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1. 发明公开

EP3086305A4 ELECTRONIC DEVICE, AND TRANSLUCENT COVER MEMBER FOR ELECTRONIC DEVICE 有权
标题翻译： ELEKTRONISCHE VORRICHTUNG UNDLICHTDURCHLÄSSIGEABDECKUNGFÜRELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3086305A4
公开(公告)日：2017-08-23
申请号：EP14872544
申请日：2014-12-22
申请人： KYOCERA CORP
发明人： UMEHARA MOTOHIRO , MURAKAMI SHIN
IPC分类号： G09F9/00 , G02B1/02 , G02B5/20 , H04M1/02
CPC分类号： G02B5/208 , G02B1/02 , H04M1/0266 , H04M1/0279 , H04M1/03 , H04R17/005 , H04R2400/03 , H04R2499/11
摘要： An electronic apparatus, comprising: an image display device that includes an image display surface; and a light-transmissive cover member that is disposed such that at least part of the light-transmissive cover member faces the image display surface, wherein the light-transmissive cover member comprises a single crystal body containing alumina (Al 2 O 3 ) as a main component, and the single crystal body, a transmittance (%) of light having a wavelength of 260 nm is smaller than 92% of a transmittance (%) of light having a wavelength of a 550 nm.
摘要翻译： 1。一种电子设备，包括：图像显示装置，其包括图像显示表面; 以及透光性的罩部件，该透光性的罩部件被配置成使得所述透光性的罩部件的至少一部分与所述图像显示面相对，所述透光性的罩部件由含有氧化铝（Al 2 O 3）作为主成分和单晶体时，具有260nm波长的光的透射率（％）小于具有550nm波长的光的透射率（％）的92％。

2. 发明公开

EP0792955A3 Sapphire single crystal, semiconductor laser diode using the same for substrate, and method for manufacturing the same 失效
标题翻译：蓝宝石单晶，其如在一个半导体激光二极管的基板和其制备方法使用
公开(公告)号：EP0792955A3
公开(公告)日：1998-05-13
申请号：EP97301352
申请日：1997-02-28
申请人： KYOCERA CORP
发明人： KINOSHITA HIROYUKI , UMEHARA MOTOHIRO
IPC分类号： C30B33/00 , H01S5/02 , H01S5/32 , H01S5/323 , C30B29/20 , C30B15/34 , H01S3/085
CPC分类号： H01S5/32341 , C30B29/20 , C30B33/00 , G02B1/02 , H01S5/0202 , H01S5/0213 , H01S5/0422 , H01S5/3202
摘要： A sapphire single crystal body useful as a substrate, of thin film growth, for semiconductor or the like electronic parts or component parts, a single crystal sapphire substrate, and a method for working the same are disclosed. Considering that the cleavage plane of the plane R of the sapphire single crystal body has a smooth plane high in surface precision and is easier to cleave, for an easier dividing operation, by cleaving, of the substrate after the formation of the element such as semiconductor element, functional element, a reference plane substantially parallel or vertical to the plane R is provided on the periphery of the substrate, so as to make an index for controlling the plane R in the cleavage division. Forming a linear crack parallel or vertical to the reference plane of the substrate provides a starting point to develop the crack in the thickness direction. In a laser diode of the invention, the single crystal sapphire substrate which forms the semiconductor multilayer is cleaved, divided along the plane R to form the cleaved plane connected with the semiconductor multilayer and the substrate. Since the cleaved plane of the semiconductor muitilayer is an extremely smooth plane, the cleaved plane can be used for the reflection plane for laser resonator use of the semiconductor multilayer.
摘要翻译：蓝宝石单晶体作为一个有用的基片，薄膜生长的，对于半导体等电子部件或组成部分，单晶蓝宝石衬底，和用于工作的同一个方法游离缺失光盘。考虑没有所述蓝宝石单晶体的平面R的解理面具有光滑的平面高的表面精确度，并且更容易切割，在容易将手术，由元件形成后切割基板的，：诸如半导体元件，功能元件，一个基准平面基本上平行或垂直于平面R被设置在基片的周边上，从而使一个索引，用于控制在所述裂解的分裂平面R。形成线性裂缝平行或垂直于基板的基准平面提供了一个起点来开发在厚度方向上的裂纹。在本发明的一个激光二极管，其形成在半导体多层单晶蓝宝石衬底被切割，沿着将R分割，以形成与半导体层叠基板和平面相连的切割平面。由于半导体muitilayer的解理平面计划极其光滑，切割的平面可用于反射面的激光谐振器中使用的半导体多层的。

