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1. 发明公开

EP2559732A3 Epoxy encapsulating and lamination adhesive and method of making same 有权
标题翻译：环氧封装和层压粘合剂及其制造方法
公开(公告)号：EP2559732A3
公开(公告)日：2015-12-09
申请号：EP12179655.1
申请日：2012-08-08
申请人： General Electric Company
发明人： Gorczyca, Thomas Bert , McConnelee, Paul Alan
IPC分类号： C08L63/00 , C09J163/00 , H01L23/29 , C08G59/50
CPC分类号： H01L23/28 , C08G59/50 , C08K5/1515 , C08K5/1539 , C08K5/17 , C08K5/18 , C09J163/00 , H01L21/56 , H01L23/293 , H01L2224/48091 , H01L2224/92144
摘要： An adhesive includes an epoxy resin and a hardener. The hardener includes trioxdiamine, diaminodicyclohexylmethane, toluene diamine, and bisphenol-A dianhydride.
摘要翻译：粘合剂包括环氧树脂和硬化剂。硬化剂包括三氧二胺，二氨基二环己基甲烷，甲苯二胺和双酚A二酐。

2. 发明授权

EP1408087B1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method 失效转让
标题翻译：环氧polysiloxanharzzusammensetzungen所以封装的半导体器件和工艺
公开(公告)号：EP1408087B1
公开(公告)日：2007-10-10
申请号：EP03256305.8
申请日：2003-10-07
申请人： GENERAL ELECTRIC COMPANY
发明人： Gorczyca, Thomas Bert
IPC分类号： C08L83/04 , H01L33/00 , C08G59/42
CPC分类号： C08L63/00 , C08G59/4284 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , Y10T428/31511 , Y10T428/31663 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.

4. 发明公开

EP0611121A2 Systems for patterning dielectrics and structures therefrom 失效
标题翻译： Verfahren zum Mustern von Dielektrikum und resultierende Strukturen。
公开(公告)号：EP0611121A2
公开(公告)日：1994-08-17
申请号：EP94300881.3
申请日：1994-02-07
申请人： GENERAL ELECTRIC COMPANY
发明人： Wojnarowski, Robert John , Cole, Herbert Stanley , Gorczyca, Thomas Bert , Balch, Ernest Wayne , Saia, Richard Joseph
IPC分类号： H01L21/48 , H01L23/498 , H01L21/311 , H01L23/538
CPC分类号： H05K3/0041 , H01L21/31138 , H01L21/486 , H01L21/76802 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/1147 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/30105 , H01L2924/3011 , H05K1/036 , H05K3/0032 , H05K2201/0166 , H05K2201/0195 , Y10S438/94 , Y10S438/945 , H01L2924/00
摘要： A differentiable ablation approach to patterning dielectrics which are not of the same absorbance uses an absorbant dielectric (20) at a specified laser wavelength over a non-absorbant dielectric (18) at that wavelength. The absorbant dielectric may be laser-patterned and become an integral mask enabling plasma etching of the underlying non-absorbant dielectric. If the patterning of the absorbant dielectric involves vias, polymer ridges formed around via surfaces during laser patterning may be removed at the same time the underlying non-absorbant dielectric is etched using a transparent, oxygen plasma resistant mask. Alternatively, an inert mask may be used instead of the absorbent dielectric to allow plasma etching of the non-absorbant dielectric.
摘要翻译：要求用于在电介质材料层中制造开口的方法，其本身不敏感于在所选择的激光波长处的激光烧蚀。该方法包括步骤（a）提供不被激光烧蚀的第一介电层（18）; （b）在所述第一层上提供第二电介质层（20），并且可以以可选择的激光波长激光烧蚀的另一种材料形成; （c）在第二电介质层上施加硬掩模（76）; （d）在硬掩模中形成开口（23）; （e）通过激光烧蚀在第二介电层中形成相应的开口; （f）通过RIE在第一电介质层中提供与第二电介质层中的开口对准的开口，从而去除在第二电介质层中围绕开口形成的任何电介质隆起; 和（g）去除硬掩模。还要求保护的是一种去除在电介质层中的通孔表面周围形成的电介质隆起的方法，包括以下步骤：（i）在介电层上施加硬掩模; （ii）通过所述硬掩模和所述电介质对通孔进行激光抖动，以使所述电介质层的一部分未被所述掩模保护; （iii）通过控制使所述电介质层的未受保护的部分各向同性地蚀刻以使所述通孔表面周围的所述电介质隆起; 和（iv）去除硬掩模。

