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1. 发明公开

EP1134729A2 Magnetic head and magnetic recording and reproducing system 审中-公开
标题翻译： Magnetischer Kopf和磁石Aufzeichnungs-和Wiedergabesystem
公开(公告)号：EP1134729A2
公开(公告)日：2001-09-19
申请号：EP01302288.4
申请日：2001-03-13
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Funayama, Tomoni , Yoshikawa, Masatoshi , Koizumi, Takashi , Hori, Akio , Osawa, Yuichi
IPC分类号： G11B5/187 , G11B5/193 , G11B5/127 , G11B5/133
CPC分类号： B82Y10/00 , G11B5/3903 , G11B5/3967
摘要： There are provided a magnetic head for vertical magnetic recording capable of suppressing noises due to a magnetically soft layer and improving the lowering of efficiency, and a magnetic recording and/or reproducing system using the same. The magnetic head includes: a recording head (8) comprising a first main pole (1) and a first return yoke (2), the first main pole having a first medium facing portion, the first return yoke having a second medium facing portion, the first and second medium facing portions are disposed with first magnetic gap therebetween, and a reproducing head (9) comprising a second main pole (4) and a second return yoke (5), the second main pole having a third medium facing portion, the second return yoke having a fourth medium facing portion, the third and fourth medium facing portions are disposed with second magnetic gap therebetween, first angle θ1 between first and second straight lines being smaller than second angle θ2 between the first straight line and third straight line, the first straight line (L1) connecting centers of medium facing surfaces of the first medium facing portion and the second medium facing portion, the second straight line (L2) connecting opposing corners of medium facing surfaces of the first medium facing portion and the second medium facing portion, and the third straight line (L3) connecting centers of medium facing surfaces of the third medium facing portion and the fourth medium facing portion. With this construction, the direction of magnetic fluxes flowing through medium during a recording operation is not coincident with that during a reproducing operation, so that it is possible to prevent the generation of Barkhausen noises, which are generated when both directions are coincident with each other, and the lowering of reproducing efficiency.
摘要翻译：提供了一种用于垂直磁记录的磁头，其能够抑制由软磁层引起的噪声并提高效率的降低，以及使用该磁头的磁记录和/或再现系统。磁头包括：包括第一主极（1）和第一返回轭（2）的记录头（8），第一主极具有第一介质面对部分，第一返回轭具有第二介质面对部分，第一和第二介质面对部分之间设置有第一磁隙，以及包括第二主极（4）和第二返回轭（5）的再现头（9），第二主极具有第三介质面对部分，所述第二回转轭具有第四介质面对部分，所述第三和第四介质面对部分之间设置有第二磁隙，第一角度和角度;第一和第二直线之间的1小于第二角度和角度;在第一直线之间和第三直线，连接第一介质对向部分和第二介质面向部分的介质相对表面的中心的第一直线（L1），连接相对角部的第二直线（L2）所述第一介质面对部分和所述第二介质面对部分的介质面向表面以及连接所述第三介质面向部分和所述第四介质面向部分的介质相对表面的中心的所述第三直线（L3）。利用这种结构，在记录操作期间流过介质的磁通量的方向与再现操作期间的磁通量的方向不一致，使得可以防止当两个方向彼此一致时产生的巴克豪森噪声，再现效率降低。

