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    • 1. 发明公开
    • Information storage systems
    • 信息存储系统
    • EP1587069A2
    • 2005-10-19
    • EP05016134.8
    • 2003-10-24
    • Barnes, Charles Frederick James
    • Barnes, Charles Frederick James
    • G11B5/58G11B21/02
    • G11B5/29G11B5/00G11B5/02G11B5/09G11B5/255G11B5/295G11B5/3103G11B5/3106G11B5/48G11B5/488G11B5/4886G11B5/49G11B5/4907G11B5/4961G11B5/4969G11B5/4976G11B5/4992G11B5/52G11B5/54G11B5/56G11B5/58G11B15/18G11B15/40G11B15/60G11B15/683G11B17/30G11B2005/0002G11B2005/0005
    • An information storage apparatus comprises a one or more storage media (168), which include a plurality of information tracks. Each storage medium (168) has a head assembly (170) having a substantially planar surface and a plurality of read/write heads positioned in registry with said information tracks. The read/write heads are arranged substantially in the plane of the planar surface. The information storage medium (168) and the head assembly (170) are arranged in mutually sliding abutment such that the read/write heads are substantially in sliding contact with the outer surface of the information storage medium in use.
      In another aspect an information storage and retrieval apparatus comprises an information storage medium (168) comprising an information storage area, and an array (170) of information read and/or write heads. The information storage medium (168) and array of heads (170) are arranged to be oscillated with respect to each other in use such that each region of the information storage area is aligned with at least one of the read/write heads during the oscillation.
    • 信息存储设备包括一个或多个存储介质(168),其包括多个信息轨道。 每个存储介质(168)具有头部组件(170),该头部组件具有基本上平坦的表面以及与所述信息轨道对齐定位的多个读/写头。 读/写头基本上布置在平坦表面的平面中。 信息存储介质(168)和磁头组件(170)被设置成相互滑动邻接,使得读/写头在使用中基本上与信息存储介质的外表面滑动接触。 在另一方面,信息存储和检索装置包括信息存储介质(168),其包括信息存储区域和信息读取和/或写入头的阵列(170)。 信息存储介质(168)和磁头阵列(170)被布置为在使用中相对于彼此振荡,使得信息存储区域的每个区域在振荡期间与读/写头中的至少一个对齐 。
    • 2. 发明公开
    • Data transfer head
    • Datentransferkopf。
    • EP0568257A1
    • 1993-11-03
    • EP93303085.0
    • 1993-04-21
    • International Business Machines Corporation
    • McKay, Jeffrey MerrittNishihira, Henry ShuseiTam, Andrew Ching
    • G11B5/48G11B5/31
    • G11B5/6005G11B5/3103G11B5/4806G11B5/4813G11B5/4833G11B5/484G11B5/49G11B21/00Y10T29/49032Y10T29/49041
    • A data transfer head 22 comprises a combination assembly formed from an integrated suspension 26, slider 24 and transducer 25. The combination transducer-slider-suspension assembly is batch produced by forming a plurality of the combination assemblies onto a single wafer 100. The wafer is then diced to separate the assemblies into individual sections 106, 108. The transducers are deposited onto the wafer and the air bearing surface formed. Conductors 42 to interconnect each transducer with the external circuits are insulated from the wafer and deposited along a path which will form the suspension. A spring-like resilient layer is then deposited over and electrically insulated from the conductors. The wafer is then pattern etched to remove a portion of the wafer backside to form the suspension. Integrated circuit amplifiers 56 can be deposited at the free end of the conductors prior to separation of individual assemblies.
    • 数据传送头22包括由集成悬架26,滑块24和换能器25形成的组合组件。通过在单个晶片100上形成多个组合组件来批量生产组合传感器 - 滑块 - 悬挂组件。晶片是 然后切割以将组件分离成单独的部分106,108。将换能器沉积到晶片上并形成空气轴承表面。 将每个换能器与外部电路互连的导体42与晶片绝缘,并沿着将形成悬架的路径沉积。 然后将弹簧状弹性层沉积在导电体上并与导体电绝缘。 然后对晶片进行图案蚀刻以去除晶片背面的一部分以形成悬浮液。 集成电路放大器56可以在分离各个组件之前在导体的自由端处沉积。