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1. 发明公开

EP2966404A1 PHYSICAL QUANTITY SENSOR STRUCTURE 审中-公开
标题翻译： SENSORSTRUKTURFÜRPHYSIKALISCHEQUANTITÄTEN
公开(公告)号：EP2966404A1
公开(公告)日：2016-01-13
申请号：EP13877142.3
申请日：2013-12-20
申请人： Hitachi Automotive Systems, Ltd.
发明人： KANAMARU Masatoshi , AONO Takanori , HAYASHI Masahide , JEONG Heewon
IPC分类号： G01C19/5783 , H01L29/84
CPC分类号： G01D11/245 , G01C19/5783 , G01P1/023
摘要： To suppress variations of a vacuum pressure atmosphere in a physical sensor, a physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, includes a sensor part in which a plurality of substrates are stacked, and a cavity substrate 9 having a space and provided on an upper surface side or a lower surface side of the sensor part by bonding, wherein the sensing part communicates with a space of the cavity substrate via a ventilation passage 11a provided in the sensor part.
摘要翻译：为了抑制物理传感器中的真空压力气氛的变化，在真空空间中设置有测量物理量的感测部件的物理传感器包括堆叠多个基板的传感器部分和空腔基板 9，其具有通过接合设置在传感器部分的上表面侧或下表面侧上的空间，其中，感测部分经由设置在传感器部分中的通风通道11a与空腔基板的空间连通。

2. 发明授权

EP3139178B1 ACCELERATION DETECTION DEVICE 有权
公开(公告)号：EP3139178B1
公开(公告)日：2019-06-12
申请号：EP15786381.2
申请日：2015-04-08
申请人： Hitachi Automotive Systems, Ltd.
发明人： JEONG Heewon , HAYASHI Masahide , YAMANAKA Kiyoko , MAEDA Daisuke
IPC分类号： G01P15/08 , B81B3/00 , G01P15/125 , H01L29/84

3. 发明公开

EP3193176A1 PHYSICAL QUANTITY SENSOR 审中-公开
标题翻译：物理量传感器
公开(公告)号：EP3193176A1
公开(公告)日：2017-07-19
申请号：EP15840211.5
申请日：2015-06-29
申请人： Hitachi Automotive Systems, Ltd.
发明人： KANAMARU Masatoshi , HAYASHI Masahide , YURA Masashi , JEONG Heewon
IPC分类号： G01P21/00 , B81B3/00 , G01P15/08 , G01P15/125 , H01L29/84
摘要： For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.
摘要翻译：对于通过MEMS工艺制造的小型传感器，当在最后步骤中形成电极焊盘，布线或屏蔽层时，难以非破坏性地研究用于感测物理量的结构是否已被令人满意地处理。在本发明中，在由MEMS结构形成的物理量传感器中，在电极基板的表面上形成具有贯通配线的表面电极并且其周边被绝缘的结构中，形成由金属在平面图中在电极基板的表面上提供材料并且在屏蔽层内部提供用于内部观察的空间使得可以检查内部缺陷。

4. 发明授权

EP3128333B1 ACCELERATION SENSOR 有权
公开(公告)号：EP3128333B1
公开(公告)日：2018-06-27
申请号：EP15772477.4
申请日：2015-03-25
申请人： Hitachi Automotive Systems, Ltd.
发明人： HAYASHI Masahide , JEONG Heewon
IPC分类号： G01P15/125 , G01P15/08 , H01L29/84
CPC分类号： G01P15/125 , G01P2015/0834
摘要： Provided is a highly reliable acceleration sensor that keeps production costs low and has low zero point drift initially and over time even when used in a poor installation environment. In this acceleration sensor, a weight that rotates when acceleration is applied in the z-direction is disposed in a cavity surrounded by a support substrate and a cap layer. The cap layer is formed such that both sides thereof across the axis of rotation of the weight have different masses per unit area.

5. 发明公开

EP2952852A1 INERTIAL FORCE DETECTION DEVICE 审中-公开
标题翻译： TRÄGHEITSKRAFTDETEKTOR
公开(公告)号：EP2952852A1
公开(公告)日：2015-12-09
申请号：EP13873709.3
申请日：2013-12-13
申请人： Hitachi Automotive Systems, Ltd.
发明人： NAKAMURA Toshiaki , HAYASHI Masahide , OHSAKA Ichiro , TSURU Yasutaka , MAEDA Daisuke
IPC分类号： G01C19/5776 , G01P15/18
CPC分类号： G01C19/5726 , G01C19/5776 , G01P15/18 , G01P21/00
摘要： In order to provide an inertial force detection device with improved reliability, an inertial force detection device that has a vibrating body displaceable in a first direction and a second direction perpendicular to each other and detects, as angular velocity, the amount of displacement when the vibrating body is displaced in the second direction due to the occurrence of angular velocity in a state where the vibrating body is made to vibrate in the first direction includes, for example, digital signal processing means, means for detecting a failure in a register unit and a calculation unit of the digital signal processing means, and means for outputting a failure detection result to the outside.
摘要翻译：为了提供具有可靠性提高的惯性力检测装置，具有能够沿第一方向和第二方向互相移动的振动体的惯性力检测装置，作为角速度检测振动时的位移量由于在振动体在第一方向上振动的状态下由于角速度的产生而在第二方向上移动的主体包括例如数字信号处理装置，用于检测寄存器单元中的故障的装置和数字信号处理装置的计算单元，以及用于向外部输出故障检测结果的装置。

