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1. 发明公开

EP1133437A4 CUSHIONED WAFER CONTAINER 有权
标题翻译：蒸晶片容器
公开(公告)号：EP1133437A4
公开(公告)日：2008-04-09
申请号：EP99933631
申请日：1999-07-09
申请人： ENTEGRIS INC
发明人： BORES GREGORY W , ZABKA MICHAEL C
IPC分类号： B65D57/00 , B65D85/90 , B65D85/00 , B65D85/86 , H01L21/00 , H01L21/673
CPC分类号： H01L21/67369 , H01L21/67383 , Y10T29/49826
摘要： A wafer container comprising a receptacle (90) and door (20) and having two distinct levels of support axially offset from one another. The first level of support is by wafer shelves (106) contacting the bottom surface at the left side and right side of each wafer. The second level of support is provided by cushions (40, 120) securing the wafer at the front edge and back edge without one support at the left and right edges. The cushions on the door and at the rear of the receptacle are preferably removable such as by folding or compressing. The cushions preferably have V-shaped engaging elements (46) to constrain the wafer edge and to provide a ramp (55, 133) to guide and lift the front and rear edges of the wafer from the first level to the second level of support when the door is placed in position in the open front of the container.

2. 发明公开

EP1414719A1 THIN WAFER CARRIER 审中-公开
标题翻译：载体薄板
公开(公告)号：EP1414719A1
公开(公告)日：2004-05-06
申请号：EP02752306.7
申请日：2002-07-12
申请人： Entegris, Inc.
发明人： SIMPSON, Anthony , WISEMAN, Brian
IPC分类号： B65D85/90
CPC分类号： H01L21/67326 , Y10S206/832
摘要： A wafer carrier (100) for carrying a plurality of axially aligned thin circular wafers. The wafer carrier has a framework portion (101) formed from a pair of end members (102, 106) connected by a plurality of side support members (118, 119). A pair of opposing sidewall (110) assemblies is positioned between the pair of end members, and is attached to at least one side support member. Each sidewall assembly has a plurality of shelves (111) defining a plurality of slots (112) for receiving a wafer (W). The sidewall assemblies are formed from a plurality of stacked together individual shelf members (150). Each shelf member has a body portion with an upper surface and a lower surface. The lower surface has a plurality of pegs (158) which are positioned to be received by a plurality of apertures (159) formed in the upper surface of an immediately adjacent individual shelf member (150).

3. 发明公开

EP3514824A1 DRYING BOX FOR STORING SOLAR CELL CHIPS 审中-公开
公开(公告)号：EP3514824A1
公开(公告)日：2019-07-24
申请号：EP17877377.6
申请日：2017-12-29
申请人： Miasolé Equipment Integration (Fujian) Co., Ltd.
发明人： HU, Chao , SUN, Hongxia , SHU, Yi , CHEN, Fan , PAN, Deng , ZHU, Pengjian , XU, Guojun , LONG, Wei
IPC分类号： H01L21/67 , H01L21/673 , B65D85/90
摘要： The present application discloses a drying box for storing solar cell chips including a box body (1). Within the box body (1) is installed a top cover (2) that is reversibly opened and divides an inner chamber of the box body (1) into a storage chamber (13) at a lower part and a temporary storage chamber (14) at an upper part, and a side wall of the temporary storage chamber (14) is provided with a purge hole (3). The drying box further includes a control cabinet (4) disposed at one end of the box body (1). The control cabinet (4) is provided with a central controller as well as a purge controller and a drive device (5) electrically connected to the central controller. An inlet end of the purge controller is connected to a gas source and an outlet end is connected to the purge hole (3) through a gas pipe. The drive device (5) is connected to the top cover (2). The present application can effectively reduce the contact time of the cell chips and the air, and reduce the amount of water absorbed by the cell chips from the air, so as to ensure the photoelectric conversion efficiency of the cell chips.

