专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2234119A4 COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF, COPPER CONDUCTOR WIRING AND MANUFACTURING METHOD THEREOF, AND TREATMENT SOLUTION 审中-公开
标题翻译：铜导体膜及其制造方法，导电性基板及其制造方法的铜导体布线及其制造方法和处理液
公开(公告)号：EP2234119A4
公开(公告)日：2015-04-15
申请号：EP08861192
申请日：2008-12-17
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAKO HIDEO , YAMAMOTO KAZUNORI , KUMASHIRO YASUSHI , MACHII YOUICHI , YOKOZAWA SHUNYA , EJIRI YOSHINORI , MASUDA KATSUYUKI
IPC分类号： H01B5/14 , C23C18/16 , C23C18/18 , C23C18/30 , C23C18/40 , H01B13/00 , H01L21/60 , H01L23/00 , H05K3/10 , H05K3/12 , H05K3/18
CPC分类号： H05K3/182 , C23C18/1601 , C23C18/1603 , C23C18/1633 , C23C18/1635 , C23C18/1637 , C23C18/1824 , C23C18/1872 , C23C18/30 , C23C18/40 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29294 , H01L2224/29347 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/203 , H05K3/105 , H05K3/1241 , H05K2203/0315 , H05K2203/0709 , H05K2203/1157 , H05K2203/125 , Y10T428/12014 , Y10T428/12903 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/0002
摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

2. 发明公开

EP1745163A1 METHOD FOR PRODUCING ELECTROPLATED PLASTIC SANITARY ARTICLES 有权
标题翻译：工艺用于制造塑料镀锌卫生用品
公开(公告)号：EP1745163A1
公开(公告)日：2007-01-24
申请号：EP06743085.0
申请日：2006-05-30
申请人： Hansgrohe AG
发明人： FATH, Andreas
IPC分类号： C25D5/02 , C25D5/56
CPC分类号： C25D5/022 , C23C18/1605 , C23C18/1653 , C23C18/1824 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/54 , C25D7/04 , C25D17/06 , Y10T29/49432 , Y10T29/49433
摘要： In a method for producing plastic sanitary articles with surfaces metallized by electroplating, before it is metallized by electroplating using an external current source the sanitary article has at least one electrically nonconductive component. This component at least partially decouples the water-carrying regions of the sanitary article at least partially from the current flow during metallization by electroplating using the external current source. The component is preferably a separate component which can be reversibly connected to the sanitary article. The invention also includes the component for decoupling the current itself and a sanitary article provided with the component.

3. 发明公开

EP2458030A1 Method of coating a part of a heat exchanger and heat exchanger 审中-公开
标题翻译： Verfahren zum Beschichten eines Teils einesWärmetauschersundWärmetauscher
公开(公告)号：EP2458030A1
公开(公告)日：2012-05-30
申请号：EP10193194.7
申请日：2010-11-30
申请人： Alfa Laval Corporate AB
发明人： Zheng, Jie
IPC分类号： C23C18/16 , C23C18/18 , C23C18/32 , F28F19/00
CPC分类号： F28F19/06 , C23C18/1616 , C23C18/1669 , C23C18/1676 , C23C18/1824 , C23C18/1831 , C23C18/32 , F28F21/089 , F28F2245/00
摘要： A method of coating an internal surface of an assembled heat exchanger is provided. The heat exchanger (2) comprising a first passage for a first heat exchange fluid, and a second passage for a second heat exchange fluid. The first and second passages are separated by at least one heat transfer element. The heat transfer element has a first surface facing the first passage. The method comprises; pre-treating the first surface by circulating at least one pre-treatment liquid through the first passage of the heat exchanger (2) and a pre-treatment liquid storage (38) separate from the heat exchanger, and electroless nickel plating the first surface by circulating a solution comprising nickel ions through the first passage of the heat exchanger (2) and a solution container (40) separate from the heat exchanger (2). A heat exchanger comprising a nickel plating is also disclosed.
摘要翻译：提供了一种涂覆组装的热交换器的内表面的方法。所述热交换器（2）包括用于第一热交换流体的第一通道和用于第二热交换流体的第二通道。第一和第二通道由至少一个传热元件隔开。传热元件具有面向第一通道的第一表面。该方法包括：通过使热交换器（2）的第一通道和与热交换器分开的预处理液体储存器（38）循环至少一个预处理液体来预处理第一表面，以及通过将包含镍离子的溶液循环通过热交换器（2）的第一通道和与热交换器（2）分开的溶液容器（40）。还公开了一种包括镀镍的热交换器。

