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1. 发明公开

EP2599583A4 SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译： SUBSTRATVERARBEITUNGSVERFAHREN
公开(公告)号：EP2599583A4
公开(公告)日：2017-01-04
申请号：EP11812316
申请日：2011-07-19
申请人： HAMAMATSU PHOTONICS KK
发明人： SHIMOI HIDEKI , ARAKI KEISUKE
IPC分类号： H01L21/306 , B23K26/04 , B23K26/38
CPC分类号： B23K26/064 , B23K26/0006 , B23K26/0057 , B23K26/006 , B23K26/0736 , B23K26/382 , B23K26/384 , B23K26/40 , B23K2203/50 , B23K2203/56 , H01L21/30608 , H01L21/76898
摘要： A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and construct a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of less than 45° therebetween, and the modified spots are made align in a plurality of rows along the line.
摘要翻译：在硅衬底中形成沿着预定线延伸的空间的衬底处理方法包括：在衬底处会聚作为具有除了1以外的椭圆率的椭圆偏振光的激光的第一步骤，以形成多个经修改的并且构成包含修饰斑点的修饰区域，以及各向异性蚀刻基板的第二步骤，以沿着改质区域选择性地进行蚀刻，并形成基板的空间。在第一步骤中，光在基板处会聚，使得光相对于基板的移动方向和光的偏振方向在其间形成小于45°的角度，并且将修改的光点对准沿着线的多行。

2. 发明公开

EP2599581A4 LASER PROCESSING METHOD 有权
标题翻译： LASERVERARBEITUNGSVERFAHREN
公开(公告)号：EP2599581A4
公开(公告)日：2016-12-28
申请号：EP11812313
申请日：2011-07-19
申请人： HAMAMATSU PHOTONICS KK
发明人： SHIMOI HIDEKI , ARAKI KEISUKE
IPC分类号： H01L21/48 , B23K26/00 , H01L23/498
CPC分类号： B23K26/006 , B23K26/0006 , B23K26/0057 , B23K26/382 , B23K26/384 , B23K26/40 , B23K2203/50 , B23K2203/56 , H01L21/30608 , H01L21/486 , H01L23/49827
摘要： A laser processing method comprises a laser light converging step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region within the object, and an etching step of anisotropically etching the object so as to thin the object to a target thickness and advancing the etching selectively along the modified region so as to form the object with a through hole tilted with respect to a thickness direction of the object after the laser light converging step, wherein the laser light converging step forms a first modified region as the modified region in a part corresponding to the through hole in the object and a second modified region as the modified region extending parallel to the thickness direction and joining with the first modified region in a part to be removed upon thinning by the anisotropic etching in the object, and wherein the etching step advances the etching selectively along the second modified region and then along the first modified region while thinning the object and completes forming the through hole when the object is at the target thickness.
摘要翻译：一种激光加工方法，其特征在于，包括：激光收敛步骤，使激光在由硅制成的待加工的片状物体上会聚，以在物体内形成改质区域;以及蚀刻步骤，对所述物体进行各向异性蚀刻，将物体薄化成目标厚度，并且沿着改质区域选择性地推进蚀刻，以便在激光聚焦步骤之后形成具有相对于物体的厚度方向倾斜的通孔的物体，其中激光聚光步骤形成作为与物体中的通孔对应的部分中的改质区域的第一改质区域和作为改变区域的第二改性区域，其平行于厚度方向延伸，并且在变薄的部分中与第一改质区域连接，该物体中的各向异性蚀刻，并且其中蚀刻步骤沿着第二改质区域选择性地前进蚀刻，然后沿着该FI 第一修改区域，同时使物体变薄，并在物体处于目标厚度时完成形成通孔。

3. 发明公开

EP3077149A1 METHOD AND APPARATUS FOR INTERNALLY MARKING A SUBSTRATE HAVING A ROUGH SURFACE 审中-公开
标题翻译：方法和装置进行内部标记优先粗糙表面的基板
公开(公告)号：EP3077149A1
公开(公告)日：2016-10-12
申请号：EP14867057.3
申请日：2014-12-02
申请人： Electro Scientific Industries, Inc.
发明人： ZHANG, Haibin , REKOW, Mathew , YANG, Chuan , DARWIN, Michael, J.
IPC分类号： B23K26/00 , B23K26/36
CPC分类号： B23K26/009 , B23K26/0006 , B23K26/0054 , B23K26/0057 , B23K26/006 , B23K26/083 , B23K26/0876 , B23K26/53 , B23K26/55 , B23K37/0235 , B23K2203/50 , H01L23/544 , Y10T428/24364
摘要： A method for laser processing provides a coating material (130) applied to a rough surface (42) of a substrate (44) to mitigate adverse optical effects that would be caused by roughness of the surface (42). Laser pulses (52) of the laser output of suitable parameters can be directed and focused to internally mark the substrate (44) material without damaging the rough surface (42) after passing through the coating material (130).

