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1. 发明授权

EP2823695B1 A MEMS MICRO-MIRROR ASSEMBLY 有权转让
公开(公告)号：EP2823695B1
公开(公告)日：2018-10-24
申请号：EP13703592.9
申请日：2013-02-11
申请人： Intel Corporation
发明人： KHECHANA, Faouzi , ABELÉ, Nicolas
IPC分类号： H05K1/02 , G02B26/08 , H05K1/11 , H05K1/18
CPC分类号： G02B26/085 , B81B7/007 , B81B2201/042 , B81B2207/098 , B81C1/00214 , B81C1/00873 , B81C3/005 , B81C2203/054 , B81C2203/057 , G02B7/1821 , G02B26/0833 , G02B26/105 , G03B21/008 , H01L2224/48091 , H01L2924/1461 , H05K1/0269 , H05K1/0281 , H05K1/118 , H05K1/189 , H05K3/328 , H05K3/34 , H05K2201/083 , H05K2201/10083 , H05K2203/049 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirro rassembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).

2. 发明授权

EP3169449B1 TILED CMUT DIES WITH PITCH UNIFORMITY 有权
标题翻译： TILED CMUT模具具有针距均匀性
公开(公告)号：EP3169449B1
公开(公告)日：2018-03-21
申请号：EP15735707.0
申请日：2015-07-13
申请人： Koninklijke Philips N.V. , Technische Universiteit Delf
发明人： SUDOL, Wojtek , DIRKSEN, Peter , HENNEKEN, Vincent Adrianus , DEKKER, Ronald , LOUWERSE, Marcus Cornelis
IPC分类号： B06B1/02 , G01N29/24 , G01N29/26 , H04R19/00 , B81C1/00
CPC分类号： B06B1/0292 , B81C1/00214 , G01N29/2406 , G01N29/262 , G01N2291/02475 , G01N2291/106 , H04R19/00
摘要： A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.

3. 发明公开

EP2823695A1 A MEMS MICRO-MIRROR ASSEMBLY 有权转让
标题翻译： MEMS-MIKROSPIEGELANORDNUNG
公开(公告)号：EP2823695A1
公开(公告)日：2015-01-14
申请号：EP13703592.9
申请日：2013-02-11
申请人： Lemoptix SA
发明人： KHECHANA, Faouzi , ABELÉ, Nicolas
IPC分类号： H05K1/02 , G02B26/08 , H05K1/11 , H05K1/18
CPC分类号： G02B26/085 , B81B7/007 , B81B2201/042 , B81B2207/098 , B81C1/00214 , B81C1/00873 , B81C3/005 , B81C2203/054 , B81C2203/057 , G02B7/1821 , G02B26/0833 , G02B26/105 , G03B21/008 , H01L2224/48091 , H01L2924/1461 , H05K1/0269 , H05K1/0281 , H05K1/118 , H05K1/189 , H05K3/328 , H05K3/34 , H05K2201/083 , H05K2201/10083 , H05K2203/049 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirror assembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).
摘要翻译：包括MEMS器件（240）的MEMS微反射镜组件（250,3300,270,400），其包括MEMS管芯（241）和磁体（231）; MEMS器件（240）机械地并且电连接到的柔性PCB板（205）; 其中所述柔性PCB板还包括第一延伸部分（205b），所述第一延伸部分包括至少一个电触头（259a，b），所述电触头可用于电连接所述MEMS微镜组件（250,300,270,400）到另一个电气部件）。还提供了一种包括这种MEMS微镜组件（250,300,270,400）的投影系统。

4. 发明公开

EP3029445A3 RELATIVE AND ABSOLUTE PRESSURE SENSOR COMBINED ON CHIP 有权
标题翻译：合并，相对绝对压力传感器芯片
公开(公告)号：EP3029445A3
公开(公告)日：2016-08-03
申请号：EP15197628.9
申请日：2015-12-02
申请人： Melexis Technologies NV , X-FAB Semiconductor Foundries AG
发明人： VAN DER WIEL, Appolonius Jacobus , SCHWARZ, Uwe , DE WINTER, Rudi
IPC分类号： G01L15/00 , G01L9/00 , B81B7/04 , B81C1/00 , G01F1/34 , G01F15/14
CPC分类号： G01F1/34 , B81B7/04 , B81B2201/0264 , B81C1/00214 , G01F15/14 , G01L9/008 , G01L15/00
摘要： A method (100) for manufacturing a system (200) in a wafer (210) for measuring an absolute and a relative pressure. In a first step (110) a shallow (220) and a deep (230) cavity are etched in the wafer (210). In a second step (120) a top wafer (510) is applied and in a third step (125) the top wafer is thinned for forming a first respectively second membrane (262, 272) over the shallow respectively deep cavity (220, 230), and for forming in the top wafer (510) first respectively second bondpads (261, 271) at the first respectively second membrane (262, 272) resulting in a first respectively second sensor (260, 270). A third step (130) back grinding the wafer (210) resulting in a opened deep cavity (230) and a still closed shallow cavity (220). The first bondpads (261) of the first sensor (260) for measuring an absolute pressure and the second bondpads (271) of the second sensor (270) a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.