6. 发明授权

EP2605022B1 INERTIAL SENSOR 有权
标题翻译：内置传感器
公开(公告)号：EP2605022B1
公开(公告)日：2015-02-25
申请号：EP11816403.7
申请日：2011-08-08
申请人： Hitachi Automotive Systems, Ltd.
发明人： YAMANAKA Kiyoko , JEONG HEEWON , NAKAMURA Toshiaki , HAYASHI Masahide
IPC分类号： G01P21/00 , G01P15/125 , G01P15/08 , G01C19/5747
CPC分类号： G01P15/125 , G01C19/5747 , G01P15/0802 , G01P21/00 , G01P2015/0814

7. 发明公开

EP3358358A1 PHYSICAL QUANTITY SENSOR 无效转让
公开(公告)号：EP3358358A1
公开(公告)日：2018-08-08
申请号：EP16850878.6
申请日：2016-08-03
申请人： Hitachi Automotive Systems, Ltd.
发明人： KANAMARU Masatoshi , MAEDA Daisuke , HAYASHI Masahide , YURA Masashi , OKAMOTO Akihiro
IPC分类号： G01P15/125 , B81B3/00 , G01P15/08 , H01L29/84
CPC分类号： G01P15/08 , B81B3/00 , B81B7/0016 , B81B2201/0235 , B81B2203/0118 , B81B2203/04 , B81B2203/056 , B81B2207/012 , G01P15/125 , G01P2015/0862 , G01P2015/0882 , H01L29/84
摘要： To provide a physical quantity sensor having excellent reliability by reducing the influence of a force applied from the outside. Disclosed is a physical quantity sensor, which has a weight or a movable electrode formed on a device substrate, and an outer peripheral section that is disposed to surround the weight or the movable electrode, said weight or movable electrode being displaceable in the rotation direction in a plane. When the weight or the movable electrode is displaced in the rotation direction in the plane, the physical quantity sensor is provided with a rotation space at the outer peripheral section of an end portion of the weight or the movable electrode, said end portion being in the direction viewed from the center position of the weight or the movable electrode.

8. 发明公开

EP3252478A1 SEMICONDUCTOR SENSOR DEVICE 审中-公开
标题翻译：半导体传感器装置
公开(公告)号：EP3252478A1
公开(公告)日：2017-12-06
申请号：EP16743057.8
申请日：2016-01-08
申请人： Hitachi Automotive Systems, Ltd.
发明人： DEGAWA Munenori , KIKUCHI Hiroshi , OKAMOTO Akihiro , YURA Masashi , HAYASHI Masahide
IPC分类号： G01P15/08 , B81B3/00 , G01C19/5747 , G01C19/5769 , G01P15/125 , G01P15/18 , H01L29/84
CPC分类号： B81B7/0041 , B81B3/00 , B81B3/0021 , B81B2201/0235 , B81B2201/0285 , G01C19/5747 , G01C19/5769 , G01P15/08 , G01P15/125 , G01P15/18 , H01L29/84 , H01L2224/32145 , H01L2224/32245 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00 , H01L2924/00012
摘要： The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.
摘要翻译：本发明的目的在于提高采用树脂封装的半导体传感器装置中的腔体的耐压性，并且不会不利地影响导电构件的嵌入性。半导体传感器装置具有在多个层叠基板1,4,5的层叠结构内以气密方式密封的间隙1a，并且具有层叠结构的外侧被树脂覆盖的结构，其中，在间隙1的上壁1b的外侧配置有至少一侧的长度大于间隙1a的沿该侧的一侧的长度的板状部件2，该间隙的上壁1b机械地悬挂在板状部件2上。

9. 发明公开

EP3128333A1 ACCELERATION SENSOR 有权
标题翻译：加速度传感器
公开(公告)号：EP3128333A1
公开(公告)日：2017-02-08
申请号：EP15772477.4
申请日：2015-03-25
申请人： Hitachi Automotive Systems, Ltd.
发明人： HAYASHI Masahide , JEONG Heewon
IPC分类号： G01P15/125 , G01P15/08 , H01L29/84
CPC分类号： G01P15/125 , G01P2015/0834
摘要： Provided is a highly reliable acceleration sensor that keeps production costs low and has low zero point drift initially and over time even when used in a poor installation environment. In this acceleration sensor, a weight that rotates when acceleration is applied in the z-direction is disposed in a cavity surrounded by a support substrate and a cap layer. The cap layer is formed such that both sides thereof across the axis of rotation of the weight have different masses per unit area.
摘要翻译：提供高度可靠的加速度传感器，即使在恶劣的安装环境中使用时，也能保持较低的生产成本并始终保持低零点漂移。在该加速度传感器中，当在z方向上施加加速度时旋转的配重设置在由支撑基板和盖层围绕的空腔中。覆盖层形成为使得横跨配重的旋转轴线的两侧在每单位面积上具有不同的质量。

10. 发明授权

EP2573514B1 COMPOSITE SENSOR AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：复合传感器及其制造方法
公开(公告)号：EP2573514B1
公开(公告)日：2015-07-15
申请号：EP11783661.9
申请日：2011-05-20
申请人： Hitachi Automotive Systems, Ltd.
发明人： AONO Takanori , SUZUKI Kengo , KOIDE Akira , HAYASHI Masahide
IPC分类号： G01C19/56 , G01P15/08 , H01L21/50 , H01L23/02
CPC分类号： G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

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