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    • 1. 发明公开
    • PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF
    • 美国华盛顿州哈萨克斯坦
    • EP1600812A1
    • 2005-11-30
    • EP04717285.3
    • 2004-03-04
    • NIPPON KAYAKU KABUSHIKI KAISHA
    • TANAKA, RyutaroKOYANAGI, Hiroo
    • G03F7/027G03F7/035C08G18/67C08F290/06
    • C08G18/773C08F290/067C08G18/4837C08G18/5015C08G18/5021C08G18/5072C09J175/04G03F7/027G03F7/038
    • A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
    • 对光化学能量射线(感光度)的敏感度优异的感光性树脂组合物在短时间内是可硬化的,并且可以通过用碱性水溶液的显影形成图案,并且在后固化步骤中通过热固化得到固化膜, 该固化膜具有令人满意的柔性,并且适用于绝缘性优异的镀金,无电镀金和镀锡电阻的焊料掩模油墨; 及其固化物。 特别是一种感光性树脂组合物,其特征在于,含有(1)可溶于碱水溶液的聚氨酯树脂(A),在不存在催化剂的情况下通过氨基甲酸酯化得到的聚氨酯树脂,二异氰酸酯化合物(a),具有烯属不饱和的二醇化合物 其分子(b)中的基团和其分子中具有羧基的二醇化合物(c)任选地与在其分子(d)中不具有任何烯键式不饱和基团或羧基的二醇化合物一起,并使反应产物与环状 酸酐(e); (2)光聚合引发剂(B); 和(3)反应性交联剂(C)。
    • 3. 发明公开
    • PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
    • 美国皇家美术大师哈萨克斯坦
    • EP1710626A1
    • 2006-10-11
    • EP05703982.8
    • 2005-01-21
    • NIPPON KAYAKU KABUSHIKI KAISHA
    • KOYANAGI, HirooTANAKA, RyutaroKAMETANI, Hideaki
    • G03F7/027
    • G03F7/027G03F7/038
    • [PROBLEMS]
      To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof.
      [MEANS FOR SOLVING PROBLEMS]
      A photosensitive resin composition comprising a carboxyl group-containing resin (A) which is a reaction product of a compound (a) represented by the following formula (1):

      wherein n is an average value of 1 to 20; R 1 and R 2 may be the same or different, and are each a hydrogen atom, a halogen atom or a C 1 to C 4 lower alkyl group; R 3 , R 5 , R 8 and R 10 may be the same or different, and are each a hydrogen atom, a halogen atom or a methyl group; and R 4 , R 6 , R 7 and R 9 may be the same or different, and are each a hydrogen atom or a methyl group, a compound (b) having an ethylenically unsaturated group and a glycidyl group in the molecule and a polybasic acid anhydride (c), a crosslinking agent (B) and a photopolymerization initiator (C), and a cured product thereof.
    • [问题]为了提供具有优异的光敏性的感光性树脂组合物,其固化物的粘合性,铅笔硬度,耐溶剂性,耐酸性,耐热性,耐镀金性,HAST性,阻燃性,柔软性等优异的固化物 。 解决问题的手段一种含有含羧基的树脂(A)的感光性树脂组合物,其为由下式(1)表示的化合物(a)的反应产物:其中n为1〜20的平均值 ; R 1和R 2可以相同或不同,各自为氢原子,卤素原子或C 1〜C 4低级烷基; R 3,R 5,R 8和R 10可以相同或不同,分别为氢原子,卤原子或甲基; R 4,R 6,R 7和R 9可以相同或不同,分别为氢原子或甲基,分子中具有烯键式不饱和基团和缩水甘油基的化合物(b)和多元碱 酸酐(c),交联剂(B)和光聚合引发剂(C)及其固化物。
    • 4. 发明公开
    • POLYAMIDE ACID RESIN HAVING UNSATURATED GROUP, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, AND CURED PRODUCT THEREOF
    • 与不饱和基团感光性树脂组合物和固化物THEREOF聚酰胺树脂酸
    • EP1698651A1
    • 2006-09-06
    • EP04807366.2
    • 2004-12-20
    • NIPPON KAYAKU KABUSHIKI KAISHA
    • AMISHIMA, ChikaTANAKA, RyutaroKAMETANI, HideakiKOYANAGI, Hiroo
    • C08G73/16G03F7/027
    • C08L79/08C08G73/16G03F7/037H05K1/0346H05K3/3452
    • The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C).