4. 发明公开

EP2055419A1 Method of soldering a magnesium alloy workpiece with electroless plating with Nickel-Phosphrous, fluxing and use of a leadfree tin alloy solder 审中-公开
标题翻译：一种用于使用镍 - 磷，一个Flüssimittels和自由铅 - 锡合金焊接材料的化学镀焊接由镁合金制成的工件的方法
公开(公告)号：EP2055419A1
公开(公告)日：2009-05-06
申请号：EP08251752.5
申请日：2008-05-20
申请人： Magtech Technology Co., Ltd
发明人： Ho, Climent
IPC分类号： B23K1/00 , B23K1/19 , B23K1/20 , B23K35/26 , B23K35/36 , C23C18/32 , C23C18/50 , C23C18/54
CPC分类号： B23K1/0008 , B23K1/19 , B23K1/203 , B23K35/26 , B23K35/262 , B23K2201/34 , B23K2203/15 , C23C18/165 , C23C18/1689 , C23C18/1824 , C23C18/36
摘要： The present application relates to a method of soldering a magnesium alloy workpiece. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
摘要翻译：本申请涉及到焊接的镁合金工件的方法。该方法包括提供一镁合金工件; 修改所述镁合金工件的表面上; 执行高磷（7〜12重量％的P）的镁合金工件的表面上化学镀镍的过程; 制备用于不同无铅的锡合金焊料的焊料助熔剂; 并进行锡焊接工艺焊接镁合金工件与所述无铅的锡合金焊料含其相应的焊剂。

5. 发明公开

EP1668174A2 PLATING METHOD AND APPARATUS 审中-公开
标题翻译：方法和设备的金属沉积
公开(公告)号：EP1668174A2
公开(公告)日：2006-06-14
申请号：EP04788461.4
申请日：2004-09-29
申请人： EBARA CORPORATION
发明人： KURIYAMA, Fumio, c/o Ebara Corporation , KIUMI, Rei, c/o Ebara Corporation , SAITO, Nobutoshi c/o Ebara Corporation , TAKEMURA, Takashi, c/o Ebara Corporation , KIMURA, Masaaki c/o Ebara Corporation , TAKEDA, Sachiko c/o Ebara Corporation , GUO, Yugang c/o Ebara Corporation
IPC分类号： C25D5/34 , C25D7/12
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substrate into contact with electrolytic ionized water or performing a team treatment using steam on a surface of a substrate, and plating the surface of the substrate after said applying, exposing, bringing or performing process. A plating method comprising performing a team treatment using steam on a surface of a substrate, and performing a wet process on the surface of the substrate of a substrate with an acidic plating solution, cleaning the surface of the substrate with pure water and cleaning the surface of the substrate with an alkalescent aqueous solution. A plating apparatus adapted to perform at least one of said methods.

6. 发明公开

EP3030688A4 ELECTROLESS NICKEL PLATING SOLUTION AND METHOD 有权
标题翻译： LÖSUNGFÜRCHEMISCHE VERNICKELUNG UND VERFAHREN
公开(公告)号：EP3030688A4
公开(公告)日：2017-06-07
申请号：EP14834142
申请日：2014-07-17
申请人： MACDERMID ACUMEN INC
发明人： JANIK ROBERT , MICYUS NICOLE J
IPC分类号： C23C18/36 , C23C18/18 , C23C18/20 , C23C18/34
CPC分类号： C23C18/1646 , C23C18/1637 , C23C18/1639 , C23C18/1641 , C23C18/1824 , C23C18/1844 , C23C18/1893 , C23C18/2046 , C23C18/2086 , C23C18/34 , C23C18/36
摘要： An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
摘要翻译：描述无电镀镍溶液及其使用方法。无电镀镍溶液包含（i）镍离子源; （ii）还原剂; （iii）一种或多种络合剂; （iv）一种或多种浴稳定剂; （v）增白剂，所述增白剂包含具有磺酸或磺酸盐基团的磺化化合物; 和（vi）任选地，一种或多种另外的添加剂。磺化化合物增白剂的使用导致在具有高光泽值的各种基材上形成明亮的无电镀镍沉积物。

7. 发明公开

EP2606162A1 VERFAHREN ZUM STROMLOSEN VERKUPFERN VON METALLISCHEN SUBSTRATEN 审中-公开
公开(公告)号：EP2606162A1
公开(公告)日：2013-06-26
申请号：EP11744001.6
申请日：2011-08-10
申请人： Chemetall GmbH
发明人： KLEINLE, Michael
IPC分类号： C23C18/38
CPC分类号： C23C18/1633 , C23C18/1637 , C23C18/1651 , C23C18/1653 , C23C18/1689 , C23C18/1824 , C23C18/38 , C23C18/54 , C23C28/023 , Y10T29/49885 , Y10T428/12792 , Y10T428/12903
摘要： The invention relates to a process for treating a metallic surface of an object with an aqueous copper-plating solution, with which a first copper-plating solution, which is free of cyanide and free of strong reducing agent, is electrolessly applied to clean metallic surfaces of the object, or after pretreatment to cleaned metallic surfaces, to form a first copper layer or copper alloy layer as a barrier layer and/or as a conductive layer, and also to the use of the objects produced by the process according to the invention.
摘要翻译：本发明涉及一种用镀铜水溶液处理物体的金属表面的方法，其中无电镀无氰化合物和不含强还原剂的第一镀铜溶液，以清洁金属表面的物体，或者在经清洗的金属表面进行预处理之后，形成作为阻挡层和/或作为导电层的第一铜层或铜合金层，以及使用根据本发明的方法生产的物体。