2. 发明公开

EP1134729A3 Magnetic head and magnetic recording and reproducing system 审中-公开
标题翻译：磁头和magnetiches录制和播放系统
公开(公告)号：EP1134729A3
公开(公告)日：2002-08-07
申请号：EP01302288.4
申请日：2001-03-13
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Funayama, Tomoni , Yoshikawa, Masatoshi , Koizumi, Takashi , Hori, Akio , Osawa, Yuichi
IPC分类号： G11B5/012 , G11B5/127 , G11B5/39 , G11B5/187 , G11B5/193 , G11B5/133
CPC分类号： B82Y10/00 , G11B5/3903 , G11B5/3967
摘要： There are provided a magnetic head for vertical magnetic recording capable of suppressing noises due to a magnetically soft layer and improving the lowering of efficiency, and a magnetic recording and/or reproducing system using the same. The magnetic head includes: a recording head (8) comprising a first main pole (1) and a first return yoke (2), the first main pole having a first medium facing portion, the first return yoke having a second medium facing portion, the first and second medium facing portions are disposed with first magnetic gap therebetween, and a reproducing head (9) comprising a second main pole (4) and a second return yoke (5), the second main pole having a third medium facing portion, the second return yoke having a fourth medium facing portion, the third and fourth medium facing portions are disposed with second magnetic gap therebetween, first angle θ1 between first and second straight lines being smaller than second angle θ2 between the first straight line and third straight line, the first straight line (L1) connecting centers of medium facing surfaces of the first medium facing portion and the second medium facing portion, the second straight line (L2) connecting opposing corners of medium facing surfaces of the first medium facing portion and the second medium facing portion, and the third straight line (L3) connecting centers of medium facing surfaces of the third medium facing portion and the fourth medium facing portion. With this construction, the direction of magnetic fluxes flowing through medium during a recording operation is not coincident with that during a reproducing operation, so that it is possible to prevent the generation of Barkhausen noises, which are generated when both directions are coincident with each other, and the lowering of reproducing efficiency.

3. 发明公开

EP0153618A2 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same 失效
标题翻译：一种用于制造高导热性基板和在该方法中使用的铜导体板的过程。
公开(公告)号：EP0153618A2
公开(公告)日：1985-09-04
申请号：EP85101186.6
申请日：1985-02-05
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Nakahashi, Masako , Shirokane, Makoto , Yamazaki, Tatsuo , Yoshino, Hisashi , Hori, Akio , Takeda, Hiromitsu
IPC分类号： H01L21/48 , H01L23/14
CPC分类号： C04B35/645 , B23K35/268 , B32B3/10 , B32B9/005 , B32B9/041 , B32B15/018 , B32B15/02 , B32B15/20 , B32B2250/44 , B32B2255/205 , B32B2307/302 , B32B2307/304 , B32B2307/732 , B32B2457/14 , C04B37/02 , C04B37/026 , C04B2235/6581 , C04B2237/12 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/366 , C04B2237/407 , C04B2237/62 , C04B2237/708 , C04B2237/72 , C04B2237/76 , C04B2237/86 , C22C5/06 , C22C9/00 , C22C11/06 , C22C14/00 , H01L21/48 , H01L21/4871 , H01L21/4882 , H01L23/142 , H01L23/3735 , H01L24/32 , H01L2924/01322 , H01L2924/15787 , H05K1/0306 , H05K3/38 , H01L2924/00
摘要： A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 µm comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AIN) substrate and a copper member; and joining said aluminium nitride (AIN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.
摘要翻译：一种制备它包括一个具有厚度为0.5至10微米，包括银（Ag）和选自钛，锆和铪，因此铜的选择的活性金属的插入有源层的高导热性的衬底的方法（铜）任选地之间，在氮化铝（AlN）基板和铜构件; 并通过加热海誓山盟接合所述氮化铝（AlN）基底和Said铜（Cu）构件。铜布线片包含上述有源层因此在该方法中使用。

4. 发明授权

EP0107913B1 Radiation-sensitive carrier body utilized as stamper structure 失效
标题翻译：辐射敏感载体作为冲击器结构使用
公开(公告)号：EP0107913B1
公开(公告)日：1988-06-22
申请号：EP83305768.0
申请日：1983-09-27
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takeoka, Yoshikatsu , Yasuda, Nobuaki , Hori, Akio , Ozawa, Norio
IPC分类号： G11B7/26 , G11B7/24
CPC分类号： G11B7/26 , G11B7/241 , G11B7/2531 , G11B7/256 , G11B23/0057 , G11B2007/24306 , G11B2007/2431 , G11B2007/24312 , G11B2007/24314 , G11B2007/24316 , G11B2007/24322 , G11B2007/24328 , Y10S430/146 , Y10S430/165