4. 发明公开

EP3030212A1 LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS 有权转让
标题翻译： LANGFRISTIGE VERPACKUNGFÜRDEN SCHUTZ EINER IMPLANTATELEKTRONIK
公开(公告)号：EP3030212A1
公开(公告)日：2016-06-15
申请号：EP14834336.1
申请日：2014-03-25
申请人： California Institute of Technology
发明人： TAI, Yu-Chong , CHANG, Han-Chieh
IPC分类号： A61J1/00 , B65D85/86 , B65D85/90 , A61F2/14 , A61B90/00
CPC分类号： H05K3/4038 , A61F9/0017 , H01L23/3135 , H01L2224/73204 , H01L2924/0002 , H05K1/032 , H05K3/0041 , H05K3/281 , H05K3/282 , H05K3/284 , H05K3/285 , H05K3/381 , H05K2201/017 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10075 , H05K2201/10083 , H05K2201/10287 , H05K2201/10356 , H05K2203/0139 , H05K2203/0514 , H05K2203/1316 , H05K2203/1322 , H05K2203/1338 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.
摘要翻译：本发明提供了一种微封装装置，包括：用于固定装置的基板; 附着在所述基底上的腐蚀屏障; 可选地，至少一个馈通设置在所述衬底中，以允许至少一个输入和/或至少一条输出线进入所述微封装装置; 以及被配置为封装所述微封装设备的封装材料层。

5. 发明公开

EP2303721A4 TRANSPORT PACKAGE 审中-公开
标题翻译：运输包装
公开(公告)号：EP2303721A4
公开(公告)日：2012-04-04
申请号：EP09800620
申请日：2009-07-03
申请人： SCHOELLER ARCA SYSTEMS AB
发明人： HOLGESSON MAGNUS
IPC分类号： B65D85/90 , B65D19/00 , B65D19/06 , B65D81/05 , H01L21/673 , H05K7/14
CPC分类号： H01L21/67369 , B65D19/0016 , B65D81/052 , B65D81/127 , B65D2213/02 , B65D2519/00034 , B65D2519/00069 , B65D2519/00179 , B65D2519/00213 , B65D2519/00268 , B65D2519/00288 , B65D2519/00333 , B65D2519/00497 , B65D2519/00597 , B65D2519/00641 , B65D2519/00711 , B65D2519/0081 , B65D2519/0086 , B65D2519/00915 , H01L21/67363

6. 发明公开

EP1556209A4 HIGH TEMPERATURE, HIGH STRENGTH, COLORABLE MATERIALS FOR DEVICE PROCESSING SYSTEMS 审中-公开
标题翻译：高强高温材料设备处理系统
公开(公告)号：EP1556209A4
公开(公告)日：2009-07-01
申请号：EP03770728
申请日：2003-10-09
申请人： ENTEGRIS INC
发明人： EXTRAND CHARLES W , BUCHA ROBERT
IPC分类号： H01L21/68 , B32B1/02 , B65D85/86 , B65D85/90 , F16L1/00 , H01L21/673
CPC分类号： H01L21/6733 , H01L21/67336 , Y10T428/13 , Y10T428/1352
摘要： Electrostatic-discharge safe devices for processing electronic components, e.g., matrix trays, chip trays, and wafer carriers are disclosed that are made from a mixture of a high temperature, high strength polymer and at least one metal oxide, and optionally with at least one pigment. The use of the metal oxides as conductive materials advantageously allows for light-colored electrostatic-discharge safe materials to be made. Such materials may be colored with pigments without compromise of material performance specifications.

7. 发明公开

EP1680805A4 WAFER CARRIER DOOR 审中-公开
标题翻译：晶片载体DOOR
公开(公告)号：EP1680805A4
公开(公告)日：2009-01-14
申请号：EP04810521
申请日：2004-11-08
申请人： ENTEGRIS INC
发明人： BURNS JOHN , FULLER MATTHEW A , KING JEFFREY J , FORBES MARTIN L , SMITH MARK V
IPC分类号： B65D85/90 , A47G19/08 , B08B3/00 , B08B3/02 , B08B9/00 , B08B9/093 , H01L20060101 , H01L21/00 , H01L21/68
CPC分类号： H01L21/67373 , H01L21/67386
摘要： A wafer carrier door having an inner door portion and an outer door portion. The inner door portion has a substantially continuous inner surface. The outer door portion extends over at least a portion of the inner door portion. The outer door portion has a plurality of apertures formed therein. The outer door portion is attached to the inner door portion.

