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    • 2. 发明公开
    • Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
    • 电沉积铜箔及其制造使用含有氯离子和有机添加剂的添加控制电解的方法。
    • EP0632146A1
    • 1995-01-04
    • EP94303814.1
    • 1994-05-26
    • GOULD ELECTRONICS INC.
    • Apperson, R. DuaneClouser, Sidney J.Patrick, Richard D.
    • C25D1/04C25D3/38
    • H05K1/09C25D1/04C25D3/38H05K3/382H05K2201/0355Y10T428/12
    • This invention is directed to an electrodeposited copper foil having a matte-side raw foil R tm of about 4 to about 10 microns, an ultimate tensile strength measured at 23°C in the range of about 55,000 to about 80,000 psi, an elongation measured at 23°C of about 6% to about 25%, an ultimate tensile strength measured at 180°C in the range of about 30,000 psi to about 40,000 psi, an elongation measured at 180°C of about 4% to about 15%, and a thermal stability of less than about -20%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) preparing an electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 1.2 to about 4.5 ppm, at least one organic additive at a concentration of about 0.4 to about 20 ppm, and at least one impurity at a concentration of about 0.01 to about 20 grams per liter; (B) flowing said electrolyte solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode, the current density being in the range of about 0.1 to about 3 A/cm²; and (C) removing copper foil from said cathode.
    • 本发明涉及在具有约4的无光泽侧面生箔řTM至约10微米的电解铜箔,在约55000的范围内,在23℃测得的极限抗拉强度约80,000磅,在23伸长度测定 约6%至C.在约30,000磅的范围在180℃下测得的约40000磅极限抗拉强度约25%,在180℃下约4%的伸长率测量到约15%,和一个 小于约-20%的热稳定性。 因此,本发明涉及用于制备上述箔的方法,该方法包括:(A)制备电解质溶液以约1.2的浓度含有铜离子,硫酸根离子,氯离子以约4.5 ppm时,至少一种有机添加剂 在约0.4至约20ppm,并且在约12点01分至每升约20克的浓度的至少一种杂质的浓度; (B)流动,在阳极和阴极之间,所述电解质溶液中,并施加有效量的横跨所述阳极和所述阴极电压的,以在所述阴极上沉积铜,其电流密度在约0.1的范围内,以约3 A /厘米 <2>; 从所述阴极和(C)除去铜箔。