5. 发明授权

EP0052309B1 Method of manufacturing a semiconductor element 有权转让
标题翻译：制造半导体元件的方法
公开(公告)号：EP0052309B1
公开(公告)日：1984-07-11
申请号：EP81109514.0
申请日：1981-11-04
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Nakamura, Kisaku , Jimi, Eiji , Goto, Haruyuki , Hori, Akio
IPC分类号： H01L21/78 , H01L21/288
CPC分类号： H01L21/78 , H01L21/28 , H01L21/288 , H01L23/4924 , H01L24/11 , H01L2224/05655 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/351 , H01L2924/00 , H01L2924/00014

6. 发明授权

EP0153618B1 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same 失效
标题翻译：制备高导热性基板和铜箔布线的方法
公开(公告)号：EP0153618B1
公开(公告)日：1990-06-13
申请号：EP85101186.6
申请日：1985-02-05
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Nakahashi, Masako , Shirokane, Makoto , Yamazaki, Tatsuo , Yoshino, Hisashi , Hori, Akio , Takeda, Hiromitsu
IPC分类号： H01L21/48 , H01L23/14
CPC分类号： C04B35/645 , B23K35/268 , B32B3/10 , B32B9/005 , B32B9/041 , B32B15/018 , B32B15/02 , B32B15/20 , B32B2250/44 , B32B2255/205 , B32B2307/302 , B32B2307/304 , B32B2307/732 , B32B2457/14 , C04B37/02 , C04B37/026 , C04B2235/6581 , C04B2237/12 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/366 , C04B2237/407 , C04B2237/62 , C04B2237/708 , C04B2237/72 , C04B2237/76 , C04B2237/86 , C22C5/06 , C22C9/00 , C22C11/06 , C22C14/00 , H01L21/48 , H01L21/4871 , H01L21/4882 , H01L23/142 , H01L23/3735 , H01L24/32 , H01L2924/01322 , H01L2924/15787 , H05K1/0306 , H05K3/38 , H01L2924/00
摘要： A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 mu m comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AlN) substrate and a copper member; and joining said aluminium nitride (AlN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.
摘要翻译：一种高导热性基板的制造方法，其特征在于，在所述活性层的中间包含银（Ag）和选自钛，锆和铪的活性金属以及铜（Cu ）可选地，在氮化铝（AlN）衬底和铜构件之间; 并通过加热将所述氮化铝（AlN）衬底和所述铜（Cu）构件彼此接合。在该方法中也可以使用包含上述有源层的铜布线片。

7. 发明公开

EP0153618A3 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same 失效
标题翻译：制备高导热性基板和铜箔布线的方法
公开(公告)号：EP0153618A3
公开(公告)日：1987-04-15
申请号：EP85101186
申请日：1985-02-05
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Nakahashi, Masako , Shirokane, Makoto , Yamazaki, Tatsuo , Yoshino, Hisashi , Hori, Akio , Takeda, Hiromitsu
IPC分类号： H01L21/48 , H01L23/14
CPC分类号： C04B35/645 , B23K35/268 , B32B3/10 , B32B9/005 , B32B9/041 , B32B15/018 , B32B15/02 , B32B15/20 , B32B2250/44 , B32B2255/205 , B32B2307/302 , B32B2307/304 , B32B2307/732 , B32B2457/14 , C04B37/02 , C04B37/026 , C04B2235/6581 , C04B2237/12 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/366 , C04B2237/407 , C04B2237/62 , C04B2237/708 , C04B2237/72 , C04B2237/76 , C04B2237/86 , C22C5/06 , C22C9/00 , C22C11/06 , C22C14/00 , H01L21/48 , H01L21/4871 , H01L21/4882 , H01L23/142 , H01L23/3735 , H01L24/32 , H01L2924/01322 , H01L2924/15787 , H05K1/0306 , H05K3/38 , H01L2924/00
摘要： A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 µm comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AIN) substrate and a copper member; and joining said aluminium nitride (AIN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.
摘要翻译：一种高导热性基板的制造方法，其特征在于，包括厚度为0.5〜10μm的活性层，其中含有银（Ag）和选自钛，锆和铪的活性金属以及铜（Cu ）可选地，在氮化铝（AlN）衬底和铜构件之间; 并通过加热将所述氮化铝（AlN）衬底和所述铜（Cu）构件彼此接合。在该方法中也可以使用包含上述有源层的铜布线片。

