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1. 发明授权

EP2962779B1 PUNCH DIE 有权
公开(公告)号：EP2962779B1
公开(公告)日：2019-11-13
申请号：EP14757159.0
申请日：2014-02-19
申请人： Amada Holdings Company Ltd.
发明人： ENDO, Shigeru , NAKAI, Hiroshi
IPC分类号： B21D28/34 , B21D28/36

2. 发明公开

EP3075485A4 LASER MACHINING METHOD AND LASER MACHINING MACHINE 有权
标题翻译： LASERBEARBEITUNGSVERFAHREN UND LASERBEARBEITUNGSMASCHINE
公开(公告)号：EP3075485A4
公开(公告)日：2017-09-06
申请号：EP14865811
申请日：2014-11-07
申请人： AMADA HOLDINGS COMPANY LTD
发明人： IMAYA SHOICHI , YAMAIZUMI YOUHEI
IPC分类号： B23K26/382 , B23K26/08 , B23K26/142 , B23K26/16 , B23K26/38 , B23Q7/00 , G05B19/18
CPC分类号： B23K26/388 , B23K26/0876 , B23K26/142 , B23K26/16 , B23K26/38 , B23K26/389 , B23Q7/006 , G05B19/182 , G05B2219/36199 , G05B2219/45041
摘要： In a laser processing method for carrying out hole-forming on a plate-shaped workpiece (W), [A] a hole is formed by laser-cutting the workpiece along an outline of the hole (1) to be formed, [B] a laser processing head (31) is moved with respect to the workpiece after forming the hole, and [C] a cutout piece (7) inside the outline of the hole is dropped off by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. According to the laser processing method, the cutout piece generated when carrying out hole-forming by laser processing can be prevented from getting stuck in a hole.
摘要翻译：在用于在板状工件（W）上进行孔加工的激光加工方法中，[A]通过沿着要形成的孔（1）的轮廓激光切割工件来形成孔，[B] 在形成孔后，使激光加工头（31）相对于被加工物移动，通过使激光加工头移动，同时从该加工头喷出辅助气体，从而使孔的轮廓内的切断片（7）激光加工头到轮廓内的切割片。根据激光加工方法，可以防止在通过激光加工进行孔加工时产生的切割片卡在孔中。

3. 发明公开

EP3210683A1 REPLACEMENT METHOD FOR ATTACHING AND DETACHING MOLD FOR PRESS BRAKE AND MOLD ACCOMMODATING DEVICE 有权
标题翻译：压力机制动装置及模具调节装置装卸模具的更换方法
公开(公告)号：EP3210683A1
公开(公告)日：2017-08-30
申请号：EP15852179.9
申请日：2015-07-03
申请人： Amada Holdings Company Ltd.
发明人： SATO, Masaaki
IPC分类号： B21D5/02 , B21D37/04
CPC分类号： B21D5/0254 , B21D5/02 , B21D37/04 , B21D37/145 , Y10T483/1731
摘要： A tool storage device (1) is disposed on a side of a press brake (3). In the tool storage device (1), a lower tool holder (105) is lifted up from lower tool holder support members (33L, 33R), is moved forward or backward, and both end sides in a left-and-right direction of the lower tool holder (105) are lowered after being passed through recessed portions (117) formed on the lower tool holder support members (33L, 33R) (step (a)). The lowered lower tool holder (105) is conveyed forward, and is positioned to a same height as a height of a lower tool mounting portion (11) in a lower table (13) (step (b)). The lower tool (103) held in the lower tool holder (105) is transferred to the lower tool mounting portion (11) by a tool replacement device (19L), and is mounted on the lower table (13) (step (c)). Reverse operations in order of step (c), step (b), and step (a) are performed, and the lower tool (103) mounted on the lower table (13) is returned into the tool storage device (1) (step (d)).
摘要翻译：工具储存装置（1）设置在压弯机（3）的一侧。在该工具收纳装置（1）中，下工具保持器（105）从下工具保持器支承构件（33L，33R）上抬起，向前或向后移动，并且沿左右方向的两个端侧下工具架105在通过形成在下工具架支撑构件33L，33R上的凹部117后下降（步骤（a））。下降的下部工具架105向前方输送，定位于与下部工作台13的下部工具安装部11的高度相同的高度（工序（b））。通过工具更换装置19L将保持在下部工具夹具105中的下部工具103转移到下部工具安装部11上，并安装在下部工作台13上（步骤c））。进行步骤（c），步骤（b）和步骤（a）的反向操作，并将安装在下台（13）上的下工具（103）返回到工具存储装置（1）中（d））。

4. 发明授权

EP3127628B1 CUTTING DIE 有权
公开(公告)号：EP3127628B1
公开(公告)日：2022-06-08
申请号：EP15772332.1
申请日：2015-03-19
发明人： MORIYA, Hideyuki , ENDO, Shigeru
IPC分类号： B21D28/14 , B21D28/34

5. 发明授权

EP3205439B1 PIERCING METHOD AND LASER PROCESSING APPARATUS 有权
公开(公告)号：EP3205439B1
公开(公告)日：2020-03-25
申请号：EP15848766.0
申请日：2015-09-09
申请人： Amada Holdings Company Ltd.
发明人： LI, Ruotao , ISHIGURO, Hiroaki
IPC分类号： B23K26/064 , B23K26/00 , B23K26/382