    • 本发明提供了一种新颖的聚酰胺酸树脂(A)中的不饱和基团含有适合于感光性树脂组合物,以及使用该感光性树脂组合物,所有这些都具有优良的感光性,并将所得固化产物具有优异的柔韧性,以及 作为密合性,铅笔硬度,耐溶剂性,耐酸性,耐热性,耐镀金性,等等。 所述不饱和基团含有聚酰胺酸树脂(A)通过在(a)具有终端酐基的含不饱和基团的聚酯树脂反应而获得的,和(b)具有2个氨基中的分子的化合物,并且所述光敏树脂组合物 是通过使含有所述聚酰胺酸树脂(A)与包含不饱和基团,交联剂(B)和光聚合引发剂(C)的树脂组合物得到。
    • 7. 发明公开
    • PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
    • 美国皇家美术大师哈萨克斯坦
    • EP1715381A1
    • 2006-10-25
    • EP05709869.1
    • 2005-02-08
    • NIPPON KAYAKU KABUSHIKI KAISHA
    • TANAKA, RyutaroNAKANISHI, MasatakaAKATSUKA, YasumasaKOYANAGI, Hiroo
    • G03F7/004C08G59/32G03F7/027
    • G03F7/038C08G59/32
    • Disclosed is a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. Also disclosed is such a cured product. Specifically disclosed is a photosensitive resin composition containing a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1).

      [In the formula, R 1 to R 8 independently represents a hydrogen atom, a C 1 -C 4 alkyl group or a halogen atom.]
    • 本发明公开了一种具有优异的光敏性的光敏树脂组合物,其固化产物的粘合性,铅笔硬度,耐溶剂性,耐酸性,耐热性,耐镀金性等优异。 还公开了这种固化产物。 具体公开了含有可溶于碱性水溶液的树脂(A),交联剂(B),光聚合引发剂(C)和固化剂(D))的光敏树脂组合物,其中固化剂(D)为环氧树脂 通过使含有不少于80%由下式(1)表示的四苯基乙烷衍生物的化合物缩水甘油化获得的化合物。 [式中,R 1〜R 8独立地表示氢原子,C 1〜C 4烷基或卤素原子。
    • 9. 发明公开
    • URETHANE OLIGOMER, RESIN COMPOSITIONS THEREOF, AND CURED ARTICLE THEREOF
    • URETHANOLIGOMER,HARZZUSAMMENSETZUNGEN UNDGEHÄRTETEGEGENSTÄNDE
    • EP1170315A1
    • 2002-01-09
    • EP00909644.7
    • 2000-03-15
    • Nippon Kayaku Kabushiki Kaisha
    • MORI, SatoshiYOKOSHIMA, MinoruKIYOYANAGI, NorikoMATSUO, YuichiroKOYANAGI, Hiroo
    • C08G18/67C08G59/14C08F290/06C08F299/06
    • G03F7/0388C08F283/006C08F283/10C08F290/00C08F290/06C08F290/147C08G18/6254C08G18/672C08G18/683C08L63/10C09D175/04G03F7/027H05K3/287Y10S428/901Y10T428/24917Y10T428/31551C08G18/42C08L75/04
    • The present invention is intended to provide a resin and a resin composition that can be diluted with water and is excellent in providing a cured product (curing, adhesion, and water resistance); a resin composition that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.
      A urethane oligomer (A) obtained by reacting a polyol compound(a) with a polybasic acid anhydride(b-1) having at least two acid anhydride groups per molecule, a polyisocyanate compound(c), and a hydroxy compound having ethylenically unsaturated groups; and
      A resin composition and a photosensitive film comprising (1) the above oligomer (A); (2) one or more resins selected from an unsaturated group-containing polycarboxylic acid (B), a reactive diluent(C-1)such as (meth)acrylates, an unreactive diluent(C-2)such as carbitol acetate and a thermoplastic polymer(D); and (3) a photopolymerization initiator.
    • 本发明旨在提供可以用水稀释并且提供固化产物(固化,粘合和耐水性)优异的树脂和树脂组合物; 由于固化物的柔软性,耐焊锡性等优异,可以用有机溶剂或稀碱溶液显影,因此适用于阻焊剂和层间绝缘层的树脂组合物; 适用于抗蚀剂或覆盖层的感光性树脂组合物; 和由此获得的感光膜。 通过使多元醇化合物(a)与每分子具有至少两个酸酐基的多元酸酐(b-1)反应得到的氨基甲酸酯低聚物(A),多异氰酸酯化合物(c)和具有烯属不饱和基团的羟基化合物 ; 和A树脂组合物和感光膜,其包含(1)上述低聚物(A); (2)一种或多种选自不饱和基团的多元羧酸(B),反应性稀释剂(C-1)如(甲基)丙烯酸酯,非反应性稀释剂(C-2)如卡必醇乙酸酯和热塑性塑料 聚合物(D); 和(3)光聚合引发剂。