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1. 发明公开

EP4350742A1 METHOD FOR PRODUCING ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4350742A1
公开(公告)日：2024-04-10
申请号：EP22811405.4
申请日：2022-05-27
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： YASUI, Hiroto , KURIHARA, Hiroyoshi , KINOSHITA, Jin
IPC分类号： H01L21/301 , C09J7/38
摘要： A method for manufacturing an electronic device, the method at least including a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. Here, the adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tanδ at -5°C of a cured film of the ultraviolet curable adhesive resin material, which is measured as described in the following [Procedure], is 0.25 to 0.85. [Pressure] (i) A film having a film thickness of 0.2 mm is formed using the ultraviolet curable adhesive resin material, the film is irradiated with an ultraviolet ray having a main wavelength of 365 nm at an irradiation intensity of 100 W/cm 2 with an ultraviolet ray amount of 1080 mJ/cm 2 using a high-pressure mercury lamp in an environment at 25°C for ultraviolet curing, and a cured film is obtained. (ii) A dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz and a temperature of -50°C to 200°C in a tensile mode.

2. 发明公开

EP4350740A1 METHOD FOR PRODUCING ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4350740A1
公开(公告)日：2024-04-10
申请号：EP22811397.3
申请日：2022-05-27
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： YASUI Hiroto , KURIHARA Hiroyoshi , KINOSHITA Jin
IPC分类号： H01L21/301 , C09J7/38
摘要： A method for manufacturing an electronic device, the method at least including a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tanδ at -5°C of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, which is measured under the following conditions, is 0.25 to 0.85 (Conditions: a dynamic viscoelasticity is measured at a frequency of 1 Hz and a temperature of -50°C to 200°C in a tensile mode).

3. 发明公开

EP4350031A1 PLASMA POLYMERISATION COATING, PREPARATION METHOD, AND DEVICE 审中-公开
公开(公告)号：EP4350031A1
公开(公告)日：2024-04-10
申请号：EP22810360.2
申请日：2022-05-11
申请人： Jiangsu Favored Nanotechnology Co., Ltd.
发明人： ZONG, Jian
IPC分类号： C23C16/513 , C23C16/50 , C23C16/448 , C23C14/48 , C09D183/04 , C23C16/42 , C23C16/30 , B05D7/24 , B05D3/14 , B05D5/08
摘要： Provided in the specific embodiments of the present invention are a plasma polymerisation coating, the plasma polymerisation coating being formed by the plasma deposition of a substrate in contact with an organosilane monomer having an aromatic group or epoxy group; the coating formed by plasma deposition containing said monomer can effectively improve the wear resistance of the coating.

4. 发明公开

EP4349935A2 ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES 审中-公开
公开(公告)号：EP4349935A2
公开(公告)日：2024-04-10
申请号：EP24159152.8
申请日：2017-06-19
申请人： Universal Display Corporation
发明人： TSAI, Jui-Yi , JI, Zhiqiang , DYATKIN, Alexey Borisovich , XIA, Chuanjun , LIN, Chun , ZENG, Lichang , YEAGER, Walter
IPC分类号： C09K11/06
摘要： Iridium complexes comprising three different bidentate ligands and their use in OLEDs to enhance the device efficiency and lifetime are disclosed.

5. 发明公开

EP4349924A1 COATING COMPOSITION FOR UNDERCOAT, AND COATING FILM 审中-公开
公开(公告)号：EP4349924A1
公开(公告)日：2024-04-10
申请号：EP23813539.6
申请日：2023-07-19
申请人： Nippon Paint Marine Coatings Co., Ltd.
发明人： OHTOMO, Satoru , HATANAKA, Teruhisa
IPC分类号： C09D5/00 , C09D5/08 , C09D133/00 , C09D163/00 , C09D7/61
摘要： Provided is a coating composition for undercoating including: an acryl resin; and an epoxy resin, wherein the acryl resin has a solubility parameter of 9.0 or more and 12 or less and a weight average molecular weight of 1,000 or more and 95,000 or less, and wherein the epoxy resin has a solubility parameter of 10 or more and 12 or less and a weight average molecular weight of 250 or more and 2,500 or less.

6. 发明公开

EP4349889A1 HEAT CONDUCTION FILM AND HEAT-DISSIPATING STRUCTURE USING SAME 审中-公开
公开(公告)号：EP4349889A1
公开(公告)日：2024-04-10
申请号：EP21942156.7
申请日：2021-05-26
申请人： NISSAN MOTOR CO., LTD.
发明人： KANEKO, Takako , NAITO, Tetsuro , TSUKADA, Yoshiko , YAJIMA, Atsuhiko , SHIRATORI, Kazuyuki
IPC分类号： C08J3/20 , B29C70/62 , B29C70/88 , B32B9/00 , C08J5/18 , C08K3/04 , C08K7/00 , C09K5/00 , H01L23/36 , H05K7/20
摘要： Provided is a means capable of selectively improving thermal conductivity in a plane direction of a heat conduction sheet.
A heat conduction film is configured by disposing a scale-like carbon material formed of a plurality of graphene layers such that the adjacent scale-like carbon materials are in contact with each other and a long axis of the scale-like carbon material is oriented in a plane direction of the film.