8. 发明公开

EP2342372A4 METHOD FOR ENHANCING THE SOLDERABILITY OF A SURFACE 有权
标题翻译：方法提高焊曲面的
公开(公告)号：EP2342372A4
公开(公告)日：2013-01-23
申请号：EP09818156
申请日：2009-07-17
申请人： MACDERMID INC
发明人： LONG ERNEST , TOSCANO LENORA M , MCKIRRYHER COLLEEN , ROMAINE PAUL , KOLOGE DONNA , CASTALDI STEVEN A , STEINECKER CARL P
IPC分类号： C25D5/54 , C23C18/16 , C23C18/42 , H05K3/24 , H05K3/28
CPC分类号： H05K3/282 , B23K35/3006 , B23K35/3612 , C23C18/1204 , C23C18/1601 , C23C18/1689 , C23C18/1824 , C23C18/42 , C23C18/54 , H05K3/244
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

9. 发明授权

EP1745163B1 VERFAHREN ZUR HERSTELLUNG VON GALVANISIERTEN SANITÄRGEGENSTÄNDEN AUS KUNSTSTOFF 有权
标题翻译：工艺用于制造塑料镀锌卫生用品
公开(公告)号：EP1745163B1
公开(公告)日：2011-03-16
申请号：EP06743085.0
申请日：2006-05-30
申请人： Hansgrohe AG
发明人： FATH, Andreas
IPC分类号： C25D5/02 , C25D5/56
CPC分类号： C25D5/022 , C23C18/1605 , C23C18/1653 , C23C18/1824 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/54 , C25D7/04 , C25D17/06 , Y10T29/49432 , Y10T29/49433
摘要： In a method for producing plastic sanitary articles with surfaces metallized by electroplating, before it is metallized by electroplating using an external current source the sanitary article has at least one electrically nonconductive component. This component at least partially decouples the water-carrying regions of the sanitary article at least partially from the current flow during metallization by electroplating using the external current source. The component is preferably a separate component which can be reversibly connected to the sanitary article. The invention also includes the component for decoupling the current itself and a sanitary article provided with the component.

10. 发明公开

EP0851041A1 Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs 失效
标题翻译： Inn en rs es rs rs rs rs rs rs rs rs rs rs rs rs rs rs rs rs rs
公开(公告)号：EP0851041A1
公开(公告)日：1998-07-01
申请号：EP97122145.2
申请日：1997-12-16
申请人： KM Europa Metal Aktiengesellschaft
发明人： Baukloh, Achim, Dr. , Reiter, Ulrich, Dr.
IPC分类号： C23C18/31
CPC分类号： C23C18/1824 , C23C18/1601 , C23C18/1616 , C23C18/1676 , C23C18/168 , C23C18/31 , C23C18/54 , F16L58/08
摘要： Die Erfindung betrifft ein Installationsrohr aus Kupfer mit einer vollflächig haftenden temperaturgesteuert aufgebrachten Zinnschicht auf der Innenoberfläche, wobei die Dicke der am Übergang vom Kupferrohr auf die Zinnschicht ausgebildeten intermetallischen Phase kleiner als 20 %, vorzugsweise kleiner als 5% der Gesamtschichtdicke ist. Ferner betrifft die Erfindung ein Verfahren zur Beschichtung eines Installationsrohrs auf chemischem Wege, bei dem die Temperatur der Verzinnungslösung gezielt variiert wird. Zur Gewährleistung einer möglichst geringen intermetallischen Phase an der Kupferoberfläche beginnt man den Verzinnungsprozeß bei einer geringen Temperatur. Hierdurch wird die Bildung einer großen Zahl von gleichmäßig verteilten Kristallkeimen gleicher Orientierung gefördert. Anschließend wird die Temperatur gezielt so eingestellt, daß das Wachsen der Kristalle gesteigert wird und diese mit gleichbleibender Orientierung schnell wachsen. Man erzielt dann eine dichte Zinnschicht mit geringer freier Oberfläche.
摘要翻译：具有内部锡层的铜管以受控的温度施加并且在其整个区域上与管道结合，其特征在于，从铜管到锡层的过渡处的金属间相的厚度小于总层厚度的20％，优选小于5％。铜管的内部涂布方法的特征在于镀锡溶液的温度变化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式