44 are formed on both surfaces of a package 30 crossing between solder bumps 38. The solder bumps 38, which are the first terminal, and the footprint 22, which is the second terminal, are electrically and mechanically coupled by a fillet-like solder junction part 48. Even when a mother board 20 is warped in that state, the package 30 is deformed corresponding to the warpage. That is since the lower surface of the package 30 is shrinkingly deformed and the upper surface is extendingly deformed, the stress generated on the junction part 48 can be mitigated. As a result, the reliability of the solder-junctioned part 48 after mounting can be enhanced.

3. 发明专利

JPH01118369A SOLDERING REFLOW FURNACE 失效
公开(公告)号：JPH01118369A
公开(公告)日：1989-05-10
申请号：JP27633387
申请日：1987-10-30
申请人： FUJITSU LTD
发明人： CHIBA KIYOSHI , KIKUCHI MISAO
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04
摘要： PURPOSE:To prevent the camber of a printed circuit board by transferring the printed circuit board by a specified transfer means inside a furnace in the soldering reflow furnace fitting a chip part via a soldered layer to both faces of the printed circuit board. CONSTITUTION:A creamy solder 44 is coated on the wiring pattern formed on one face of a printed circuit board 40 and the chip part 46 of a resistor, etc., is fitted thereon by the solder layer of both end parts thereof. This printed circuit board 40 is transferred by the base seat part of a mesh belt 3 of the inside of a reflow furnace and a soldering part 44' is formed by reflowing the creamy solder 44. A creamy solder 48 is then coated on the opposite face of the printed circuit board 40 subjected to one side packaging and after fitting a chip part 50 thereon a soldering part 48' is finally formed by reflowing by supporting this printed circuit board 40 by the supporting part 5 on the mesh belt 3. A printed board free from camber is obtainable and also the chip part 46 soldered previously is not displaced nor dropped at the soldering time of the succeeding chip part 50.

4. 发明专利

JPS58184784A Method of positioning tapping screw for ground 失效
标题翻译：定位螺钉的地线方法
公开(公告)号：JPS58184784A
公开(公告)日：1983-10-28
申请号：JP6820082
申请日：1982-04-23
申请人： Fujitsu Ltd
发明人： CHIBA KIYOSHI
IPC分类号： H05K7/12 , H04Q1/02 , H05K1/02

5. 发明专利

JPH09172294A WORK TABLE FOR MOUNTING BOARD 失效
公开(公告)号：JPH09172294A
公开(公告)日：1997-06-30
申请号：JP32863095
申请日：1995-12-18
申请人： FUJITSU LTD
发明人： KOGURE SEIJI , CHIBA KIYOSHI
IPC分类号： B23P19/00 , H05K13/00
摘要： PROBLEM TO BE SOLVED: To appropriately support a board of any parts device with simple constitution by providing expansion members under a printed substrate, giving pressure on the printed board by means of filling fluid and to prevent a work table from coming into contact with the printed board by means of the discharge of fluid. SOLUTION: The expansion members (air bags) 31 changing the volume of fluid by means of filling/discharging it are provided under the printed board 15. Pressure is given on the printed board 15 by feeding fluid and the work table is prevented from coming into contact with the printed board 15 by means of discharging fluid. In the work table for double face mounting, the printed boards 15 of a size out of various sizes is received and both clampers 3 and 4 appropriately sandwich the printed board 15. The two air bags 31 made of rubber are provided on a supporting board 12 in parallel and air is filled/ discharged. Consequently, the board of any parts arrangement can appropriately be supported with simple constitution.

6. 发明专利

JPS62269393A METHOD OF PRINTING CIRCUIT BOARD MODULE PATTERN 失效
公开(公告)号：JPS62269393A
公开(公告)日：1987-11-21
申请号：JP11538386
申请日：1986-05-19
申请人： FUJITSU LTD
发明人： CHIBA KIYOSHI
IPC分类号： B41F15/08 , H05K3/12

7. 发明专利

JPS5466447A STRUCTURE OF TERMINAL OF ELECTROMAGNETIC RELAY 失效
公开(公告)号：JPS5466447A
公开(公告)日：1979-05-29
申请号：JP13276277
申请日：1977-11-05
申请人： NIPPON ELECTRIC CO , NIPPON TELEGRAPH & TELEPHONE , OKI ELECTRIC IND CO LTD , HITACHI LTD , FUJITSU LTD
发明人： MIKAMI NOBUO , SHIMIZU YUUICHI , OONUKI SHIYOUICHI , YAMANE MIKITO , CHIBA KIYOSHI
IPC分类号： H01H50/14

8. 发明专利

JPH02105499A METHOD OF SUPPLYING CHIP COMPONENT OF CHIP MOUNTER 失效
公开(公告)号：JPH02105499A
公开(公告)日：1990-04-18
申请号：JP25706888
申请日：1988-10-14
申请人： FUJITSU LTD
发明人： UMEHARA SHIGEMICHI , CHIBA KIYOSHI
IPC分类号： H05K13/00 , H05K13/02
摘要： PURPOSE:To obviate the need to separate the top tape of a carrier tape prior to the suction of chip components by a suction nozzle by pushing out chip components from the side opposite to the suction nozzle of the carrier tape using a thrust head. CONSTITUTION:When a carrier tape 11 is fed, a roll cutter 21 is rotated and a top tape 24 is damaged reasonably. When a chip component 13 to be taken out is moved above a thrust head 25, the supply of the carrier tape 11 is stopped. In this state, by making the thrust head 25 move in the upward direction, the chip component 13 is projected out of a top tape. The section where the chip component 13 are projected from the top tape 14 or the chip component 13 projecting completely from the top tape 14 is suck on the suck nozzle 24 and these chip components are transferred to a preset position on a printed wiring board.

9. 发明专利

JPS60261200A METHOD OF MOUNTING CHIP PART 失效
公开(公告)号：JPS60261200A
公开(公告)日：1985-12-24
申请号：JP11759684
申请日：1984-06-08
申请人： FUJITSU LTD
发明人： CHIBA KIYOSHI
IPC分类号： H05K13/08

10. 发明专利

JPS59210615A Method of trimming resistor 失效
公开(公告)号：JPS59210615A
公开(公告)日：1984-11-29
申请号：JP8532983
申请日：1983-05-16
申请人： Fujitsu Ltd
发明人： CHIBA KIYOSHI
IPC分类号： H01C17/22

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