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    • 7. 发明公开
    • Liquid dispensing reservoir having a flow rate that is independent of the liquid level
    • 容器用于分配液体,其流量是独立的液面。
    • EP0614135A1
    • 1994-09-07
    • EP93203613.0
    • 1993-12-21
    • Verenigde Bedrijven Groeneveld B.V.
    • de Leeuw, Nicolaas Antonie
    • G05D9/02G05D7/01A47K3/22
    • G05D7/0146A47K3/286G05D9/02
    • The invention relates to a liquid dispensing reservoir (1) with an outlet (3) opening provided in the (bottom) wall of the same. The outlet (3) opening merges into an auxiliary reservoir (4) located under the (main) reservoir (1), that is provided with an auxiliary outlet opening (3) and accommodates a float type valve body (6) that cooperates with the outlet opening (3) of the main reservoir (1). The sizes of the two outlet (3,5) opening are such that with the main reservoir (1) at least filled to a minimum level (III) and the auxiliary outlet (5) opening in the opened position, a substantially constant liquid level will be set within the auxiliary reservoir (4) due to the valve body (6) causing a regulated flow of liquid to discharge from the main reservoir (1).
    • 本发明涉及一种液体分配容器(1)在相同的(底)壁提供在出口(3)的开口。 所述出口(3)开口过渡到位于下(主)贮存到辅助蓄能器(4)(1)在没有辅助出口开口(3)上设置有与容纳浮子式阀体(6)那样配合与 出口开口(3)的主贮存器(1)。 两个出口(3.5)的开口的尺寸被检查与主贮存器(1)至少填充到最小水平(III)和辅助出口(5)开口,在打开位置时,基本恒定的液面那样 将被在辅助贮存器(4)内设置由于所述阀体(6)造成的液体调节流量从主贮存器排出(1)。
    • 10. 发明公开
    • Apparatus suitable for processing semiconductor slices
    • Vorrichtung zum Behandeln von Halbleiterscheiben。
    • EP0271958A2
    • 1988-06-22
    • EP87202498.9
    • 1987-12-14
    • PHILIPS ELECTRONICS UK LIMITEDPhilips Electronics N.V.
    • Titterington, Joseph Bell c/o Mullard LimitedArdern, William c/o Mullard Limited
    • H01L21/00G05D9/02
    • H01L21/67057H01L21/67051Y10T137/86485
    • Apparatus suitable for processing semiconductor slices, the apparatus comprises a tank (1) for receiving a jig carrying semiconductor slices, a first supply line (2) for supplying a processing liquid to the tank (1), a supply valve (3) for controlling liquid supply through the first supply line (2), the supply valve (3) being operable in response to changes in fluid pressure at a control port (4) of the supply valve (3) and a second supply line (5) for supplying fluid to the control port (4) to control operation of the supply valve (3). The second supply line (5) communicates with an inlet (8) of the tank (1) via a control valve (7) which is operable in response to changes within the tank to control the fluid pressure at the control port (4) and so control operation of the supply valve (3).
      In the arrangement shown in Figure 1, a valve member (7a) of the valve (7) is carried by a platform (9) pivotally mounted within the tank (1). The weight of a jig carrying semiconductor slices acting on the platform (9) causes the platform (9) to tilt to close the control valve (7) thereby increasing the fluid pressure at the control port (4), causing the supply valve to open and so supply liquid to the tank via the inlet (1ʹ).
    • 适用于处理半导体薄片的装置,该装置包括一个用于接纳载有半导体薄片的夹具的罐(1),用于向罐(1)供应处理液体的第一供应管线(2),用于控制 通过第一供应管线(2)供应液体,供应阀(3)可响应供应阀(3)的控制端口(4)处的流体压力的变化而操作,第二供应管线(5)用于供应 流体到控制端口(4)以控制供应阀(3)的操作。 第二供应管线(5)经由控制阀(7)与罐(1)的入口(8)连通,该控制阀可响应罐内的变化而操作以控制控制端口(4)处的流体压力, 所以控制供油阀(3)的运行。 在图1所示的装置中,阀(7)的阀构件(7a)由可枢转地安装在罐(1)内的平台(9)承载。 作用在平台(9)上的载有半导体薄片的夹具的重量使得平台(9)倾斜以关闭控制阀(7),从而增加控制端口(4)处的流体压力,从而使供给阀打开 并且因此通过入口(1')向罐提供液体。