6. 发明授权

EP2998809B1 LASER PROCESSING METHOD AND LASER PROCESSING PROGRAM DEVICE 有权
公开(公告)号：EP2998809B1
公开(公告)日：2020-03-11
申请号：EP14798078.3
申请日：2014-01-22
申请人： Amada Holdings Company Ltd.
发明人： OOTSU, Takaaki
IPC分类号： G05B19/4093 , B23K26/00 , B23K26/38 , B23K26/08

7. 发明授权

EP3210683B1 REPLACEMENT METHOD FOR ATTACHING AND DETACHING TOOL FOR PRESS BRAKE AND TOOL STORAGE DEVICE 有权
公开(公告)号：EP3210683B1
公开(公告)日：2019-02-20
申请号：EP15852179.9
申请日：2015-07-03
申请人： Amada Holdings Company Ltd.
发明人： SATO, Masaaki
IPC分类号： B21D5/02 , B21D37/04

8. 发明授权

EP3031561B1 HORIZONTAL BAND SAW MACHINE 有权
公开(公告)号：EP3031561B1
公开(公告)日：2018-09-05
申请号：EP14833745.4
申请日：2014-07-02
申请人： Amada Holdings Company Ltd. , Amada Machine Tools Co., Ltd
发明人： SAKAI, Norihisa , SETO, Akio
IPC分类号： B23D55/08 , B23D55/04
CPC分类号： B23D55/086 , B23D53/04 , B23D55/04 , B23D55/082
摘要： A horizontal band saw machine for cutting a workpiece by an endless band saw blade includes a vise mechanism provided on a downstream side of a cutting position and having a pair of jaws, a vertically-movable cutting head, a pair of saw blade wheels provided rotatably on the cutting head, the band saw blade looped over the pair of saw blade wheels, a saw blade guide mechanism having a pair of saw blade guides that are suspended from the cutting head, a contact guide attached to the other of the pair of jaws, a coupling bracket connected to the other of the pair of saw blade guides to locate a distal end thereof below the other of the pair of saw blade wheels, and a follower member provided at the distal end of the coupling bracket to contact with the contact guide slidably. The contact guide and the coupling bracket are configured to move one of the pair of saw blade guides until the follower member contacts with the contact guide when the band saw blade is fed circularly in a state where the band saw blade is clamped by the one of the pair of saw blade guides.

9. 发明公开

EP3127628A4 CUTTING DIE 有权
公开(公告)号：EP3127628A4
公开(公告)日：2018-01-03
申请号：EP15772332
申请日：2015-03-19
申请人： AMADA HOLDINGS COMPANY LTD
发明人： MORIYA HIDEYUKI , ENDO SHIGERU
IPC分类号： B21D28/14 , B21D28/34
CPC分类号： B21D28/14 , B21D28/145 , B21D28/34 , B21D45/02 , B23D1/26 , B23D11/00 , B23D13/04 , B23P23/02 , B23Q11/0053 , Y10T29/5115 , Y10T83/2083 , Y10T83/2122 , Y10T83/8732 , Y10T409/501148
摘要： In a cutting die D having a cutting chip 50, applied to a punch press, and cutting a work W in collaboration with a cutting punch P, a resistance member 51 (53, 55, 56) for guiding swarf K generated during cutting of the work W through the cutting chip 50 and dividing it by giving resistance to it is provided around a scrap discharge hole 39 so that the divided swarf K does not remain in the scrap discharge hole 39 but is discharged to an outside so as to prevent clogging by scrap.

10. 发明公开

EP3064308A4 LASER PROCESSING MACHINE 有权
标题翻译： LASERVERARBEITUNGSMASCHINE
公开(公告)号：EP3064308A4
公开(公告)日：2017-05-10
申请号：EP14857259
申请日：2014-10-09
申请人： AMADA HOLDINGS COMPANY LTD
发明人： HAJI SHIGEYUKI , HIRASAWA TAISUKE
IPC分类号： B23K26/70 , B23K26/00 , B23K26/02 , B23K26/08 , B23K26/10 , B23K26/38 , B23K37/02 , B23K37/04 , B23K101/18
CPC分类号： B23K26/00 , B23K26/02 , B23K26/08 , B23K26/38 , B23K26/706 , B23K37/0235 , B23K37/0408 , B23K2201/18
摘要： A laser processing machine (M1) includes a machine main body (10) that has a laser processing head (20), a processing table (14-15) on which a workpiece to be processed is laid; and a light-shielding cover (30,40) that is provided above the processing table, and covers an upper surface of the processing table. The cover is transformable between a deployed state and retracted state, and can adjust an area covering the upper surface of the processing table. According to the laser processing machine, it is possible to cover only a necessary area for laser processing by its compact cover without inhibiting workability for carrying in/out the workpiece.
摘要翻译：激光加工机（M1）具备：具有激光加工头（20）的机械主体（10）;载置被加工物的加工台（14-15）以及遮光罩（30,40），其设置在所述加工台的上方，覆盖所述加工台的上表面。盖可在展开状态和收缩状态之间转换，并可调整覆盖加工台上表面的区域。根据该激光加工机，不会妨碍搬入搬出工件的作业性，而能够以小型的罩仅覆盖必要的激光加工用区域。

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