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    • 8. 发明授权
    • Giessharze auf Basis von Acrylsäureestern
    • 基于丙烯酸酯的浇注树脂
    • EP0107764B1
    • 1987-03-18
    • EP83108800.0
    • 1983-09-07
    • HÜLS TROISDORF AKTIENGESELLSCHAFT
    • Hanisch, Horst, Dr.Lenz, TheoBernhardt, Günther, Dr.
    • C08F20/12C08F2/44
    • C08F2/44C08F20/12
    • 1. Claims for the Contracting States BE, CH, DE, FR, GB, IT, LI, NL, SE Casting resins based on flowable hardenable acrylic and methacrylic acid esters and finely divided inorganic fillers, which contain organosilicon compounds as bonding agents, characterised in that the organosilicon compound possesses one or several ethylenically unsaturated groups and is contained in the resin in amounts between 0.2 and 4% by weight related to the finely divided inorganic filler and the casting resin additionally contains a metal acid ester of metals of the IVth or Vth sub-groups of the Periodic System of the elements in amounts between 0.05 and 1% by weight related to the finely divided inorganic filler and the ratio of metal acid ester : organosilicon compound lies between 1:10 and 10:2. 1. Claims for the Contracting State AT Stable, flowable, mouldable and cross-linkable mixture of flowable, hardenable acrylic and methacrylic acid esters and finely divided inorganic fillers, which contains organosilicon compound as bonding agent, characterised in that the organosilicon compound possesses one or several ethylenically unsaturated groups and is contained in the mixture in amounts between 0.2 and 4% by weight related to the finely divided inorganic fillers and the mixture additionally contains a metal acid ester of metals of the IVth or Vth sub-groups of the Periodic System of the elements in amounts between 0.05 and 1% by weight, related to the finely divided inorganic fillers, and the ratio of metal acid ester : organosilicon compound lies between 1:10 and 10:2.
    • 1.对缔约国的要求BE,CH,DE,FR,GB,IT,LI,NL,SE基于可流动的可硬化丙烯酸和甲基丙烯酸酯和细分无机填料的铸造树脂,其含有有机硅化合物作为粘合剂,其特征在于 因为有机硅化合物具有一个或多个烯键式不饱和基团,并且在与分散的无机填料相关的0.2至4重量%的量中包含在树脂中,并且浇铸树脂还含有第IV或 元素系统的Vth分子量与细碎无机填料相关的0.05-1重量%,金属酸酯:有机硅化合物的比例为1:10至10:2。 1.对缔约国的要求AT含有有机硅化合物作为粘合剂的可流动的,可硬化的丙烯酸和甲基丙烯酸酯和细分的无机填料的稳定的,可流动的,可模制的和可交联的混合物,其特征在于有机硅化合物具有一个或 几种烯键式不饱和基团,并且以与细碎的无机填料相关的重量计在0.2至4%之间的混合物中含有,并且该混合物另外含有周期性体系的IV或Vth子组的金属的金属酸酯 与细碎无机填料相关的0.05-1重量%的元素,金属酸酯:有机硅化合物的比例为1:10至10:2。