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1. 发明公开

EP0459394A3 Laser machining apparatus and method of the same 失效
标题翻译：激光加工设备及其相关方法
公开(公告)号：EP0459394A3
公开(公告)日：1993-01-20
申请号：EP91108687.4
申请日：1991-05-28
申请人： HITACHI, LTD.
发明人： Miyauchi, Tateoki , Maruyama, Shigenobu , Mizukoshi, Katsurou , Hongo, Mikio , Morita, Koyo , Katayama, Kaoru , Suzuki, Minoru , Mera, Kazuo , Sakamoto, Haruhisa
IPC分类号： B23K26/02
CPC分类号： B23K26/032
摘要： A laser machining apparatus includes a laser beam source (1), such as of excimer laser, which produces a laser beam to be projected on a work piece or a sample (13), first and second illumination light sources (16, 17) which have wavelengths substantially equal to the wavelength of the laser beam and illuminate the entire image and the laser beam, respectively, a first beam splitter (17) which guides the image produced by the illumination light to an observation unit, a second beam splitter (10) which guides the laser beam from the laser beam source to an objective lens, and a controller which controls the machining condition including the relative positioning between the sample and the laser beam depending on the result of observation. The laser beam guide path structure from the laser beam source to the sample has its interior wall (63) made of laser-transparent material such as glass, and the transparent material is enclosed by a laser blocking material (67, 68) such as a metal or water.

2. 发明公开

EP0461414A3 Method of cutting interconnection pattern with laser and apparatus thereof 失效
标题翻译：用激光切割互连图案的方法及其设备
公开(公告)号：EP0461414A3
公开(公告)日：1992-04-01
申请号：EP91107938.2
申请日：1991-05-16
申请人： HITACHI, LTD.
发明人： Miyauchi, Tateoki , Hongo, Mikio , Maruyama, Shigenobu , Mizukoshi, Katsurou , Yamaguchi, Hiroshi , Morita, Koyo
IPC分类号： H01L21/90 , H01L23/525
CPC分类号： H01L23/5258 , B23K26/0624 , B23K26/066 , B23K2201/38 , B23K2201/40 , H01L2924/0002 , H01L2924/00
摘要： In an interconnection film cutting method and apparatus therefor according to the present invention, a laser beam (5) having a pulse width of 10⁻⁹ second or less is illuminated on a desired portion of the interconnection pattern of a semiconductor device (8), such as a link used for redundant operation of a defective bit in, for example, a LSI memory, or on a desired portion of the interconnection pattern of a large-scaled interconnection substrate through a transmission type liquid crystal mask in the form of a desired pattern so as to cut the interconnection pattern without damaging a layer disposed below the interconnection pattern.

3. 发明公开

EP0461414A2 Method of cutting interconnection pattern with laser and apparatus thereof 失效
标题翻译： Verfahren und Vorrichtung zum Verbindungsmusterschneiden durch Laser。
公开(公告)号：EP0461414A2
公开(公告)日：1991-12-18
申请号：EP91107938.2
申请日：1991-05-16
申请人： HITACHI, LTD.
发明人： Miyauchi, Tateoki , Hongo, Mikio , Maruyama, Shigenobu , Mizukoshi, Katsurou , Yamaguchi, Hiroshi , Morita, Koyo
IPC分类号： H01L21/90 , H01L23/525
CPC分类号： H01L23/5258 , B23K26/0624 , B23K26/066 , B23K2201/38 , B23K2201/40 , H01L2924/0002 , H01L2924/00
摘要： In an interconnection film cutting method and apparatus therefor according to the present invention, a laser beam (5) having a pulse width of 10⁻⁹ second or less is illuminated on a desired portion of the interconnection pattern of a semiconductor device (8), such as a link used for redundant operation of a defective bit in, for example, a LSI memory, or on a desired portion of the interconnection pattern of a large-scaled interconnection substrate through a transmission type liquid crystal mask in the form of a desired pattern so as to cut the interconnection pattern without damaging a layer disposed below the interconnection pattern.
摘要翻译：在根据本发明的互连膜切割方法及其装置中，在半导体器件的互连图案的期望部分上照射具有10 <> 9秒或更小的脉冲宽度的激光束（5）（8），例如用于例如LSI存储器中的有缺陷的位的冗余操作的链路，或者通过传输型液晶掩模在大规模互连基板的互连图案的期望部分上形式，以便切割互连图案而不损坏布置在互连图案下方的层。

4. 发明授权

EP0459394B1 Laser machining apparatus and method of the same 失效
标题翻译：一种激光加工装置及其方法
公开(公告)号：EP0459394B1
公开(公告)日：1995-12-13
申请号：EP91108687.4
申请日：1991-05-28
申请人： HITACHI, LTD.
发明人： Miyauchi, Tateoki , Maruyama, Shigenobu , Mizukoshi, Katsurou , Hongo, Mikio , Morita, Koyo , Katayama, Kaoru , Suzuki, Minoru , Mera, Kazuo , Sakamoto, Haruhisa
IPC分类号： B23K26/02
CPC分类号： B23K26/032

5. 发明公开

EP0459394A2 Laser machining apparatus and method of the same 失效
标题翻译： Laserbearbeitungsgerätund dessen Verfahren。
公开(公告)号：EP0459394A2
公开(公告)日：1991-12-04
申请号：EP91108687.4
申请日：1991-05-28
申请人： HITACHI, LTD.
发明人： Miyauchi, Tateoki , Maruyama, Shigenobu , Mizukoshi, Katsurou , Hongo, Mikio , Morita, Koyo , Katayama, Kaoru , Suzuki, Minoru , Mera, Kazuo , Sakamoto, Haruhisa
IPC分类号： B23K26/02
CPC分类号： B23K26/032
摘要： A laser machining apparatus includes a laser beam source (1), such as of excimer laser, which produces a laser beam to be projected on a work piece or a sample (13), first and second illumination light sources (16, 17) which have wavelengths substantially equal to the wavelength of the laser beam and illuminate the entire image and the laser beam, respectively, a first beam splitter (17) which guides the image produced by the illumination light to an observation unit, a second beam splitter (10) which guides the laser beam from the laser beam source to an objective lens, and a controller which controls the machining condition including the relative positioning between the sample and the laser beam depending on the result of observation. The laser beam guide path structure from the laser beam source to the sample has its interior wall (63) made of laser-transparent material such as glass, and the transparent material is enclosed by a laser blocking material (67, 68) such as a metal or water.
摘要翻译：一种激光加工设备包括：激光束源（例如准分子激光器），其产生要投影到工件或样品（13）上的激光束;第一和第二照明光源（16,17），其中具有基本上等于激光束的波长的波长并分别照射整个图像和激光束，第一分束器（17）将由照明光产生的图像引导到观察单元，第二分束器（10）），其将来自激光束源的激光束引导到物镜;以及控制器，其根据观察结果控制包括样品和激光束之间的相对定位的加工条件。从激光束源到样品的激光束引导路径结构具有由诸如玻璃的激光透明材料制成的内壁（63），并且透明材料被激光阻挡材料（67,68）包围，例如金属或水。

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