4. 发明公开

EP2929381A1 VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON ZUMINDEST EINEM FASER-BRAGG-GITTER 有权转让
公开(公告)号：EP2929381A1
公开(公告)日：2015-10-14
申请号：EP13799521.3
申请日：2013-12-02
申请人： Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： SCHADE, Wolfgang , BURGMEIER, Jörg
IPC分类号： G02B6/02 , H01S3/00 , B23K26/06
CPC分类号： G02B6/02128 , B23K26/006 , G02B6/02147 , G02B6/02152 , H01S3/0057
摘要： The invention relates to a method and a device for producing at least one fibre Bragg grating (1) in a waveguide (2), wherein the waveguide (2) has at least one core (21) having a first refractive index (n
1 ) and the fibre Bragg grating (1) contains a plurality of spatial regions (10) which each occupy a partial volume of the core (21) and have a second refractive index (n
2 ), wherein the spatial regions (10) are each produced by the action of laser radiation on a partial volume of the core (21), wherein the laser radiation contains a plurality of pulse trains (5) each containing a plurality of individual pulses (51), wherein the time interval between successive individual pulses (51) is smaller than the time interval between successive pulse trains (5) and the time interval between successive individual pulses (51) is chosen between 10 ns and 100 ps or the pulse train has a duration of 50 fs to 50 ps.
摘要翻译：本发明涉及一种用于在波导中制造至少一个光纤布拉格光栅的方法和装置，其中波导具有至少一个具有第一折射率的光纤，并且光纤布拉格光栅包含多个空间区域，每个空间区域占据部分芯的体积并具有第二折射率，其中空间区域各自通过激光辐射在芯的部分体积上的作用产生，其中激光辐射包含多个脉冲序列，每个脉冲串包含多个独立的脉冲，其中连续单个脉冲之间的时间间隔小于连续脉冲串之间的时间间隔，并且在10ns和100ps之间选择连续单个脉冲之间的时间间隔，或脉冲串具有50fs至50ps的持续时间。

5. 发明公开

EP2836332A1 DISPOSITIF ET METHODE DE NANO-USINAGE PAR LASER 有权
标题翻译： VORRICHTUNG UNS VERFAHREN ZUR NANOSKALIGEN LASERBEARBEITUNG
公开(公告)号：EP2836332A1
公开(公告)日：2015-02-18
申请号：EP13723418.3
申请日：2013-04-12
申请人： Centre National de la Recherche Scientifique (CNRS) , Université de Franche-Comté
发明人： COURVOISIER, François , LACOURT, Pierre-Ambroise , JACQUOT, Maxime , FURFARO, Luca , DUDLEY, John , DE LABACHELERIE, Michel
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40
CPC分类号： H01L21/67115 , B23K26/006 , B23K26/0613 , B23K26/0624 , B23K26/382 , B23K26/40 , B23K2201/40 , B23K2203/50 , B23K2203/52 , H01L21/3247 , H05K3/0038
摘要： According to one aspect, the invention relates to a device (1, 2, 3) for laser nanomachining a sample made of a material having a given transparency band, the device comprising: a focusing module (203, 703) allowing a nondiffracting beam (210, 710) to be generated, along a focusing line generally oriented along the optical axis of the focusing module, from a given incident beam; first means (202, 702) for emitting a first light pulse (I
1 ) of spectral band comprised in the transparency band of said material, able to generate in said material, after focusing by said focusing module, a plasma of free charges along said focusing line via multi-photon absorption, thus forming a "plasma channel"; and second means (202, 702) for emitting at least one second electromagnetic wave (I
2 ) of spectral band comprised in the transparency band of said material, which wave(s) is/are intended to be spatially superposed on said plasma channel in order to heat said material via absorption by the free charges of the plasma.
摘要翻译：根据一个方面，本发明涉及一种用于激光纳米加工由具有给定透明带的材料制成的样品的装置（1,2,3），该装置包括：聚焦模块（203,703），其允许非衍射光束沿着沿着聚焦模块的光轴大致取向的聚焦线从给定的入射光束产生; 第一装置（202,702），用于发射包括在所述材料的透明带中的光谱带的第一光脉冲（I1），能够在所述聚焦模块聚焦之后在所述材料中产生沿着所述聚焦的自由电荷的等离子体线通过多光子吸收，从而形成“等离子体通道”; 以及用于发射包括在所述材料的透明带中的光谱带的至少一个第二电磁波（I2）的第二装置（202,702），该波将被依次空间上叠加在所述等离子体通道上以通过等离子体的游离电荷的吸收来加热所述材料。

