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    • 7. 发明公开
    • PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD FOR PIEZOELECTRIC DEVICE
    • 压电器件及其制造方法的压电装置
    • EP2690782A4
    • 2014-08-20
    • EP12759963
    • 2012-03-21
    • MURATA MANUFACTURING CO
    • ITO KOREKIYOIWAMOTO TAKASHI
    • H03H3/08H01L41/187H01L41/33H03H9/02H03H9/145
    • H01L41/29H01L41/04H01L41/0477H01L41/1873H01L41/297H01L41/313H01L2224/11H03H3/08H03H9/02574H03H9/02929H03H9/14538
    • Provided are a piezoelectric device that allows for an improvement in the power durability of an electrode formed on a piezoelectric thin film and a significant reduction in etchant concentration or etching time and a method for manufacturing such a piezoelectric device. Among a +C plane (22) on the +Z axis side of a piezoelectric thin film (20) and a -C plane (12) on the -Z axis side of the piezoelectric thin film (20), the -C plane (12) on the -Z axis side of the piezoelectric thin film (20) is etched. Thus, -Z planes (21) of the piezoelectric thin film (20) on which epitaxial growth is possible are exposed. Ti is epitaxially grown on the -Z planes (21) of the piezoelectric thin film (20) in the -Z axis direction such that the crystal growth plane thereof is parallel to the -Z planes (21) of the piezoelectric thin film (20). Al is then epitaxially grown on the surface of the Ti electrode (65) in the -Z axis direction such that the crystal growth plane thereof is parallel to the -Z planes (21) of the piezoelectric thin film (20).
    • 本发明提供一种压电装置做允许对在形成于压电薄膜和在蚀刻剂浓度,蚀刻时间显著减少和用于制造压电装置搜索的方法的电极的功率耐久性的改善。 中的+ C面(22)上的压电薄膜(20)和在所述压电薄膜(20)的Z轴侧的-c面(12)的+ Z轴侧,C面( 12)上的压电薄膜的-Z轴侧(20)被蚀刻。 因此,压电薄膜(20),其上的外延生长是可能的Z平面(21)被暴露。 Ti的外延生长在所述压电薄膜的-Z面(21)(20)在所测试的Z轴方向的平面内做其晶体生长是平行于压电薄膜的Z平面(21)(20 )。 的Al,然后外延生长在所测试的Z轴方向的钛电极(65)的表面上做了其晶体生长面是平行于压电薄膜(20)的Z平面(21)。