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    • 1. 发明专利
    • Etching method and etching device
    • 蚀刻方法和蚀刻装置
    • JP2014179553A
    • 2014-09-25
    • JP2013054117
    • 2013-03-15
    • Nagoya Univ国立大学法人名古屋大学
    • TAJIMA SATOMIHAYASHI TOSHIOISHIKAWA KENJIHORI MASARU
    • H01L21/302
    • PROBLEM TO BE SOLVED: To provide an etching method and an etching device capable of carrying out dry etching to Si crystal or the like by using relatively inexpensive and easily acquirable gas without using a plasma generation device.SOLUTION: An etching device 100 is configured to carry out dry etching to an Si member S1. The etching device 100 includes: a reaction chamber 150 for carrying out etching to the Si member S1; a first gas supply part 111 for supplying first gas containing Fgas to the reaction chamber 150; and a second gas supply part 112 for supplying second gas containing NO gas to the reaction chamber 150. Then, the inner pressure of the reaction chamber 150 is set within the range of 10 Pa or more and 10000 Pa or less, and the mixed gas of first gas and second gas is introduced to the Si member S1 to carry out etching.
    • 要解决的问题:提供一种能够在不使用等离子体产生装置的情况下通过使用相对便宜且易于获取的气体对Si晶体等进行干蚀刻的蚀刻方法和蚀刻装置。解决方案:蚀刻装置100被配置为 对Si构件S1进行干蚀刻。 蚀刻装置100包括:用于对Si构件S1进行蚀刻的反应室150; 用于向反应室150供给含有Fgas的第一气体的第一气体供给部111; 以及用于向反应室150供给含有NO气体的第二气体的第二气体供给部112.然后,反应室150的内部压力设定在10Pa以上且10000Pa以下的范围内,混合气体 的第一气体和第二气体被引入到Si构件S1中以进行蚀刻。
    • 4. 发明专利
    • Manufacturing method of printed wiring board
    • 印刷线路板的制造方法
    • JP2013058698A
    • 2013-03-28
    • JP2011197477
    • 2011-09-09
    • Ibiden Co Ltdイビデン株式会社Nagoya Univ国立大学法人名古屋大学
    • IWATA YOSHIYUKIHORI MASARUSAKAMOTO HAJIME
    • H05K3/42H05H1/00H05H1/24H05K3/18H05K3/26
    • H05K3/027H05K3/0035H05K3/0055H05K3/421H05K2203/095
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an environment-conscious multilayer printed wiring board capable of forming a via conductor with high connection reliability by removing resin residue in a small diameter aperture for a via.SOLUTION: When performing atmospheric pressure plasma processing with high electron density by using a process gas mixed with a fluorovinyl ether-based gas having a double bond between two carbons and a fluoroalkyl ether group, F radicals, CF radicals, CF2 radicals and CF3 radicals for removing resin residue on the bottom of an aperture for a via conductor by chemical reaction are obtained abundantly with a low mixing ratio. Consequently, chemical removal progresses efficiently and the resin residue of via is removed by a synergetic effect with physical removal by particles in plasma.
    • 要解决的问题:提供一种能够通过去除用于通孔的小直径孔中的树脂残留物而形成具有高连接可靠性的通孔导体的环境意识的多层印刷线路板的制造方法。 解决方案:通过使用与在两个碳和氟代烷基醚基团之间具有双键的氟乙烯基醚基气体混合的工艺气体进行高电子密度的大气压等离子体处理,F自由基,CF自由基,CF2基团和 通过化学反应在通孔导体的孔的底部除去树脂残渣的CF 3基团以低的混合比大量获得。 因此,通过物理除去等离子体中的颗粒的协同效应,有效地进行化学去除并且通孔的树脂残余物被除去。 版权所有(C)2013,JPO&INPIT
    • 8. 发明专利
    • Planar waveguide
    • 平面波形
    • JP2012013931A
    • 2012-01-19
    • JP2010150030
    • 2010-06-30
    • Nagoya Univ国立大学法人名古屋大学
    • EBIZUKA NOBORUISHIKAWA KENJIKONDO HIROKIHORI MASARU
    • G02B6/122
    • PROBLEM TO BE SOLVED: To provide a planar waveguide having a small-sized hybrid lens having a large NA and a little loss.SOLUTION: This planar waveguide includes: a clad layer; a core layer superposed on the surface side of the clad layer and having a refractive index higher than that of the clad layer; and a hybrid lens section formed on the surface or the interior of the core layer, having a refractive index higher than that of the clad layer, and having a different refractive index from that of the core layer. The hybrid lens section of this planar waveguide includes: a geometric grating part, which is a diffractive lens, or a dioptric lens part, which is symmetric about an optical axis and has a substantially serrate shape whose intervals become narrower as it separates farther from the optical axis; and a VP grating part, which is a diffractive lens, provided distant from the optical axis with respect to the geometric grating part or the dioptric lens part, and whose intervals become narrower as it separates farther from the optical axis.