3. 发明公开

EP3226286A4 SAW DEVICE AND METHOD FOR MANUFACTURING SAW DEVICE 有权
公开(公告)号：EP3226286A4
公开(公告)日：2018-07-25
申请号：EP15862238
申请日：2015-11-27
申请人： KYOCERA CORP
发明人： UMEHARA MOTOHIRO , NABESHIMA YUTAKA
IPC分类号： H03H9/02 , H03H3/08 , H03H9/10
CPC分类号： H03H9/25 , H01L23/04 , H01L23/08 , H01L41/23 , H01L41/29 , H01L41/312 , H01L2924/0002 , H03H3/08 , H03H9/02559 , H03H9/1071 , H03H9/14538 , H01L2924/00
摘要： A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

4. 发明公开

EP3089141A4 ELECTRONIC DEVICE AND LIGHT-TRANSMITTING COVER SUBSTRATE FOR ELECTRONIC DEVICE 有权
标题翻译： ELEKTRONISCHE VORRICHTUNG UNDLICHTDURCHLÄSSIGESABDECKSUBSTRATFÜREINE ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3089141A4
公开(公告)日：2017-08-23
申请号：EP14874333
申请日：2014-12-24
申请人： KYOCERA CORP
发明人： UMEHARA MOTOHIRO , TSUBOKURA SATORU
IPC分类号： G09F9/00 , G02F1/1333 , G06F1/16 , G06F1/20 , H04M1/02
CPC分类号： F21V15/01 , F21V33/00 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1688 , G06F1/203 , H04M1/0266 , H04M1/0268 , H04M1/22 , H04R2499/11

5. 发明公开

EP3065168A4 SAPPHIRE STRUCTURE HAVING ATTACHED METAL BODY, METHOD FOR MANUFACTURING SAPPHIRE STRUCTURE HAVING ATTACHED METAL BODY, ELECTRONIC DEVICE, AND OUTER PACKAGE 有权
标题翻译： SAPHIRSTRUKTUR MITANGEHÄNGTEMMETALLKÖRPER，VERFAHREN ZUR HERSTELLUNG DER SAPHIRSTRUKTUR MITANGEHÄNGTEMMETALLKÖRPER，ELEKTRONISCHE VORRICHTUNG UND AUSSENVERPACKUNG
公开(公告)号：EP3065168A4
公开(公告)日：2017-07-19
申请号：EP14856813
申请日：2014-10-30
申请人： KYOCERA CORP
发明人： UMEHARA MOTOHIRO , KUBO YOSHINORI
IPC分类号： H01L23/15 , B06B1/06 , G06F1/16 , H01L21/02 , H01L23/12 , H01L41/09
CPC分类号： H01L29/04 , B06B1/00 , B06B1/0603 , G06F1/1626 , G06F1/1656 , G06F1/203 , H01L21/441 , H01L21/465 , H01L41/00 , H01L41/0926
摘要： There is provided a sapphire structure with a metal body including a sapphire structure that includes a flat surface and is provided with a concave portion on the flat surface; and a metal body that is disposed in the concave portion and bonded to an inner surface of the concave portion, in which the metal body includes a surface portion that is substantially with the flat surface.
摘要翻译：提供了一种蓝宝石结构，其具有包括蓝宝石结构的金属体，该蓝宝石结构包括平坦表面并且在该平坦表面上设置有凹部; 以及金属体，其配置在所述凹部内并与所述凹部的内表面接合，所述金属体具有大致平坦的表面部。

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