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1. 发明授权

EP1135794B1 A METHOD AND APPARATUS FOR THE TRANSPORT AND TRACKING OF AN ELECTRONIC COMPONENT 有权
标题翻译：方法和设备运输和电子元件的追求
公开(公告)号：EP1135794B1
公开(公告)日：2008-04-23
申请号：EP99963020.5
申请日：1999-12-03
申请人： FormFactor, Inc.
发明人： ONDRICEK, Douglas, S. , PEDERSEN, David, V.
IPC分类号： H01L21/00
CPC分类号： G01R1/0433 , G01R31/01 , H01L23/544 , H01L2223/54473 , H01L2924/0002 , H05K3/325 , H05K2201/09472 , H01L2924/00
摘要： An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test board for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon.

2. 发明公开

EP1455388A1 RELIABILITY EVALUATION TESTER, RELIABILITY EVALUATION TEST SYSTEM, CONTACTOR, AND RELIABILITY EVALUATION TEST METHOD 有权
标题翻译：系统VERFAHREN ZURZUVERLÄSSIGKEITSBEWERTUNG
公开(公告)号：EP1455388A1
公开(公告)日：2004-09-08
申请号：EP02788667.0
申请日：2002-11-27
申请人： TOKYO ELECTRON LIMITED , Kabushiki Kaisha Toshiba , IBIDEN CO., LTD.
发明人： Takekoshi, Kiyoshi, TOKYO ELECTRON AT LIMITED , Hosaka, Hisatomi, TOKYO ELECTRON AT LIMITED , Hagihara, Junichi, TOKYO ELECTRON AT LIMITED , Hatsushika, Kunihiko, TOKYO ELECTRON AT LIMITED , Usui, Takamasa , Kaneko, Hisashi , Hayasaka, Nobuo , Ido, Yoshiyuki
IPC分类号： H01L21/66
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus (10) of this invention includes a wafer storage section (12) which stores a wafer (W) in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor (11) are totally in electrical contact with each other. The wafer storage section (12) transmits/receives a test signal to/from a measurement section (15) and has a hermetic and heat insulating structure. The wafer storage section (12) has a pressure mechanism (13) which presses the contactor (11) and a heating mechanism (14) which directly heats the wafer (W) totally in contact with the contactor (11) to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置（10）包括晶片储存部（12），其存储晶片（W）的状态，其中形成在晶片上的多个器件的电极焊盘和接触器（11 ）彼此完全电接触。晶片存储部分（12）向/从测量部分（15）发送/接收测试信号，并具有密封和隔热结构。晶片储存部分（12）具有压力接触器（11）的压力机构（13）和将与接触器（11）完全接触的晶片（W）直接加热至预定高温的加热机构（14）。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

3. 发明公开

EP1135794A1 A METHOD AND APPARATUS FOR THE TRANSPORT AND TRACKING OF AN ELECTRONIC COMPONENT 有权
标题翻译：方法和设备运输和电子元件的追求
公开(公告)号：EP1135794A1
公开(公告)日：2001-09-26
申请号：EP99963020.5
申请日：1999-12-03
申请人： FORMFACTOR, INC.
发明人： ONDRICEK, Douglas, S. , PEDERSEN, David, V.
IPC分类号： H01L21/00
CPC分类号： G01R1/0433 , G01R31/01 , H01L23/544 , H01L2223/54473 , H01L2924/0002 , H05K3/325 , H05K2201/09472 , H01L2924/00
摘要： An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test board for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon.

4. 发明公开

EP1092338A1 ASSEMBLY OF AN ELECTRONIC COMPONENT WITH SPRING PACKAGING 有权
标题翻译：电子元件由弹簧组总成
公开(公告)号：EP1092338A1
公开(公告)日：2001-04-18
申请号：EP99933638.1
申请日：1999-06-30
申请人： FORMFACTOR, INC.
发明人： PEDERSEN, David, V. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, Y.
IPC分类号： H05K3/32
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