5. 发明公开

EP3029445A2 RELATIVE AND ABSOLUTE PRESSURE SENSOR COMBINED ON CHIP 有权
标题翻译：芯片上组合相对和绝对压力传感器
公开(公告)号：EP3029445A2
公开(公告)日：2016-06-08
申请号：EP15197628.9
申请日：2015-12-02
申请人： Melexis Technologies NV , X-FAB Semiconductor Foundries AG
发明人： VAN DER WIEL, Appolonius Jacobus , SCHWARZ, Uwe , DE WINTER, Rudi
IPC分类号： G01L15/00 , G01L9/00
CPC分类号： G01F1/34 , B81B7/04 , B81B2201/0264 , B81C1/00214 , G01F15/14 , G01L9/008 , G01L15/00
摘要： A method (100) for manufacturing a system (200) in a wafer (210) for measuring an absolute and a relative pressure. In a first step (110) a shallow (220) and a deep (230) cavity are etched in the wafer (210). In a second step (120) a top wafer (510) is applied and in a third step (125) the top wafer is thinned for forming a first respectively second membrane (262, 272) over the shallow respectively deep cavity (220, 230), and for forming in the top wafer (510) first respectively second bondpads (261, 271) at the first respectively second membrane (262, 272) resulting in a first respectively second sensor (260, 270). A third step (130) back grinding the wafer (210) resulting in a opened deep cavity (230) and a still closed shallow cavity (220). The first bondpads (261) of the first sensor (260) for measuring an absolute pressure and the second bondpads (271) of the second sensor (270) a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.
摘要翻译：一种用于制造用于测量绝对压力和相对压力的晶片（210）中的系统（200）的方法（100）。在第一步骤（110）中，在晶片（210）中蚀刻浅（220）和深（230）腔。在第二步骤（120）中施加顶部晶片（510），并且在第三步骤（125）中，将顶部晶片变薄以在浅的相应深腔（220,230）上形成第一和第二隔膜（262,272）），并且用于在第一和第二薄膜（262,272）处在顶部晶片（510）中分别形成第一和第二分别的第二键合焊盘（261,271），从而形成第一或第二传感器（260,270）。第三步（130）背面研磨晶片（210），产生敞开的深腔（230）和仍然闭合的浅腔（220）。用于测量绝对压力的第一传感器（260）的第一键合焊盘（261）和第二传感器（270）的第二键合焊盘（271）具有相对压力。第一步骤中的蚀刻分别限定了由浅腔和深腔形成的传感器中的第一膜和第二膜的边缘。

6. 发明公开

EP1461287A2 HYBRID MEMS FABRICATION METHOD AND NEW OPTICAL MEMS DEVICE 审中-公开
标题翻译：用于生产混合MEMS和新的光学MEMS器件
公开(公告)号：EP1461287A2
公开(公告)日：2004-09-29
申请号：EP02795482.5
申请日：2002-07-17
申请人： Rockwell Scientific Licensing, LLC
发明人： DE NATALE, Jeffrey, F.
IPC分类号： B81B3/00 , G02B26/08
CPC分类号： G02B6/3518 , B81B3/0083 , B81B2201/042 , B81C1/00214 , B81C2201/053 , G02B6/3584
摘要： A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material (12). Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques (14). Drive electronics are mounted to the layers of structural and sacrificial material (17). The handle layer is removed (18) to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved (20). The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer (54) being adjacent to a Si mirror layer (52). The surface micromachining layers form electrode (66) and spring structures (67, 68). Drive electronics (92) are then mounted on the layers of structural material, so that a bias can be applied to the MEMS structures. The handle layer (54) is removed from the mirror layer (52) to reveal the mirror's reflective surface, and the sacrificial material (64) is dissolved away, freeing the MEMS structures to operate. For optical or other MEMS arrays, a linking framework (70) can be included to attach the MEMS devices.

