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1. 发明公开

EP1882955A1 Fault Detection Apparatus For Surface Mount Package 审中-公开
标题翻译： Gerht zur Fehlerermittlung beioberflächenmontiertenGehäusen
公开(公告)号：EP1882955A1
公开(公告)日：2008-01-30
申请号：EP06118127.7
申请日：2006-07-28
申请人： Research In Motion Limited
发明人： Sheeran, John
IPC分类号： G01R31/04
CPC分类号： G01R31/048
摘要： A fault detection apparatus (60) for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board (38) such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount package. When mounted within the apparatus, a test signal is applied to the electrical component. The apparatus includes a mechanical actuator, such as a solenoid (68), for applying a reciprocating force to the circuit board (38). The reciprocating force can disturb a defect (54) in the ball grid array manifesting as a mechanically unreliable connection at one of the balls where an electrically intermittent connection is occurring. By disturbing the mechanically unreliable connection, the electrically intermittent connection can be caused to fail altogether and thereby reveal the defect as a test signal is carried through the printed circuit board.
摘要翻译：提供了一种用于表面贴装封装的故障检测装置（60）。该装置可以包括用于可释放地固定电路板（38）的保持器，例如经由球栅阵列表面安装封装安装在其上的电气部件的印刷电路板。当安装在设备内时，将测试信号施加到电气部件。该装置包括用于向电路板（38）施加往复力的机械致动器，例如螺线管（68）。往复力可以扰乱球栅阵列中的缺陷（54），其表现为在发生电间断连接的球之一中机械不可靠的连接。通过扰乱机械不可靠的连接，可以使电气间断连接完全失效，从而在通过印刷电路板传送测试信号时显露缺陷。

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