5. 发明公开

EP0757413A3 Adapter mit einem eine Kontaktierungsvorrichtung aufweisenden Träger 失效
标题翻译：适配器与具有接触支撑
公开(公告)号：EP0757413A3
公开(公告)日：1998-05-20
申请号：EP96110559
申请日：1996-06-29
申请人： KONTRON ELEKTRONIK
发明人： HORAK DIETER , HABERMAYR ERWIN
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R13/22 , H01R31/06 , H01R33/76 , H05K7/10
CPC分类号： G01R1/0433 , H01L2924/0002 , H01R13/22 , H01R31/06 , H05K7/1023 , Y10S439/912 , H01L2924/00
摘要： Bei einem Adapter mit einem eine Kontaktierungsvorrichtung aufweisenden Träger zur elektrischen Verbindung von elektrischen Kontakten eines auf einer Platine aufgebrachten elektronischen Bauteils mit einem Testgerät wird die Kontaktierungsvorrichtung durch ein kontakteübergreifendes elektrisches Verbindungsstück mit rasterförmigen Leitungsabschnitten gebildet.
Vorzugsweise weist der Träger mindestens einen Durchbruch für eine lösbare mechanische Verbindung mit dem elektronischen Bauteil oder mit der Platine auf.

6. 发明公开

EP0809328A2 Electrical interconnect contact system 失效
标题翻译： Elektrisches Verbindungskontaktsystem
公开(公告)号：EP0809328A2
公开(公告)日：1997-11-26
申请号：EP97400942.5
申请日：1997-04-25
申请人： JOHNSTECH INTERNATIONAL CORPORATION
发明人： Johnson, David A. , Kline, Eric V. , Fulcher, Donald L.
IPC分类号： H01R13/24
CPC分类号： H01R13/2414 , G01R1/0433 , G01R1/0466 , H01R12/714 , H01R13/2435 , H05K7/1046 , H05K7/1069
摘要： A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus may include a contact engagable by the lead and further engagable by the spaced terminal. An elastomeric element is provided to bias the contact in an original position. As the contact is engaged by the lead, the elastomeric element may deform to permit movement of the contact. It is contemplated that the elastomeric element may be shaped, relative to the contact, to provide at least one spatial relief region between the elastomeric element and the contact. Further, it is contemplated that the elastomeric element may have one or more cavities formed therein to provide at least one spatial relief region. Finally, it is contemplated that the contact housing may be designed to provide at least one spatial relief region adjacent the elastomeric element. Accordingly, as a force to applied to the contact via a lead or the like, the elastomeric element may become deformed, causing a portion of the deformed elastomeric element to extend at least partially into the at least one spatial relief region. It has been found that by providing even a modest spatial relief region adjacent the elastomeric element, the lifetime of the elastomeric element may be substantially increased.
摘要翻译：一种用于将设备的引线电连接到与引线间隔一定距离的端子的连接器。该装置可以包括由引线接合并且可由间隔开的端子进一步接合的触点。提供弹性体元件以将接触件偏置在原始位置。当接触件被引线接合时，弹性体元件可以变形以允许接触件移动。可以设想，弹性体元件可以相对于接触件成形，以在弹性体元件和接触件之间提供至少一个空间浮雕区域。此外，预期弹性体元件可以具有形成在其中的一个或多个空腔以提供至少一个空间释放区域。最后，可以想到，接触壳体可被设计成提供与弹性体元件相邻的至少一个空间浮雕区域。因此，作为通过引线等施加到接触件的力，弹性体元件可能变形，导致变形的弹性体元件的一部分至少部分地延伸到至少一个空间释放区域中。已经发现，通过提供邻近弹性体元件的适度的空间释放区域，弹性体元件的寿命可以显着增加。

7. 发明公开

EP0793807A1 METHOD AND DEVICE FOR TESTING OF ELECTRONIC COMPONENTS 失效
标题翻译：方法和设备用于测试电子组件
公开(公告)号：EP0793807A1
公开(公告)日：1997-09-10
申请号：EP95938697.0
申请日：1995-11-24
申请人： TELEFONAKTIEBOLAGET LM ERICSSON
发明人： GUSTAFSON, Ake
IPC分类号： G01R31 , G01R1 , G06F11 , H05K13
CPC分类号： G01R31/2886 , G01R1/0433
摘要： A test assembly for use in testing electronic components, preferably surface mount IC-circuit components, includes a carrier (4) by means of which a component (2) is picked-up and brought to and held against the conductors (6) on a printed circuit board (5). The printed circuit board (5) includes at least one cavity (9) underneath the contact conductors (6) in the region where the component (2) is to be held, such as to render the conductors resilient. Pressure pads (7) are placed in the cavity (9) between the bottom of the cavity and the contact conductors (6) such as to regulate the resilience of the conductors (6).

