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    • 4. 发明公开
    • VERFAHREN UND VORRICHTUNG ZUM BESTÜCKEN VON SUBSTRATEN MIT BAUELEMENTEN
    • VERFAHREN UND VORRICHTUNG ZUMBESTÜCKENVON SUBSTRATEN MIT BAUELEMENTEN
    • EP1175815A1
    • 2002-01-30
    • EP00938518.8
    • 2000-04-28
    • SIEMENS AKTIENGESELLSCHAFT
    • GRASMÜLLER, Hans-HorstBACHTHALER, ThomasNUMBERGER, RichardBARNOWSKI, Frank
    • H05K13/04
    • H05K13/0408
    • At least the parts of the holding device (3) that are facing towards the component (2) are coupled to the placement head (4) by a spring (6), in order to achieve a defined contact pressure of the components (2) on the substrates. Said spring causes the components (2) to accelerate excessively as they are received from supply devices, which can cause said components (2) to fall off. According to the invention and device, the spring coupling is replaced by a rigid coupling as the component (2) is received from the supply device (8). The acceleration that acts on the component (2) is reduced, so that the placement capacity can be improved through higher receiving speeds while maintaining the same degree of acceleration actually acting on the component (2).
    • 保持装置(3)的朝向部件(2)的至少部分通过弹簧(6)联接到放置头部(4),以便实现部件(2)的限定的接触压力, 在衬底上。 所述弹簧在部件(2)从供应装置接收时过度加速,这会导致所述部件(2)脱落。 根据本发明和装置,当部件(2)从供应装置(8)接收时,弹性联接器由刚性联接器代替。 作用于部件(2)的加速度减小,从而通过更高的接收速度可以提高布置容量,同时保持实际作用在部件(2)上的相同的加速度。