8. 发明公开

EP0107913A1 Radiation-sensitive carrier body utilized as stamper structure 失效
标题翻译：辐射敏感载体主体以用作压纹图案。
公开(公告)号：EP0107913A1
公开(公告)日：1984-05-09
申请号：EP83305768.0
申请日：1983-09-27
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takeoka, Yoshikatsu , Yasuda, Nobuaki , Hori, Akio , Ozawa, Norio
IPC分类号： G11B7/26 , G11B7/24
CPC分类号： G11B7/26 , G11B7/241 , G11B7/2531 , G11B7/256 , G11B23/0057 , G11B2007/24306 , G11B2007/2431 , G11B2007/24312 , G11B2007/24314 , G11B2007/24316 , G11B2007/24322 , G11B2007/24328 , Y10S430/146 , Y10S430/165
摘要： A radiation-sensitive carrier body (20') directly utilized as a stamper has a glass substrate (14), a first highly adhesive layer (12) securely adhered to the substrate (14), a radiation-sensitive layer (10') which discharges a gas component upon being irradiated with a laser beam and which locally forms a protuberance (30) due to the absorbed energy, a second highly adhesive layer (16') securely adhered to the specific material of the radiation-sensitive layer (10') and which deforms in accordance with deformation of the layer (10'), and a metal layer (18') which has a high releasability to allow easy separation from a optical disk substrate material such as an acrylic material when the carrier body (20') is used as a stamper substrate for manufacturing optical disks. A protuberance (32) formed on the carrier body (20') such as a continuous spiral protuberance (32) allows formation of a corresponding spiral groove in the acrylic material, serving as a pre-track into which desired information will be digitally written by a user.

9. 发明公开

EP0052309A1 Method of manufacturing a semiconductor element 有权转让
标题翻译：制造半导体元件的方法
公开(公告)号：EP0052309A1
公开(公告)日：1982-05-26
申请号：EP81109514.0
申请日：1981-11-04
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Nakamura, Kisaku , Jimi, Eiji , Goto, Haruyuki , Hori, Akio
IPC分类号： H01L21/78 , H01L21/288
CPC分类号： H01L21/78 , H01L21/28 , H01L21/288 , H01L23/4924 , H01L24/11 , H01L2224/05655 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： This invention relates to a method of manufacturing a plurality of semiconductor elements from a semiconductor wafer in which a plurality. of active elements are formed and is intended to provide particularly a semiconductor element-manufacturing method which saves the semiconductor wafer from cracks or damage during the manufacture of a semiconductor element and enables a solder layer to be deposited on the element regions without irregularities in thickness. The method starts with the step of forming a first metal layer (12) acting as an ohmic electrode by wet plating on each side of the element regions of a semiconductor wafer (11) in which a plurality of active elements are formed or on the whole surface of each side of the wafer (11). Then a second metal layer (14) which has an anticorrosive property and acts as a brazing material when the semiconductor element is mounted between a pair of electrodes, is formed on each of the element areas in the first metal layers (12).
Finally, those portions of the semiconductor wafer which are interposed between the active elements are chemically etched off with the second metal layers (14) used as masks to separate the semiconductor elements (15) from each other, thereby producing a plurality of semiconductor elements (15), each of which has its surfaces coated with the first and second metal layers.
摘要翻译：本发明涉及一种由半导体晶片制造多个半导体元件的方法，旨在提供一种半导体元件制造方法，其在制造半导体元件期间节省半导体晶片免受破裂或损坏，并且使焊料层能够在元件区域上沉积而没有厚度不规则。该方法开始于在形成有多个有源元件的半导体晶片（11）的元件区域的每一侧上通过湿法电镀形成用作欧姆电极的第一金属层（12），或者总体上晶片（11）的每一侧的表面。然后，在第一金属层（12）中的每个元件区域上形成具有防腐蚀性并在半导体元件安装在一对电极之间时用作钎焊材料的第二金属层（14）。最后，将插入在有源元件之间的半导体晶片的那些部分用作为掩模的第二金属层（14）进行化学蚀刻，以将半导体元件（15）彼此分离，从而产生多个半导体元件（ 15），每个表面都涂有第一和第二金属层。

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