6. 发明公开

EP2076353A1 INDIRECT PULSED LASER MACHINING METHOD OF TRANSPARENT MATERIALS BY BRINGING AN ABSORBING LAYER ON THE BACKSIDE OF THE MATERIAL TO BE MACHINED 审中-公开
标题翻译：用透明材料间接脉冲激光处理方法通过将吸收层在材料上的背面进行编辑
公开(公告)号：EP2076353A1
公开(公告)日：2009-07-08
申请号：EP07733865.5
申请日：2007-05-25
申请人： Szegedi Tudomanyegyetem
发明人： HOPP, Béla , SMAUSZ KOLUMBÁN, Tamás , VASS, Csaba , BOR, Zsolt
IPC分类号： B23K26/18 , B23K26/36 , B23K26/38 , B23K26/40 , C03B33/08 , C03C15/00 , C03C23/00
CPC分类号： B23K26/18 , B23K26/006 , B23K26/066 , B23K26/361 , B23K26/382 , B23K26/40 , B23K2203/42 , B23K2203/50 , B23K2203/52 , C03C15/00 , C03C23/0025 , C03C2218/355
摘要： The present invention relates to a novel indirect pulsed laser machining process of a transparent material. The process according to the invention comprises the steps of bringing a transparent material (12), at least in a region (19) thereof to be machined, into coupling with an absorbing layer (18), said coupling ensuring intense heat exchange; directing a laser pulse of a laser light (20) emitted by a laser source (10) through the transparent material (12) into the absorbing layer (18); having the energy of the laser pulse absorbed within a portion of the absorbing layer (18) located in the vicinity of the transparent material's region (19) to be machined, and thereby heating up said absorbing portion of the absorbing layer (18) to boiling and removing mechanically material from the region (19) to be machined through a retroaction exerted on said region (19) by the boiling-away material of the absorbing layer (18), comprising (i) applying as the transparent material (12) such a material that is essentially fully transmissive at the wavelength of the laser light (20), (ii) making the absorbing layer (18) of such a material that is essentially fully absorbing at the wavelength of the laser light (20), (iii) setting the energy of the laser pulse so as to correspond to at least the transparent material's (12) threshold fluence value for etching, and (iv) forming the absorbing layer (18) with such a thickness that ensures boiling away of the absorbing layer (18) in its full thickness at the transparent material's region (19) to be machined as a consequence of absorbing the energy of the laser pulse by it.
摘要翻译：本发明涉及一种透明材料制成的新颖间接脉冲激光加工过程。雅鼎的发明的方法包括在吸收层（18），所述联接确保强热交换带来的透明材料（12），在一个区域（19）其被加工至少成耦合用的步骤; 引导激光的激光脉冲（20）由通过所述透明材料（12）到所述吸收层（18）的激光源（10）发射的; 具有位于透明材料的区域（19）的附近的吸收层（18）的一部分内所吸收的激光脉冲的能量被加工，并从而加热所说的吸收区的吸收层（18）的部分至沸腾及从该区域机械材料（19）由安装在经由反作用加工由吸收层的包括施加作为透明材料（12）求沸程材料（18）（ⅰ）施加在所述区域（19）的基本上完全透射的激光（20）的波长，（ⅱ）使寻求即在激光光（20）的波长基本上完全吸收材料的吸收层（18）的材料，（ⅲ ）设置激光脉冲的能量，以对应于至少所述透明材料的（蚀刻12）阈注量值，和（iv）与寻求的厚度形成所述吸收层（18）也可确保沸腾掉吸收层的（18）在其FUL 在透明材料的区域（19）升厚度被加工通过将其吸收激光脉冲的能量的结果。

