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    • 10. 发明公开
    • Electrolytic cleaning method for metal surfaces of electronic components
    • Elektrolytisches ReinigungsverfahrenfürMetalloberflächevon elektronischen Bauelementen。
    • EP0571015A1
    • 1993-11-24
    • EP93201321.2
    • 1993-05-07
    • Meco Equipment Engineers B.V.
    • van der Heijden, Henricus Johannes
    • H01L21/48C25F1/00C25F1/02C25F1/04
    • H01L21/4864C25F1/00H01L2924/0002H01L2924/00
    • This invention relates to a method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices and similar electronic components by immersing such components in a water based solution of one or more organic solvents, conducting salts and a wetting agent and whereby the components to be cleaned are connected to the negative pole of a source of direct current, of which the positive pole is connected to an anode in the same solution and whereby during passing a current through the solution the pH of the liquid film directly adjecent to the cathodic metallic surface is raised to a value at which the solvent causes a softening action on the plastic mold flash or bleed, which is sufficient to enable the hydrogen gas, generated simultaneously on the cathode to remove the plastic mold flash or bleed from the metal surface.
      The invention relates also to a composition of a water based solution to be used with this method.
    • 本发明涉及一种通过将这些组分浸入一种或多种有机溶剂,导电盐和润湿剂的水基溶液中来电除去塑料模具闪蒸或从半导体器件和类似电子部件的金属表面渗出的方法,以及 由此待清洁的部件连接到直流电源的负极,其中正极连接到同一溶液中的阳极,并且在通过电流通过溶液时,液膜的pH直接邻接 将阴极金属表面升高到溶剂对塑料模具闪光或渗色引起的软化作用的值,其足以使得在阴极上同时产生的氢气能够从塑料模具中闪蒸或渗出 金属表面。 本发明还涉及与该方法一起使用的水溶液的组成。