8. 发明授权

EP1436218B1 A BAG 有权
公开(公告)号：EP1436218B1
公开(公告)日：2006-08-02
申请号：EP01979213.4
申请日：2001-10-19
申请人： Infineon Technologies AG
发明人： SURATTEE, Najib, Khan , THANG, Tak, Seng , LOH, CHee, Ping, Benedict , NG, Bee, Poh, Christine , ONG, Wai, Lian, Jenny , YEONG, Kok, Cheong, Bernard , TYE, Ching, Yun
IPC分类号： B65D85/90 , B65D81/26 , H01L21/00 , H05K13/00 , G01N13/22
CPC分类号： H01L21/67353 , B65D79/02 , B65D81/267 , B82Y15/00 , H01L21/67366 , H01L21/67386 , H01L21/67393
摘要： A bag (1) has side walls (3, 4) that are substantially impervious to moisture. The bag has an opening (6) at one end that is adapted to be sealed. A portion (11) of a side wall includes a substantially transparent material (12) which is substantially impervious to moisture. A moisture indicating material (13) is mounted within the bag adjacent to the transparent material (12) to enable the moisture indicating material (13) to be viewed through the transparent material, and at least a portion of the moisture indicator material (13) is exposed to air within the bag (1).

9. 发明公开

EP0972716A1 COVER-CARRYING THIN SHEET STORAGE CONTAINER 失效
标题翻译： DUNNWANDIGERLAGERUNGSBEHÄLTERAUSGERÜSTETMIT EINEM DECKEL
公开(公告)号：EP0972716A1
公开(公告)日：2000-01-19
申请号：EP97926240.9
申请日：1997-06-13
申请人： KAKIZAKI MANUFACTURING CO., LTD.
发明人： HYOBU, Yukihiro, Kakizaki Manufacturing Co., Ltd
IPC分类号： B65D43/02 , B65D55/02 , B65D85/38 , B65D85/90 , H01L21/68
CPC分类号： H01L21/67373 , H01L21/67376
摘要： The present invention provides a lid-mounted thin-plate housing container 1 having a container body 2 for housing and supporting a plurality of silicon wafers 4, and a lid 3 detachably mounted to the container body 2 for sealing the interior thereof. There is provided a magnetic force operating unit 11 for operating magnetic force generated between the container body 2 and the lid 3. The magnetic force operating unit 11 includes magnets 8 and 22 at positions which lie in the container body 2 and the lid and correspond to each other, and driving means 23 for moving the magnet 22. When the magnet 22 is aligned with the magnet 8 by the driving means, the magnets 22 and 8 attract each other to secure the lid 3 to the container body 2. When the magnet 22 is displaced from the magnet 8, the lid 3 having been secured is released, so that the lid 3 can be easily removed. In the lid 3, there is provided a seal 14 having a tongue portion 14A. The tongue portion 14A reliably seals the interior without raising the internal pressure. The magnets may be replaced by a coil 52 and a magnetic member.
摘要翻译：本发明提供一种具有容纳主体2的容器主体2的盖安装薄板容纳容器1，该容器主体2用于容纳和支撑多个硅晶片4，以及可拆卸地安装到容器主体2上用于密封其内部的盖3。设置有用于操作在容器主体2和盖3之间产生的磁力的磁力操作单元11.磁力操作单元11在位于容器主体2和盖子中的位置处包括磁体8和22，并且对应于以及用于移动磁体22的驱动装置23.当磁体22通过驱动装置与磁体8对准时，磁体22和8相互吸引，将盖3固定在容器本体2上。当磁体 22从磁体8移位，已经固定的盖3被释放，从而可以容易地移除盖3。在盖3中，设置有具有舌部14A的密封件14。舌部14A在不升高内压的情况下可靠地密封内部。磁体可以由线圈52和磁性构件代替。

10. 发明授权

EP3030212B1 LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS 有权转让
公开(公告)号：EP3030212B1
公开(公告)日：2023-08-30
申请号：EP14834336.1
申请日：2014-03-25
发明人： TAI, Yu-Chong , CHANG, Han-Chieh
IPC分类号： A61F2/14 , A61F2/02 , A61J1/00 , B65D85/86 , B65D85/90 , A61B90/00

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