7. 发明公开

EP1218790A2 MICROELECTROMECHANICAL DEVICE WITH MOVING ELEMENT 审中-公开
标题翻译：具有运动元件的微电子机械装置
公开(公告)号：EP1218790A2
公开(公告)日：2002-07-03
申请号：EP00946255.7
申请日：2000-07-20
申请人： Memlink Ltd.
发明人： CHERTKOW, Roberto, Igal
IPC分类号： G02B26/02
CPC分类号： H04Q11/0005 , B81B3/0021 , B81B2201/045 , B81B2203/051 , B81C1/00214 , G02B6/266 , G02B6/3514 , G02B6/3518 , G02B6/3556 , G02B6/357 , G02B6/3572 , G02B6/3576 , G02B6/3578 , G02B6/3584 , G02B6/423 , H01H2001/0084 , H04Q2011/0026 , H04Q2011/003 , H04Q2011/0056 , H04Q2011/0058
摘要： A microelectromechanical (MEMS) device (100) has a substrate (102) and a generally planar moving element (106), such as a mirror, disposed in parallel to the surface (108) of the substrate. An actuator is operatively engageable with the moving element (106) for selectively actuating the moving element (106) between a first position in a plane horizontal to the surface of the substrate and a second position in that plane. The MEMS device (100) may be effectively used as an optical switch. Various different actuators can be used. Preferably, the device is fabricated using a surface micromachining process.
摘要翻译：微机电（MEMS）器件（100）具有衬底（102）和平行于衬底的表面（108）设置的大致平面的移动元件（106），例如反射镜。致动器可操作地与移动元件（106）接合，用于选择性地致动移动元件（106）在水平于基板表面的平面中的第一位置与该平面中的第二位置之间。 MEMS器件（100）可以有效地用作光开关。可以使用各种不同的致动器。优选地，该装置使用表面微机械加工工艺来制造。

8. 发明公开

EP3344402A1 RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION 审中-公开
公开(公告)号：EP3344402A1
公开(公告)日：2018-07-11
申请号：EP16775362.3
申请日：2016-09-02
申请人： Qualcomm Incorporated
发明人： KIDWELL, Donald, William , SHENOY, Ravindra , LASITER, Jon
IPC分类号： B06B1/02 , B06B1/06
CPC分类号： B06B1/0292 , B06B1/0622 , B81B3/0021 , B81B3/0097 , B81B7/04 , B81C1/00134 , B81C1/00214 , H01L41/332
摘要： Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

9. 发明授权

EP2461159B1 Method of fabricating sensors having functionalized resonating beams 有权
标题翻译：制造具有功能化谐振束的传感器的方法
公开(公告)号：EP2461159B1
公开(公告)日：2017-10-25
申请号：EP10193535.1
申请日：2010-12-02
申请人： Honeywell Romania S.R.L.
发明人： Cobianu, Cornel. P.
IPC分类号： G01N29/036
CPC分类号： G01N29/022 , B01L3/502707 , B81B2201/0214 , B81B2203/0118 , B81B2207/015 , B81C1/00214 , B81C2201/0185 , B81C2203/0118 , B81C2203/0714 , B81C2203/0735 , B82Y40/00 , G01N29/036 , G01N29/222 , G01N2291/021 , G01N2291/0255 , G01N2291/0256 , G01N2291/0427

10. 发明公开

EP1273094A2 MULTI-LAYER, SELF-ALIGNED VERTICAL COMB-DRIVE ELECTROSTATIC ACTUATORS AND FABRICATION METHODS 审中-公开
标题翻译： MULTI-LAYER自调谐垂直梳状静电驱动装置和方法
公开(公告)号：EP1273094A2
公开(公告)日：2003-01-08
申请号：EP01920721.6
申请日：2001-03-23
申请人： Onix Microsystems Inc.
发明人： BEHIN, Behrang , PANNU, Satinderpall, S.
IPC分类号： H02N1/00 , B81B3/00 , B81B5/00
CPC分类号： G02B6/357 , B81B3/0021 , B81B2201/033 , B81B2201/042 , B81B2201/045 , B81B2203/0136 , B81B2203/0181 , B81B2203/058 , B81C1/0015 , B81C1/00214 , B81C1/00396 , G02B6/3518 , G02B6/3524 , G02B6/3584 , G02B6/359 , G02B26/0833 , H02N1/008 , Y10T29/49005 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A multi-layer vertical comb-drive actuator includes a first comb structure having a plurality of first comb fingers (14) and a second comb structure having a plurality of second comb fingers (24), wherein the first and second comb fingers are substantially interdigitated. The first and second comb fingers may include two or more stacked conductive layers electrically isolated from each other by an insulating layer or an air gap. Alternatively, either the first or second comb fingers may include only one conductive layer. An application of a voltage (15) between the first and second comb fingers causes the second comb structure to move relative to the first comb structure. The present invention includes a 2D-gimble configuration to rotate a movable element along two axes.

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