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    • 8. 发明公开
    • Superconducting device having a reduced thickness of oxide superconducting layer and method for manufacturing the same
    • 具有减小的氧化物超导层的厚度的超级结构及其制造方法
    • EP0475838A3
    • 1992-07-08
    • EP91402409.6
    • 1991-09-10
    • Sumitomo Electric Industries, Ltd.
    • Nakamura, TakaoInada, HiroshiIiyama, Michitomo
    • H01L39/22H01L39/24
    • H01L39/146H01L39/225H01L39/2496Y10S505/702Y10S505/728
    • A superconducting device comprises first and second oxide superconducing regions of a relatively thick thickness formed directly on a principal surface of a substrate separately from each other, and a third oxide superconducting region of an extremely thin thickness formed directly on the principal surface of the substrate so as to bridge the first and second oxide superconducting regions. A barrier layer and a diffusion source layer is formed on the third oxide superconducting region, and an isolation region is formed to cover an upper portion or both side surfaces of the diffusion source layer. The first, second and third oxide superconducting regions and the isolation region are formed of the same oxide superconductor material, and the isolation region is diffused with a material of the diffusion source layer, so that the isolation region does not show superconductivity. Therefore, a superconducting current can flow between the first and second oxide superconducting regions through only the third oxide superconducting region. For formation of the superconducting device, a first oxide superconductor thin film having a very thin thickness is formed on the principal surface of the substrate, and a barrier layer and a diffusion source layer are formed on a portion of the first oxide superconductor thin film. A second oxide superconductor thin film is grown on an exposed surface of the first oxide superconductor thin film until the two layers are embedded in the second oxide superconductor thin film, so that a material of the diffusion source layer is diffused into the second oxide superconductor thin film on an upper portion or both side surfaces of the diffusion source layer.
    • 超导装置包括彼此分开直接形成在基板的主表面上的相对较厚厚度的第一和第二氧化物超导区域,以及直接形成在基板主表面上的极薄厚度的第三氧化物超导区域 桥接第一和第二氧化物超导区域。 在第三氧化物超导区域上形成阻挡层和扩散源层,形成隔离区以覆盖扩散源层的上部或两侧表面。 第一,第二和第三氧化物超导区域和隔离区域由相同的氧化物超导体材料形成,并且隔离区域与扩散源层的材料扩散,使得隔离区域不显示超导性。 因此,超导电流可以仅通过第三氧化物超导区域在第一和第二氧化物超导区域之间流动。 为了形成超导装置,在基板的主表面上形成具有非常薄的厚度的第一氧化物超导体薄膜,并且在第一氧化物超导体薄膜的一部分上形成阻挡层和扩散源层。 在第一氧化物超导体薄膜的暴露表面上生长第二氧化物超导体薄膜,直到两层嵌入到第二氧化物超导体薄膜中,使得扩散源层的材料扩散到第二氧化物超导体薄膜 膜在扩散源层的上部或两侧表面上。
    • 9. 发明公开
    • Method for manufacturing superconducting device having a reduced thickness of oxide superconducting layer and superconducting device manufactured thereby
    • 一种制造具有由超导装置形成的超导层的厚度减小的超导器件的工艺。
    • EP0488837A2
    • 1992-06-03
    • EP91402917.8
    • 1991-10-30
    • Sumitomo Electric Industries, Ltd.
    • Nakamura, TakaoInada, HiroshiIiyama, Michitomo
    • H01L39/22H01L39/24
    • H01L39/146
    • For manufacturing a superconducting device, a compound layer which is composed of the same constituent elements of an oxide superconductor is formed on a surface of the substrate, and a gate electrode is formed on a portion of the compound layer. Portions of the compound layer at both sides of the gate electrode are etched using the gate electrode as a mask, so that a shallow step is formed on an upper surface of the compound layer and side surfaces of the step exposed. After that electric power is applied to the gate electrode to heat the gate electrode so as to carry out a heat-treatment on the portion of the compound layer under the gate electrode locally, so that a gate insulator formed directly under the the gate electrode and a superconducting channel which is constituted an extremely thin superconducting region composed of the oxide superconductor and formed under the gate insulator are produced in a self alignment to the gate electrode.
    • 为了制造超导器件,它是由氧化物超导体相同的构成元素的化合物的所有层形成在基板的一个表面上,并且一个栅电极形成在所述化合物层的一部分。 在栅电极的bothsides化合物层的部分使用栅电极作为掩模来蚀刻,所以没有一个浅台阶形成在暴露的步骤的化合物层表面和侧表面的上表面上。 做后的电力被施加到栅电极以加热所述栅电极,以便局部地进行在栅电极下的化合物层的所述部分的热处理,所以没有在栅电极之下直接形成栅极绝缘体和 超导通道的所有其构成氧化物超导体组成的极薄的超导区和所述栅极绝缘体下形成以自对准到栅电极产生的。