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1. 发明授权

EP0525820B1 Joined ceramic-metal composite substrate and method for production thereof 失效
标题翻译：陶瓷 - 金属复合材料和过程及其制备
公开(公告)号：EP0525820B1
公开(公告)日：1997-04-02
申请号：EP92114579.3
申请日：1988-12-15
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Mizunoya, Nobuyuki , Komorita, Hiroshi , Tanaka, Tadashi , Matsumura, Kazuo
IPC分类号： C04B37/02 , H01L21/48
CPC分类号： H05K3/38 , C04B37/021 , C04B2235/6567 , C04B2235/785 , C04B2237/40 , C04B2237/407 , C04B2237/568 , Y10S428/901 , Y10T428/24322 , Y10T428/24777 , Y10T428/24917 , Y10T428/24926 , Y10T428/31678

2. 发明授权

EP0481308B1 Method of manufacturing ceramics circuit board 失效
标题翻译：一种用于制造陶瓷电路板的过程
公开(公告)号：EP0481308B1
公开(公告)日：1996-12-18
申请号：EP91116978.7
申请日：1991-10-04
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Matsumura, Kazuo , Tanaka, Tadashi , Tsurutani, Shoji
IPC分类号： H05K3/20 , H05K3/06
CPC分类号： H05K3/202 , H05K1/0306 , H05K3/061 , H05K2203/0369 , H05K2203/175 , Y10S428/901 , Y10T428/24917

4. 发明公开

EP0525820A2 Joined ceramic-metal composite substrate and method for production thereof 失效
标题翻译： Keramik-Metall-Verbund和Verfahren zu seiner Herstellung。
公开(公告)号：EP0525820A2
公开(公告)日：1993-02-03
申请号：EP92114579.3
申请日：1988-12-15
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Mizunoya, Nobuyuki , Komorita, Hiroshi , Tanaka, Tadashi , Matsumura, Kazuo
IPC分类号： C04B37/02 , H01L21/48
CPC分类号： H05K3/38 , C04B37/021 , C04B2235/6567 , C04B2235/785 , C04B2237/40 , C04B2237/407 , C04B2237/568 , Y10S428/901 , Y10T428/24322 , Y10T428/24777 , Y10T428/24917 , Y10T428/24926 , Y10T428/31678
摘要： A method of producing a ceramic circuit substrate comprising forming at least one groove (11) on a face of a copper circuit board (10) of prescribed shape while providing a gas venting passage (12) to allow gas to reach the opposite face of the copper circuit board (10), and subsequently heat bonding the said face of the board (10) to a ceramic substrate (13), characterised in that the or each groove is formed by plastic deformation of the said face, in that at least part of the periphery of the copper circuit board (10) is left without any groove (11), and in that the or each groove flattens out, and the said face permanently recovers its flat shape, to a considerable extent, during the heat bonding step, thereby increasing the thermal conductivity of the composite substrate by virtue of the decreased gap between ceramic substrate and copper sheet in the region of the groove or grooves.
摘要翻译：一种制造陶瓷电路基板的方法，包括在规定形状的铜电路板（10）的表面上形成至少一个凹槽（11），同时提供气体通道（12），以允许气体到达铜电路板（10），并且随后将所述板（10）的所述面热粘合到陶瓷基板（13）上，其特征在于，所述或每个凹槽由所述面的塑性变形形成，其中至少部分没有任何槽（11）的铜电路板（10）的周边没有任何凹槽（11），并且所述面板或每个凹槽平坦化，并且所述面在相当大的程度上在热粘合步骤期间永久地恢复其平坦形状从而通过在槽或槽的区域中陶瓷基板和铜片之间的间隙减小，从而提高复合基板的热导率。

5. 发明公开

EP0525820A3 Joined ceramic-metal composite substrate and method for production thereof 失效
标题翻译：接合陶瓷金属复合基板及其生产方法
公开(公告)号：EP0525820A3
公开(公告)日：1993-06-02
申请号：EP92114579.3
申请日：1988-12-15
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Mizunoya, Nobuyuki , Komorita, Hiroshi , Tanaka, Tadashi , Matsumura, Kazuo
IPC分类号： C04B37/02 , H01L21/48
CPC分类号： H05K3/38 , C04B37/021 , C04B2235/6567 , C04B2235/785 , C04B2237/40 , C04B2237/407 , C04B2237/568 , Y10S428/901 , Y10T428/24322 , Y10T428/24777 , Y10T428/24917 , Y10T428/24926 , Y10T428/31678
摘要： A method of producing a ceramic circuit substrate comprising forming at least one groove (11) on a face of a copper circuit board (10) of prescribed shape while providing a gas venting passage (12) to allow gas to reach the opposite face of the copper circuit board (10), and subsequently heat bonding the said face of the board (10) to a ceramic substrate (13), characterised in that the or each groove is formed by plastic deformation of the said face, in that at least part of the periphery of the copper circuit board (10) is left without any groove (11), and in that the or each groove flattens out, and the said face permanently recovers its flat shape, to a considerable extent, during the heat bonding step, thereby increasing the thermal conductivity of the composite substrate by virtue of the decreased gap between ceramic substrate and copper sheet in the region of the groove or grooves.

