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JP2010108150A Thermal stress analysis method of electronic component and resin flow analysis method 有权
标题翻译：电子元件和树脂流动分析方法的热应力分析方法
公开(公告)号：JP2010108150A
公开(公告)日：2010-05-13
申请号：JP2008278269
申请日：2008-10-29
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： KONO TSUTOMU , MINO MASAYUKI , TAKESHIMA HIDEHIRO , ITO HIROYUKI , GOI TOMOKO
IPC分类号： G06F17/50 , B29C45/76
CPC分类号： G01N3/00 , G01N2203/0214
摘要： PROBLEM TO BE SOLVED: To evaluate a curvature deformation amount by taking a relationship between a filling rate and a linear expansion coefficient of fillers filled in a resin into account in a resin in a resin filling process of a package. SOLUTION: A thermal stress analysis method of an electronic component performs a resin flow analysis by filling particles simulating fillers in a resin to calculate a filler filling rate at every spot in a package. Here, the method converts the filler filling rate at every spot into a linear expansion coefficient by using a database in which the filler filling rate and the linear expansion coefficient are experimentally calculated. The method can predict a curvature deformation amount by means of a structure analysis taking a linear expansion coefficient obtained from a distribution of the filler filling rates in the package into account by using the converted linear expansion coefficient as an input value for a thermal stress analysis. Further, after calculating a curvature deformation amount of a semiconductor package having a sheet shape in the manner, the method calculates curvature deformation amounts of individual packages by dividing the package into the respective substrate areas in which each chip operates electrically. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过在包装的树脂填充过程中考虑在树脂中填充的填料的填充率和线膨胀系数之间的关系来评估曲率变形量。解决方案：电子部件的热应力分析方法通过将模拟填料的颗粒填充到树脂中来计算填料中每个点的填充剂填充率来进行树脂流动分析。这里，通过使用实验计算填充填充率和线膨胀系数的数据库，将各点的填充填充率变换为线膨胀系数。该方法可以通过使用由转换的线性膨胀系数作为热应力分析的输入值而考虑从包装中的填料填充率的分布获得的线性膨胀系数的结构分析来预测曲率变形量。此外，在以这种方式计算具有片状的半导体封装的曲率变形量之后，该方法通过将封装分成其中每个芯片电连接的各个衬底区域来计算各个封装的曲率变形量。版权所有（C）2010，JPO＆INPIT

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