会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明公开
    • Composite iridium-metal-oxygen barrier structure with refractory metal companion barrier and method for its fabrication
    • 伴随的难熔金属和制造过程的复合隔挡铱 - 金属 - 氧垒结构
    • EP1054441A3
    • 2003-01-02
    • EP00304334.6
    • 2000-05-22
    • SHARP KABUSHIKI KAISHA
    • Zhang, FengyanMaa, Jer-shenHsu, Sheng TengZhuang, Wei-Wei
    • H01L21/02H01L21/285H01L21/768
    • H01L28/75H01L21/28568H01L28/55
    • An Ir-M-O composite film (16) has been provided that is useful in forming an electrode of a ferroelectric capacitor, where M includes a variety of refractory metals. The Ir combination film is resistant to high temperature annealing in oxygen environments. When used with an underlying barrier layer (14) made from the same variety of M transition metals, the resulting conductive barrier also suppresses to diffusion of Ir into any underlying Si substrates. As a result, Ir silicide products are not formed, which degrade the electrode interface characteristics. That is, the Ir combination film remains conductive, not peeling or forming hillocks, during high temperature annealing processes, even in oxygen. The Ir-M-O conductive electrode/barrier structures are useful in nonvolatile FeRAM devices, DRAMs, capacitors, pyroelectric infrared sensors, optical displays, optical switches, piezoelectric transducers, and surface acoustic wave devices. A method for forming an Ir-M-O composite film barrier layer (16) and an Ir-M-O composite film ferroelectric electrode are also provided.
    • IR-M-O复合膜-已经提供确实处于铁电电容器,其中,M包括各种难熔金属中的电极的形成是有用的。 红外组合电影是在氧环境中的高温退火抗性。 当与在从同一品种M转换金属制成下面的阻挡层使用,所得到的导电阻挡,从而禁止与Ir扩散到任何底层Si衬底。 其结果是,IR硅化物的产品不形成,其降低了电极的界面特性。 即,组合的Ir电影保持导通,不剥离或形成小丘,在高温退火过程中,即使在氧气。 的IR-M-O导电电极/势垒结构是在非易失性FeRAM的设备,DRAM中,电容器,热电型红外线传感器,光学显示器,光学开关,压电换能器是有用的,并且表面声波装置。 因此,提供一种用于在铱-M-O复合膜阻挡层和Ir-M-O复合薄膜铁电电极形成方法。
    • 5. 发明公开
    • Allyl-derived precursor and synthesis method
    • Allyl-enthaltendeVorläuferverbindungund deren Herstellung
    • EP1016666A3
    • 2002-01-16
    • EP99308873.1
    • 1999-11-08
    • SHARP KABUSHIKI KAISHA
    • Zhuang, Wei-WeiNguyen, TueEvans, David R.Hsu, Sheng TengStecker, Greg MichaelCharneski, Lawrence J.
    • C07F1/00C07F7/08C23C16/44
    • C23C16/18C07F1/08C07F7/082
    • A Cu(hfac) allyl-derived ligand precursor has been provided. The ligand includes group consisting of alkyl, phenyl, trialkylsilane, trialkoxylsilane, halodialkylsilane, dihaloalkylsilane, trihalosilane, triphenylsilane, alkoxyl, halogen, chloroformate, cyanide , cycloalkyl, cycloalkylamine, alkyl ether, isocyanate, and pentafluorobenzene. Examples of the allyl-derived ligand precursors have proved to be stable at room temperatures, and sufficiently volatile at higher temperatures. Copper deposited with this precursor has low resistivity and high adhesive characteristics. A synthesis method has been provided which produces a high yield of the above-described precursors, including a Cu(hfac)(allyltrimethylsilane) precursor.
    • 已经提供了一种Cu(hfac)烯丙基衍生的配体前体。 配体包括由烷基,苯基,三烷基硅烷,三烷氧基硅烷,卤代烷基硅烷,二卤代烷基硅烷,三卤硅烷,三苯基硅烷,烷氧基,卤素,氯甲酸酯,氰化物,环烷基,环烷基胺,烷基醚,异氰酸酯和五氟苯组成的组。 已经证明烯丙基衍生的配体前体的实例在室温下是稳定的,并且在较高温度下具有足够的挥发性。 沉积有该前体的铜具有低电阻率和高粘合特性。 提供了一种合成方法,其产生高产率的上述前体,包括Cu(hfac)(烯丙基三甲基硅烷)前体。