7. 发明公开

EP1945402A2 MICROTOME LASER FEMTOSECONDE POUR DECOUPE PAR FAISCEAU LASER D'UNE TRANCHE DE MATIERE, NOTAMMENT DANS UNE CORNEE 审中-公开
标题翻译： LASER-FEMTOSEKUNDEN-MIKROTOM ZUM AUSSCHNEIDEN EINER MATERIALSCHEIBE DURCH EINEN LASERSTRAHL，INSBESONDERE IN EINEM ECKBEREICH
公开(公告)号：EP1945402A2
公开(公告)日：2008-07-23
申请号：EP06841997.7
申请日：2006-11-03
申请人： Centre National de la Recherche Scientifique
发明人： SALIN, François
IPC分类号： B23K26/073 , A61F9/01 , B23K26/40
CPC分类号： B23K26/006 , A61F9/00827 , A61F9/00829 , A61F9/00836 , A61F2009/00872 , B23K26/0736 , B23K26/361 , B23K26/40 , B23K2203/30 , B23K2203/42 , B23K2203/50
摘要： The invention relates to a laser femtosecond microtome for cutting out at least one slice of material from a material block by means of a focused laser beam, wherein said material block comprises a front surface and a slice carrying said front surface, the slice extends at least partially on a X, Z plane perpendicular to an axis Z of the block thickness, is separated from the remaining part of the block by a cleavage surface formed by an assembly of bubbles brought together and each bubble is formed in the focus area of at least one convergent laser beam pulse of an optical axis L. According to said invention, the optical axis L of the laser beam convergent part (3) forms an angle ranging from 45° to + 45° with respect to the X, Z plane. An ellipsoid-shaped focus area has the smallest axis thereof in the direction of the axis Y.
摘要翻译：一种激光飞秒切片机，用于通过聚焦激光束切割材料块中的至少一片材料，其中所述块包括前表面和所述切片承载前表面，所述切片至少部分地基本上以X，Z 垂直于块厚度的轴线Y的平面，通过由聚集在一起的气泡的组合形成的切割表面将切片与块的剩余部分分开，每个气泡形成在至少一个会聚激光束的聚焦区域中光轴L的脉冲。根据本发明，激光束的会聚部分（3）的光轴L相对于X，Z形成在-45°和±45°之间的角度。椭圆形焦点区域在轴线Y的方向上具有较小的轴。

8. 发明公开

EP1764831A2 Forming holes using laser energy 审中-公开
标题翻译：通过使用激光能量的形成孔的方法
公开(公告)号：EP1764831A2
公开(公告)日：2007-03-21
申请号：EP06254806.0
申请日：2006-09-15
申请人： Plastic Logic Limited
发明人： Hayton, Carl , Brown, Thomas Dpmt of electronic engineering
IPC分类号： H01L21/768 , H01L21/268 , H01L21/321 , H01L21/3105
CPC分类号： H01L51/0021 , B23K26/0006 , B23K26/006 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2201/42 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , B23K2203/54 , H01L21/268 , H01L21/31116 , H01L21/31138 , H01L21/76802 , H01L51/0541
摘要： A method for generating via-hole interconnections by laser ablation, wherein the layers to be removed and ablated from the substrate are essentially transparent to the laser radiation, but the laser light is absorbed in an underlying absorbing layer with a sufficiently high optical density at the laser wavelength.

9. 发明公开

EP1535697A1 METHOD AND DEVICE FOR PROCESSING INSIDE OF TRANSPARENT MATERIAL 审中-公开
标题翻译： VERFAHREN UND VORRICHTUNG ZUR VERARBEITUNG INNERHALB EINES DURCHSICHTIGEN MATERIALS
公开(公告)号：EP1535697A1
公开(公告)日：2005-06-01
申请号：EP03755268.4
申请日：2003-05-15
申请人： Riken
发明人： SUGIOKA, Koji c/o RIKEN , CHENG, Ya c/o RIKEN , MIDORIKAWA, Katsumi c/o RIKEN
IPC分类号： B23K26/40 , C03C23/00
CPC分类号： B23K26/0057 , B23K26/006 , B23K26/0624 , B23K26/066 , C03C4/04 , C03C23/0025
摘要： A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.
摘要翻译：在平行于飞秒激光的前进方向的截面的光焦点处，获得具有基本上圆形的形状作为加工形状，例如改性形状或加工形状。沿着与飞秒激光（10）发射的激光的前进方向正交的方向形成为规定的形状。形成在与前进方向正交的方向上的截面形状的激光形成为规定的形状，被输入到透镜（14）中。光线被透镜聚焦在透明材料（100）内并处理透明材料的内部。

10. 发明公开

EP3077149A4 METHOD AND APPARATUS FOR INTERNALLY MARKING A SUBSTRATE HAVING A ROUGH SURFACE 审中-公开
标题翻译： VERFAHREN UND VORRICHTUNG ZUR INTERNEN MARKIERUNG EINES SUBSTRATS MIT RAUEROBERFLÄCHE
公开(公告)号：EP3077149A4
公开(公告)日：2017-09-20
申请号：EP14867057
申请日：2014-12-02
申请人： ELECTRO SCIENT IND INC
发明人： ZHANG HAIBIN , REKOW MATHEW , YANG CHUAN , DARWIN MICHAEL J
IPC分类号： B23K26/00 , B23K26/08 , B23K26/36 , B23K26/53 , B23K26/55 , B23K37/02
CPC分类号： B23K26/009 , B23K26/0006 , B23K26/0054 , B23K26/0057 , B23K26/006 , B23K26/083 , B23K26/0876 , B23K26/53 , B23K26/55 , B23K37/0235 , B23K2203/50 , H01L23/544 , Y10T428/24364

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