5. 发明授权

EP2365523B1 Stress Resistant Micro-Via Structure for Flexible Circuits 有权
标题翻译：耐应力微孔结构柔性电路
公开(公告)号：EP2365523B1
公开(公告)日：2015-01-07
申请号：EP11156492.8
申请日：2011-03-01
申请人： General Electric Company
发明人： Gorczyca, Thomas Bert , Saia, Richard Joseph , McConnelee, Paul Alan
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H01L2924/00

7. 发明公开

EP0467612A2 Protective coating for high-intensity metal halide discharge lamps 失效
标题翻译： SchutzschichtfürMetallhalogenid-Entladungslampen hoherIntensität。
公开(公告)号：EP0467612A2
公开(公告)日：1992-01-22
申请号：EP91306371.5
申请日：1991-07-15
申请人： GENERAL ELECTRIC COMPANY
发明人： Witting, Harald Ludwig , Prochazka, Svante , Gorczyca, Thomas Bert , Myers, Jennifer Lori
IPC分类号： H01J61/35 , H01J61/24 , H01J61/82 , H01J9/20
CPC分类号： H01J9/20 , H01J61/35
摘要： A protective coating (12) of suitable composition and thickness is applied to the inner surface of the arc tube (14) of a high-intensity, metal halide discharge lamp (10) in order to avoid a substantial loss of the metallic component of the metal halide fill and hence a substantial buildup of free halide, thereby extending the useful life of the lamp (10). A preferred lamp structure includes a fused silica arc tube (14) with a silicon coating (12). The silicon coating (12) is preferably applied to the arc tube (14) using a chemical vapor deposition process.
摘要翻译：将适当组成和厚度的保护涂层（12）施加到高强度金属卤化物放电灯（10）的电弧管（14）的内表面上，以避免金属成分的显着损失金属卤化物填充物，因此实质上积累了游离卤化物，从而延长了灯（10）的使用寿命。优选的灯结构包括具有硅涂层（12）的熔融石英电弧管（14）。优选使用化学气相沉积工艺将硅涂层（12）施加到电弧管（14）。

8. 发明公开

EP0223958A2 Crosslinked copolyamideimides and method for their preparation 失效
标题翻译：交联copolyamideimides及其制备方法。
公开(公告)号：EP0223958A2
公开(公告)日：1987-06-03
申请号：EP86113063.1
申请日：1986-09-23
申请人： GENERAL ELECTRIC COMPANY
发明人： Bolon, Donald Allen , Gorczyca, Thomas Bert
IPC分类号： C08G73/14 , H01B3/30 , C09D5/25
CPC分类号： C08G73/1071 , C08G18/3821 , C08G18/6438 , C08G73/1014 , C08G73/105 , C08G73/106 , C08G73/14 , H01B3/306
摘要： Carboxy-terminated prepolymers are prepared by the reaction of a diamine, preferably an aromatic diamine, or a mixture thereof with a triamine, with a carboxy anhydride such as trimellitic anhydride and a dianhydride such as bisphenol A dianhydride. The prepolymers, or functional derivatives thereof, are then reacted with a diisocyanate or diamine, or a mixture thereof with a triisocyanate or triamine, preferably an aromatic diisocyanate, to produce copolyamideimides. The products prepared using triamines or triisocyanates are crosslinked. Other products containing alkyl or alicyclic groups attached to aromatic radicals can be oxidatively crosslinked, e.g., by heating in air.