    • 要解决的问题:提供具有NA大且少量损失的小型混合透镜的平面波导。 解决方案:该平面波导包括:覆层; 芯层,叠层在覆盖层的表面侧,折射率高于覆盖层的折射率; 以及形成在芯层的表面或内部的折射率高于包层的折射率并且具有与芯层的折射率不同的折射率的混合透镜部。 这种平面波导的混合透镜部分包括:作为衍射透镜的几何光栅部分或折射透镜部分,其与光轴对称,并且具有基本上锯齿形状,其间隔变得更窄,因为其与 光轴; 以及作为衍射透镜的VP光栅部分,其相对于几何光栅部分或屈光透镜部分远离光轴,并且随着与光轴分离的间隔变窄,其间隔变窄。 版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Spectroscope
    • 分光镜
    • JP2012013526A
    • 2012-01-19
    • JP2010150029
    • 2010-06-30
    • Nagoya Univ国立大学法人名古屋大学
    • EBIZUKA NOBORUHORI MASARU
    • G01J3/14G01J3/18G02B13/00
    • PROBLEM TO BE SOLVED: To provide a spectroscope to be used in a vacuum ultraviolet ray range.SOLUTION: In the spectroscope including a slit 40, a first achromatic lens 20, a grism 10, a second achromatic lens 30 and a detector 50, the first achromatic lens 20, the grism 10 and the second achromatic lens 30 are selected and formed by LiF, MgF2. The first achromatic lens 20 includes a first refractive lens 21 and a first diffractive lens 22 including a plurality of binary type diffractive lattices. The second achromatic lens 30 includes a second refractive lens 32 and a second diffractive lens 32 including a plurality of binary type diffractive lattices. The grism 10 is installed in between the first achromatic lens 20 and the second achromatic lens 30 and includes a prism 11 and diffractive lattices 12 having a plurality of binary type diffractive lattices. A mean square deviation value for the surface roughness of the binary type diffractive lattices of the first diffractive lens 22, the binary type diffractive lattices of the second diffractive lens 32 and the binary type diffractive lattices of the diffractive lattices of the grism 10 are 5 nm or less.
    • 要解决的问题:提供一种用于真空紫外线范围的分光镜。

      解决方案:在包括狭缝40,第一消色差透镜20,棱镜10,第二消色差透镜30和检测器50的分光器中,选择第一消色差透镜20,棱镜10和第二消色差透镜30 并由LiF,MgF 2形成。 第一消色差透镜20包括第一折射透镜21和包括多个二进制衍射格栅的第一衍射透镜22。 第二消色差透镜30包括第二折射透镜32和包括多个二进制衍射栅格的第二衍射透镜32。 棱镜10安装在第一消色差透镜20和第二消色差透镜30之间,并且包括棱镜11和具有多个二进制衍射晶格的衍射光栅12。 第一衍射透镜22的二进制衍射栅格的表面粗糙度,第二衍射透镜32的二进制衍射栅格和棱镜10的衍射栅格的二进制衍射栅格的均方差值为5nm 或更少。 版权所有(C)2012,JPO&INPIT