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    • 6. 发明公开
    • RADIOFREQUENCY INTERCONNECTION BETWEEN A PRINTED CIRCUIT BOARD AND A WAVEGUIDE
    • 印刷电路板与波导之间的射频连接
    • EP3240101A1
    • 2017-11-01
    • EP16166973.4
    • 2016-04-26
    • Huawei Technologies Co., Ltd.
    • SPRANGER, ChristophKOKKINOS, TitosGUNTUPALLI, Ajay BabuMORGIA, FabioBISCONTINI, Bruno
    • H01P5/107
    • According to one aspect the present invention refers to a system comprising a waveguide having a body with a first end having an opening, and a printed circuit board, PCB, having a bottom side and a opposed top side, wherein the PCB comprises a ground layer, a dielectric material layer and a signal layer arranged in a layer stack from the bottom side to the top side of the PCB, wherein the dielectric material layer is arranged between the ground layer and the signal layer, wherein the signal layer comprises a coupling pad and a first and a second output transmission line both connected to the coupling pad, further comprising a non-conducting slot in the ground layer, further comprising a electric wall galvanically connecting the coupling pad through the dielectric material layer to the ground layer, wherein the first end of the waveguide is arranged on the bottom side and is galvanically connected with the ground layer, wherein the opening, the non-conducting slot and the coupling pad are aligned such that in a stacking direction of the layer stack the opening, the non-conducting slot and the coupling pad at least partially overlap. In a second aspect the present invention is directed to a printed circuit board, PCB, having a bottom side and a opposed top side, wherein the PCB comprises a ground layer, a dielectric material layer and a signal layer arranged in a layer stack from the bottom side to the top side of the PCB, wherein the dielectric material layer is arranged between the ground layer and the signal layer, wherein the signal layer comprises a coupling pad and a first and a second output transmission line both connected to the coupling pad, further comprising a non-conducting slot in the ground layer, further comprising a electric wall galvanically connecting the coupling pad through the dielectric material layer to the ground layer, wherein the non-conducting slot and the coupling pad are aligned such that in a stacking direction of the layer stack the non-conducting slot and the coupling pad at least partially overlap.
    • 根据一个方面,本发明涉及一种系统,该系统包括具有主体的波导管,该主体具有开口的第一端以及具有底侧和相对的顶侧的印刷电路板PCB,其中PCB包括接地层 ,电介质材料层和信号层,所述电介质材料层和信号层以从所述PCB的所述底侧到所述顶侧的层堆叠布置,其中所述电介质材料层被布置在所述接地层和所述信号层之间,其中所述信号层包括耦合焊盘 以及均连接至所述耦合焊盘的第一输出传输线和第二输出传输线,所述第一输出传输线和所述第二输出传输线还包括位于所述接地层中的非导电槽,还包括电壁,所述电壁通过所述电介质材料层将所述耦合焊盘电连接至所述接地层, 波导的第一端布置在底侧上并与接地层电流连接,其中开口,非导电槽和耦合垫 被对准,使得在叠层的堆叠方向上,开口,非导电槽和耦合垫至少部分地重叠。 在第二方面,本发明涉及一种印刷电路板PCB,其具有底侧和相对的顶侧,其中PCB包括接地层,电介质材料层和信号层,所述信号层以层叠 其中所述介电材料层设置在所述接地层与所述信号层之间,其中所述信号层包括耦合焊盘以及均连接至所述耦合焊盘的第一输出传输线和第二输出传输线, 进一步包括在所述接地层中的非导电狭槽,所述狭槽还包括电壁,所述电壁通过所述电介质材料层将所述耦合焊盘电流连接到所述接地层,其中所述非导电狭槽和所述耦合焊盘对齐,使得在堆叠方向 层叠的不导电槽和耦合垫至少部分重叠。