8. 发明授权

EP0457472B1 Socket 失效
标题翻译：接收插座。
公开(公告)号：EP0457472B1
公开(公告)日：1995-02-15
申请号：EP91304089.5
申请日：1991-05-07
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Ikeya, Kiyokazu , Yamazaki, Osamu
IPC分类号： H01R13/635
CPC分类号： H05K7/1023 , G01R1/0433 , H01R13/631 , H01R13/635

9. 发明公开

EP0538010A3 Semiconductor package, a holder, a method of production and testing for the same 失效
标题翻译：半导体封装，夹具，其生产和测试方法
公开(公告)号：EP0538010A3
公开(公告)日：1993-05-19
申请号：EP92309366.0
申请日：1992-10-14
申请人： FUJITSU LIMITED , KYUSHU FUJITSU ELECTRONICS LIMITED , FUJITSU AUTOMATION LIMITED
发明人： Kasai, Junichi, c/o FUJITSU LIMITED , Tsuji, Kazuto, c/o FUJITSU LIMITED , Taniguchi, Norio, c/o FUJITSU LIMITED , Yoneda, Yoshiyuki, c/o FUJITSU LIMITED , Takenaka, Masashi, c/o FUJITSU LIMITED , Mashiko, Takashi, c/o FUJITSU AUTOMATION LIMITED , Sakuma, Masao, c/o FUJITSU AUTOMATION LIMITED , Saigo, Yukio, c/o KYUSHO FUJITSU ELECTRONICS LTD
IPC分类号： H01L23/31 , H01L23/495 , H01L21/66 , H01L21/68 , H01L21/00
CPC分类号： G01R1/0433 , G01R1/04 , H01L21/565 , H01L21/6835 , H01L22/32 , H01L23/3107 , H01L23/4334 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49572 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68313 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device comprises a plurality of leads (225) respectively made up of an inner lead (5, 93a, 225a) and an outer lead (8, 93b, 225b), a semiconductor chip (4, 223) electrically connected to the inner leads of the leads, and a package (7, 221) encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package (7, 221) has an upper part (7a, 221a) and a lower part (7b, 221b) which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads (8, 93b) have a wide part (21) which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

10. 发明公开

EP0457472A1 Socket 失效
标题翻译： Aufnahmesockel。
公开(公告)号：EP0457472A1
公开(公告)日：1991-11-21
申请号：EP91304089.5
申请日：1991-05-07
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Ikeya, Kiyokazu , Yamazaki, Osamu
IPC分类号： H01R13/635
CPC分类号： H05K7/1023 , G01R1/0433 , H01R13/631 , H01R13/635
摘要： A socket for mounting an integrated circuit chip (50) to electrically connect chip leads (51) in a test circuit during burn-in testing of the chip has rotably-mounted chip holders (60) and has a plurality of resilient contacts (90) arranged to be movable with forward motion of a reciprocating member to displace the holders and contacts against a bias force to receive the chip in the socket. The holders and contacts are movable with return motion of the reciprocating member to return to their original positions in response to the noted bias to detachably retain the chip in the socket and resiliently engage the contacts with respective chip leads with selected force. A rotably movable subordinate lever element (111) engages the reciprocating member and the contacts to facilitate moving of the contacts as a group between their original and displaced positions in response to movement of the reciprocating member.
摘要翻译：在芯片的老化测试期间，用于安装集成电路芯片（50）以电连接测试电路中的芯片引线（51）的插座具有可旋转安装的芯片保持器（60），并且具有多个弹性触点（90）布置成随着往复运动构件的向前运动而移动，以抵抗偏置力移动保持器和接触件，以将插座中的芯片接收。保持器和接触件可随着往复运动构件的返回运动而移动，以响应于所指示的偏压而返回到其原始位置，以将芯片可拆卸地保持在插座中并且以选定的力弹性地接合与相应的芯片引线的触点。可旋转移动的下级杠杆元件（111）接合往复运动元件和触点，以便于响应于往复运动元件的移动，将触点作为一组在其原始位置和位移位置之间移动。

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