7. 发明公开

EP4349597A1 WATER-REPELLENT, OIL-REPELLENT MEMBER HAVING ANTI-MICROBIAL, ANTI-MOLD, AND ANTI-VIRAL PROPERTIES, METHOD FOR PRODUCING WATER-REPELLENT, OIL-REPELLENT MEMBER, AND ARTICLE 审中-公开
公开(公告)号：EP4349597A1
公开(公告)日：2024-04-10
申请号：EP22815908.3
申请日：2022-05-24
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： SAKOH Ryusuke , YAMANE Yuji , INOUE Tomohiro , FURUDATE Manabu
IPC分类号： B32B27/30 , B05D1/36 , B05D5/08 , B05D7/24 , B32B27/00 , B32B27/18 , C09K3/18
摘要： Provided is a water-repellent, oil-repellent member having anti-microbial, anti-mold, and anti-viral properties, the water-repellent, oil-repellent member having a primer layer as a first layer on at least one surface of a substrate, and furthermore having a water-repellent, oil-repellent layer as a second layer on the outer surface of the primer layer, wherein: the primer layer comprises a layer that has a film thickness of 10-5,000 nm and that contains a silicon-compound-based binder together with metal microparticles and/or metal oxide microparticles having anti-microbial, anti-mold, and anti-viral properties; and the water-repellent, oil-repellent layer comprises a layer that has a film thickness of 0.5-50 nm and that contains, as a principal component, a cured product of a fluorine-containing organic silicon compound. This water-repellent, oil-repellent member has exceptional production properties, makes it possible to maintain a hygienic, excellent anti-fouling surface over an extended period, and also has exceptional water repellency, oil repellency, and anti-microbial, anti-mold, and anti-viral properties.

8. 发明公开

EP4349446A1 DEFOAMER COMPOSITION BASED ON OIL-IN-WATER EMULSIONS 审中-公开
公开(公告)号：EP4349446A1
公开(公告)日：2024-04-10
申请号：EP23197372.8
申请日：2023-09-14
申请人： Evonik Operations GmbH
发明人： Sun, Yi , Hu, Yanling , Niedballa, Jonas , Münster, Daniela , Chen, Xuefang , Li, Gang , Fan, HaiYi , Struck, Susanne
IPC分类号： B01D19/04 , C08L71/02 , C08L83/00 , C08L83/04 , C09D7/00 , C09D11/02
摘要： The present invention relates to a defoamer composition comprising
I) an oil phase,
II) a water phase,
III) at least one O/W emulsifier, and
IV) at least one W/O emulsifier as co-emulsifier
wherein the amount of the water phase is 20 - 90 wt.%, preferably 60 - 85 wt.% based on the total weight of the composition, characterized in that the oil phase is an oil-in-oil emulsion comprising
A) at least one or more vegetable oil as component A,
B) at least one or more polyether ester as component B and
C) at least one or more polyether-modified polysiloxane, and optional
D) at least one or more hydrophobic particle as component D.

9. 发明公开

EP4348204A1 FORCE SENSORS, FORCE SENSOR CONTROLLED ELECTRONICS, AND FORCE SENSOR CONTROLLED CONDUCTIVE HEATING ELEMENTS 审中-公开
公开(公告)号：EP4348204A1
公开(公告)日：2024-04-10
申请号：EP22812335.2
申请日：2022-05-31
申请人： Liquid X Printed Metals, Inc.
发明人： GWENGO, Chengeto , SWISHER, Robert G. , FISHER, Orin B. , BABE, William S. , VASY, Beth , PETRAK, Christianna M. , BABE, Gregory
IPC分类号： G01L1/16 , B41M3/00 , B41M5/00 , C09D11/52

10. 发明公开

EP4347733A1 POLYESTER COPOLYMER AND COATING COMPOSITIONS THEREFROM HAVING IMPROVED CORROSION RESISTANCE 审中-公开
公开(公告)号：EP4347733A1
公开(公告)日：2024-04-10
申请号：EP22812387.3
申请日：2022-05-26
申请人： Swimc LLC
发明人： HUSSAIN, Nusrah , BARTLEY III, George K. , ACCIPITER, Beverly A. , HOHMAN, Brenda E. , RIAZZI, Arthur
IPC分类号： C09D167/00 , C09D171/02

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