6. 发明公开

EP0523598A1 Ceramics circuit board 失效
标题翻译： Keramische Leiterplatte。
公开(公告)号：EP0523598A1
公开(公告)日：1993-01-20
申请号：EP92111918.6
申请日：1992-07-13
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Komorita, Hiroshi , Mizunoya, Nobuyuki , Matsumura, Kazuo , Ikeda, Kazuo , Naba, Takayuki , Tanaka, Tadashi
IPC分类号： H05K1/03
CPC分类号： H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/19107 , H05K1/0271 , H05K1/0306 , H05K3/38 , H05K3/4092 , H05K2201/0355 , H05K2201/098 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , H01L2924/00014 , H01L2924/00
摘要： This invention provides a ceramics circuit board comprising: a ceramics base board (1); a metal circuit plate (7A to 7E) integrally bonded onto a surface of the ceramics base board (1); a terminal connecting port (3A to 3E) formed by bending a part of the matal circuit plate for connecting a terminal (4) of a module, the terminal connecting port being formed so that the terminal connecting port being raised from a surface of the ceramics base board (1), and a curvature radius (R₁, R₂) of the bended portion provided on the terminal connecting port is set to 0.2 mm or more. A communication hole such as groove or through hole may also be formed at a bonding surface between the metal circuit plate and the ceramics base board.
摘要翻译：本发明提供一种陶瓷电路板，包括：陶瓷基板（1）; 一体地结合到陶瓷基板（1）的表面上的金属电路板（7A至7E）; 通过弯曲用于连接模块的端子（4）的马达电路板的一部分而形成的端子连接端口（3A至3E），端子连接端口形成为使得端子连接端口从陶瓷的表面升高基板（1）和设置在端子连接口上的弯曲部分的曲率半径（R1，R2）设定为0.2mm以上。还可以在金属电路板和陶瓷基板之间的接合表面上形成诸如槽或通孔的连通孔。

7. 发明公开

EP0481308A1 Method of manufacturing ceramics circuit board 失效
标题翻译： Verfahren zur Herstellung einer keramischen Leiterplatte。
公开(公告)号：EP0481308A1
公开(公告)日：1992-04-22
申请号：EP91116978.7
申请日：1991-10-04
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Matsumura, Kazuo , Tanaka, Tadashi , Tsurutani, Shoji
IPC分类号： H05K3/20 , H05K3/06
CPC分类号： H05K3/202 , H05K1/0306 , H05K3/061 , H05K2203/0369 , H05K2203/175 , Y10S428/901 , Y10T428/24917
摘要： A ceramics circuit board (5a) is manufactured by preliminarily preparing a circuit pattern base (3a) composed of a plurality of circuit pattern elements (1a,1b,1c,1d) connected by bridging pieces (2a) each having a thickness smaller than that of the circuit pattern element (1a,1b,1c,1d), preferably less than half thickness of the circuit pattern base (3a), applying and bonding the circuit pattern base (3a) onto one surface of a ceramics board base (5a) and removing the bridging pieces (2a) by effecting an etching treatment to thereby form a circuit pattern having a predetermined shape on the one surface of the ceramics board base (5a). The circuit pattern base (3a) and the bridging pieces (2a) are formed of one metallic plate by partially effecting etching treatment. The bridging pieces (2a) are arranged so as to have a gap between a rear surface thereof and the one surface of the ceramics board base when the circuit pattern base (3a) is applied on the one surface of the ceramics board base (5a). The bonding step may be carried out by forming, on a surface to be bonded, an eutectic material composed of the same metallic material as that composing the circuit pattern base and oxygen. It is preferred that the method further includes the step of applying and bonding a copper plate (4a) to another surface of the ceramics board base (5a) before the etching treatment.
摘要翻译：通过预先制备由多个电路图案元件（1a，1b，1c，1d）构成的电路图案基底（3a），制成陶瓷电路板（5a），该多个电路图案元件（1a，1b，1c，1d）的厚度小于（1a，1b，1c，1d），优选小于电路图形基底（3a）的一半厚度，将电路图案基底（3a）施加到陶瓷基板（5a）的一个表面上，通过进行蚀刻处理从而形成具有预定形状的电路图案，从而在陶瓷基板（5a）的一个表面上形成桥接片（2a）。通过部分地进行蚀刻处理，电路图案基底（3a）和桥接片（2a）由一个金属板形成。当将电路图案基底（3a）施加在陶瓷基板（5a）的一个表面上时，桥接件（2a）布置成在其后表面和陶瓷基板的一个表面之间具有间隙，。接合步骤可以通过在与待结合的表面上形成由与组成电路图案基底的氧化合物相同的金属材料构成的共晶材料来进行。优选的是，该方法还包括在蚀刻处理之前将铜板（4a）施加并粘接到陶瓷基板（5a）的另一表面的步骤。

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