9. 发明公开

EP2221860A2 Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods 审中-公开
标题翻译：管芯附接粘接剂的嵌入式芯片简化的结构和相关联的系统和方法
公开(公告)号：EP2221860A2
公开(公告)日：2010-08-25
申请号：EP10152745.5
申请日：2010-02-05
申请人： General Electric Company
发明人： Saia, Richard Joseph , Gorczyca, Thomas Bert
IPC分类号： H01L21/58 , H01L21/60 , C09J5/00
CPC分类号： H01L24/83 , C08G59/226 , C08G59/68 , C09J5/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , G03F7/038 , H01L24/19 , H01L24/29 , H01L24/82 , H01L2224/04105 , H01L2224/2413 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/18162 , H01L2924/3512 , H01L2924/00
摘要： Present embodiments are directed to an adhesive (106) and method for assembling a chip package (100). The adhesive (106) may be used to couple a chip (108) to a substrate (102), and the adhesive (106) may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.
摘要翻译：本实施例涉及在粘合剂（106）和方法，用于组装的芯片封装（100）。粘合剂（106）可用于将耦合的芯片（108）到基板（102）和所述粘合剂（106）可以包括在上环氧树脂，光产酸剂，抗氧化，和环氧基介电材料催化剂冷对应光酸产生。

10. 发明公开

EP1835315A1 Waveguide forming methods and waveguides fabricated therefrom 审中-公开
标题翻译： Verfahren zur Erzeugung von Wellenleitern
公开(公告)号：EP1835315A1
公开(公告)日：2007-09-19
申请号：EP07012835.0
申请日：2004-08-05
申请人： General Electric Company
发明人： Deng, Kung-Li , Gorczyca, Thomas Bert , Guida, Renato , Nielsen, Matthew Christian , Shih, Min-Yi , Tolliver, Todd Ryan
IPC分类号： G02B6/138 , G02B6/26 , G02B6/42
CPC分类号： G02B6/138 , G02B6/12 , G02B6/125 , G02B6/26 , G02B6/305 , G02B6/32 , G02B6/4212 , G02B6/4214 , G02B6/423 , G02B2006/12173
摘要： A waveguide (116) fabrication method includes depositing a photodefinable copolymer material (14) comprising methyl methacrylate, tetrafluoropropyl methacrylate, and an epoxy monomer; fixing optical elements (10, 12) relative to the copolymer material; sending light through at least one of the optical elements and copolymer material towards the other; volatilizing uncured monomer. Another waveguide (116) fabrication method includes: fixing optical elements (110, 112) relative to each other, each having an optical surface (11, 13); providing a copolymer blob (114) over the optical surfaces with sufficient surface tension to result in the copolymer blob having a curved surface (15); sending light through each of the optical elements towards the curved surface and the other; volatilizing uncured monomer. An optical path fabrication method comprises: fixing optical elements (70, 76) relative to each other, each having an optical surface (71, 77); translating and rotating a mirror (78) until aligned to optimally direct light from one of the optical elements to the other; securing the aligned mirror in position.
摘要翻译：波导（116）制造方法包括沉积包含甲基丙烯酸甲酯，甲基丙烯酸四氟丙酯和环氧单体的光可分解共聚物材料（14）相对于共聚物材料固定光学元件（10,12）; 通过光学元件和共聚物材料中的至少一个朝向另一个发射光; 挥发未固化的单体。另一个波导（116）制造方法包括：相对于彼此固定光学元件（110,112），每个具有光学表面（11,13）; 在所述光学表面上提供具有足够表面张力的共聚物斑点（114），以产生共聚物斑点具有弯曲表面（15）; 通过每个光学元件朝向弯曲表面和另一个发送光; 挥发未固化的单体。光路制造方法包括：固定光学元件（70,76），每个光学元件具有光学表面（71,77）; 平移和旋转反射镜（78）直到对准以最佳地将光从一个光学元件引导到另一个; 将对准的镜子固定就位。

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