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2. 发明公开

EP3219816A1 DEVICE AND METHOD FOR RECOVERING TIN-LEAD SOLDER FROM SCRAP 审中-公开
标题翻译：用于从废料回收锡铅焊料的装置和方法
公开(公告)号：EP3219816A1
公开(公告)日：2017-09-20
申请号：EP15858623.0
申请日：2015-11-11
申请人： Vtulkin, Denis Aleksandrovich
发明人： Vtulkin, Denis Aleksandrovich
IPC分类号： C22B25/06 , C22B7/00 , C22B9/02
CPC分类号： B23K1/018 , C22B7/001 , C22B7/004 , C22B7/005 , C22B7/006 , C22B25/06 , Y02P10/228 , Y02P10/234
摘要： The group of inventions relates to the processing of metal waste, and specifically to the recovery of tin-lead solder from electronic printed circuit board scrap. The technical result of the proposed technical solution is an increase in the productivity of the recovery of solder from scrap. The scrap is placed in a liquid-permeable and/or gas-permeable container, which is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder. After the tin-lead solder is melted, the heat-transfer medium is removed from the container, then, by means of rotation of the container, the melted tin-lead solder and the remains of the heat-transfer medium are removed from said container. The device comprises a hollow container, which is mounted in such a way as to be capable of rotation and is designed in the form of a body of revolution, and is liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation. The container can be designed in the form of a drum, which can be vertically displaced and has perforated side walls.
摘要翻译：这组发明涉及金属废料的加工，特别是从电子印刷电路板废料中回收锡铅焊料。提出的技术解决方案的技术结果是提高从废料中回收焊料的生产率。将废料置于液体可渗透和/或气体可渗透的容器中，将其置于加热至锡铅焊料的熔化温度或以上的液体或气体传热介质中。在锡铅焊料熔化后，将热传递介质从容器中取出，然后通过容器的旋转将熔化的锡铅焊料和传热介质的残余物从所述容器中取出。该装置包括中空容器，该中空容器以能够旋转的方式安装并且被设计成回转体的形式，并且从轴线在径向方向上是液体可渗透的和/或气体可渗透的的旋转。该容器可以设计成可以垂直移动并具有穿孔侧壁的鼓形式。

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